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JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration

Retrieved on:

Donnerstag, Mai 30, 2024

Electronic Design Automation, Semiconductor, Consumer Electronics, Technology, Other Technology, Mobile, Wireless, Hardware, JEDEC, XML schema, Silicon, OCP, CDXML, SIP, 3D printing

JEP30 and its supporting documents and resources are available for free download from the JEDEC website .

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JEP30 and its supporting documents and resources are available for free download from the JEDEC website .
A groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC to enhance JEP30 is combining the capabilities and open standards of OCP’s Chiplet Data Extensible Markup Language (CDXML) into the JEDEC’s JEP30 PartModel Guidelines.
This integration expands the capability of the PartModel to enable chiplet builders to also provide standardized chiplet part descriptions to their customers electronically.
“The evolution of JEP30 represents a paradigm shift in facilitating electronic product development and manufacturing,” said Mian Quddus, JEDEC Board of Directors Chairman.

SK hynix Develops Next-Generation Mobile NAND Solution ZUFS 4.0

Retrieved on:

Donnerstag, Mai 9, 2024

HBM, DRAM, AI, ICT, Zoning, Partnership, Collection, Smartphone, JEDEC, Data management, Memory, Flash memory, UFS, Medical device

Performance degradation over time improved, while lifetime increased by 40%

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Performance degradation over time improved, while lifetime increased by 40%
SEOUL, South Korea, May 8, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has developed the Zoned UFS, or ZUFS* 4.0, a mobile NAND solution product for on-device** AI applications.
SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such as smartphones, is the industry's best of its kind.
Following provision of the prototypes of ZUFS, SK hynix and the customer jointly developed the 4.0 product that qualifies the specifications by the Joint Electron Device Engineering Council, or JEDEC.
SK hynix will commence mass production of the ZUFS 4.0 in the third quarter with an aim to provide to various on-device AI smartphones by global companies.

ROHM’s New Energy-Saving DC-DC Converter ICs Offered in the TSOT23 Package

Retrieved on:

Dienstag, April 23, 2024

ICS, SOP, Programmable logic controller, COT, Rohm, Miniaturization, ROHM, JEDEC, DC-DC, Electric motor

ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz.

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ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz.
Furthermore, as reducing standby power consumption is becoming a significant challenge, there is a growing need for DC-DC converter ICs to deliver higher efficiency during light load (low power) conditions.
The new converter ICs deliver an output current of 1A to 3A in the compact TSOT23 package (2.8mm × 2.9mm).
In addition, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance.

Vishay Intertechnology Blue and True Green LEDs in MiniLED Package Deliver High Brightness in a Small Size

Retrieved on:

Mittwoch, April 17, 2024

LCD, MCD, Light-emitting diode, ESD, Heart rate, Vishay Intertechnology, JEDEC, VSH, Telecommunications, Indium gallium nitride

MALVERN, Pa., April 17, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package.

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MALVERN, Pa., April 17, 2024 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package.
With their high brightness and small size, the LEDs released today are the perfect choice for small scale, high power products that are expected to work reliably in arduous environments.
Offering a typical wavelength of 465 nm at 20 mA, the VLMB2332T1U2-08 is optimized for smoke detectors that utilize short wavelength blue light for the detection of small particles.
The LEDs’ MiniLED package features a lead-frame embedded in a white thermoplast.

Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs

Retrieved on:

Montag, April 29, 2024

With this new family of server PMICs, Rambus offers module manufacturers a complete DDR5 RDIMM memory interface chipset supporting a broad range of data center use cases.

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With this new family of server PMICs, Rambus offers module manufacturers a complete DDR5 RDIMM memory interface chipset supporting a broad range of data center use cases.
“Rambus, a proven volume supplier of on-module memory interface chips, is ready to provide the critical PMIC components for the DDR5 memory module makers.”
The PMIC is a critical component in the DDR5 memory architecture, enabling more memory channels, higher capacity modules and greater bandwidth.
The Rambus DDR5 server PMIC family includes products for the JEDEC extreme current (PMIC5020), high current (PMIC5000) and low current (PMIC5010) specifications.
This new family of Rambus server PMICs, together with Rambus DDR5 RCD, SPD Hub and Temperature Sensor ICs, comprise a complete memory interface chipset for a broad range of DDR5 RDIMM configurations and use cases.

