SGMII

Quectel Broadens RedCap Offering With Commercial Availability of RG255C-GL RedCap 5G Module

Retrieved on: 
Dienstag, April 9, 2024
Consumer Electronics, Technology, IOT (Internet of Things), Telecommunications, Apps, Applications, Software, Networks, Internet, Mobile, Wireless, 5G, Hardware, PDA, MiFi, LGA, USB 2.0, Galileo Galilei, SGMII, BDS, LTE, Internet of things, SPI, Qualcomm, LAN, 3GPP, Gateway, UART, GPS, URLLC, Router, VEX, X35, Architecture, Industrial, USB, Data-rate units, PCM, CSO, Multimedia, GLONASS, Redcap, GNSS, Mobile phone

Embedded World--Quectel Wireless Solutions, a global IoT solutions provider, is delighted to announce the commercial availability of the RG255C-GL 5G RedCap Sub-6 GHz LGA module, delivering comprehensive 5G and 4G coverage across the globe.

Key Points: 
  • Embedded World--Quectel Wireless Solutions, a global IoT solutions provider, is delighted to announce the commercial availability of the RG255C-GL 5G RedCap Sub-6 GHz LGA module, delivering comprehensive 5G and 4G coverage across the globe.
  • View the full release here: https://www.businesswire.com/news/home/20240409408432/en/
    Quectel broadens RedCap offering with commercial availability of RG255C-GL RedCap 5G module (Photo: Business Wire)
    The RG255C-GL, conforming to 3GPP Release 17 standards, features a compact LGA form factor measuring 32.0mm x 29.0mm x 2.4mm.
  • "Having the RG255C-GL 5G RedCap module commercially available offers our customers access to the benefits of 5G without the accompanying expense and power consumption," commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • Attendees to Embedded World will be able to find out more about the RG255C-GL 5G RedCap module on the Quectel stand at booth number 3-318.

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps

Retrieved on: 
Dienstag, Januar 16, 2024
Data-rate units, Parallel Redundancy Protocol, Machine learning, PRP, Library, SGMII, RGMII, Security, Time-Sensitive Networking, Microchip Technology, Redbox, MCHP, TSN, HSR, ICS, VCAP, Automation, TCAM, Integrated circuit, Growth, Video game

To provide designers with a reliable and robust network solution with deterministic communication, Microchip Technology (Nasdaq: MCHP) today announces its next-generation of LAN969x Ethernet switches with Time Sensitive Networking (TSN), scalable bandwidths from 46 Gbps to 102 Gbps and a powerful 1 GHz single-core Arm® Cortex®-A53 CPU.

Key Points: 
  • To provide designers with a reliable and robust network solution with deterministic communication, Microchip Technology (Nasdaq: MCHP) today announces its next-generation of LAN969x Ethernet switches with Time Sensitive Networking (TSN), scalable bandwidths from 46 Gbps to 102 Gbps and a powerful 1 GHz single-core Arm® Cortex®-A53 CPU.
  • For applications that require greater redundancy, the LAN969x Ethernet switches can be configured with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP).
  • “Prior to the introduction of Microchip’s LAN969x Ethernet switches, customers who wanted to implement TSN and HSR/PRP features required multiple ICs.
  • The new family of LAN969x mid-range Ethernet switches rounds out Microchip’s portfolio of TSN switches.

MaxLinear Launches Single-Port 1G Ethernet PHY Family Aimed at Both Consumer and Industrial IOT Applications

Retrieved on: 
Mittwoch, November 8, 2023
Consumer Electronics, Technology, Software, Networks, Internet, Hardware, Internet of things, BOM, PHY, Documentation, System on module, LAN, Temperature, Industrial, Energy-Efficient Ethernet, DCDC, Family, Wi-Fi, RGMII, Original equipment manufacturer, Compact, MDI, MAC, Multimedia, ODM, EEE, GM, Partnership, MXL, Variscite, Physics, Som, Synchronous Ethernet, Personal computer, SGMII, Internet service provider, Renewable energy, Ethernet, MaxLinear

The new family is available in consumer and industrial variants and addresses a wide range of applications such as gateways, routers, industrial PCs, media converters, and SGMII to RGMII bridges.

Key Points: 
  • The new family is available in consumer and industrial variants and addresses a wide range of applications such as gateways, routers, industrial PCs, media converters, and SGMII to RGMII bridges.
  • View the full release here: https://www.businesswire.com/news/home/20231108373676/en/
    MaxLinear Launches Single-Port 1G Ethernet PHY Family Aimed at Both Consumer and Industrial IOT Applications (Graphic: Business Wire)
    The new gigabit Ethernet transceivers - MxL86110C, MxL86110I, MxL86111C, and MxL86111I – are tailored to both industrial and consumer needs and meet the market need for robust Ethernet across a variety of applications, including both Industrial IoT (ex.
  • video cameras, motor drives, industrial PC) and consumer IoT (printers, Wi-Fi access points, and all varieties of gateways).
  • The industrial Ethernet end-market is expected to grow from $11B to $15.8B from 2023 to 2028, according to a report from MarketsandMarkets.

Fibocom to Pace Up the 5G FWA in the Middle East and Africa with Newly Launched FG360-MEA, Bringing Experience-first 5G Connectivity

Retrieved on: 
Dienstag, September 26, 2023
Digital divide, Carrier aggregation, Communication, EU, FWA, PCI Express, Mobile broadband, ODU, SGMII, Internet, Engineering, Bit, Growth, MediaTek, CPE, Mobile phone

SHENZHEN, China, Sept. 26, 2023 /PRNewswire/ -- Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces a regional version of FG360 5G module series, the variant FG