KIOXIA Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on:

Dienstag, April 23, 2024

Electronic Design Automation, Data Management, Semiconductor, Technology, Mobile, Wireless, 5G, Hardware, App Store (iOS/iPadOS), JEDEC, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Engineered wood

KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.

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KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.
4.0 embedded flash memory devices.
4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC standard package.
Maitry Dholakia, vice president, Memory Business Unit, for KIOXIA America, Inc. emphasized the company's ongoing leadership in UFS technology, stating, "The newest generation of our UFS 4.0 devices is a testament to our commitment to continually push performance boundaries – and make an improved user experience a reality."

Kioxia Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on:

Dienstag, April 23, 2024

Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.

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Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.
4.0 embedded flash memory devices (Graphic: Business Wire)
The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience.
4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
(2) Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies

Retrieved on:

Mittwoch, April 17, 2024

Data Management, Security, Apps, Applications, Technology, Software, Internet, Hardware, PRAC, Machine learning, JEDEC, Data-rate units, DRAM, AI, DDR5, Computer data storage

JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced publication of the JESD79-5C DDR5 SDRAM standard.

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JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, today announced publication of the JESD79-5C DDR5 SDRAM standard.
This important update to the JEDEC DDR5 SDRAM standard includes features designed to improve reliability and security and enhance performance in a wide range of applications from high-performance servers to emerging technologies such as AI and machine learning.
JESD79-5C is now available for download from the JEDEC website .
Work is underway to incorporate this feature into other DRAM product families within JEDEC,” noted Christopher Cox, JC-42 Committee Chair.

Advantech Collaborates with Phison to Develop GenAI Computing Platform for Edge and Industrial Applications

Retrieved on:

Dienstag, April 16, 2024

Recognizing this trend, Advantech (2395TT), a global leader in edge computing, announced today a collaboration with Phison (8299TT), a leading provider of NAND controllers and NAND storage solutions, to jointly produce GenAI computing platforms tailored for edge and industrial applications.

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Recognizing this trend, Advantech (2395TT), a global leader in edge computing, announced today a collaboration with Phison (8299TT), a leading provider of NAND controllers and NAND storage solutions, to jointly produce GenAI computing platforms tailored for edge and industrial applications.
View the full release here: https://www.businesswire.com/news/home/20240416272737/en/
Phison and Advantech develop GenAI computing platform for edge and industrial applications (Graphic: Phison)
Leveraging Phison's exclusive patented aiDAPTIV+ technology and seamlessly integrating it with Advantech's Edge AI Solutions, our innovative GenAI computing platform empowers customers in the edge and industrial sectors to construct secure, reliable, and cost-effective computing devices for refining GenAI models.
Additionally, to meet the rising industrial Edge AI computing needs, we engage closely with various hardware, software, and application partners.
[About Advantech Edge AI Solutions] Advantech's Edge AI Solutions provide a range of platforms, offering scalable computing power and software toolkits for AI analytics at the edge.

Montage Technology Pioneers the Trial Production of DDR5 CKDs

Retrieved on:

Mittwoch, April 10, 2024

CPU, LRDIMM, Ecosystem, Personal computer, DRAM, RCD, AI, I3C, RDIMM, CKD, CAMM, JEDEC, Montage, DDR5, Multimedia, DIMM, Video game

SHANGHAI, April 10, 2024 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-generation client memory.

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SHANGHAI, April 10, 2024 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-generation client memory.
In the DDR5 era, as data rates climb 6400 MT/s and above, the clock driver has emerged as an indispensable component for client memory.
"With the continuous development of AI technology, the era of AI-powered PC is rapidly approaching, driving demand for higher data rate DDR5 memory.
To further enhance memory data transfer efficiency, Montage has pioneered the delivery of DDR5 1st-generation CKD chip in the industry and successfully achieved volume production," said Mr. Stephen Tai, President at Montage Technology.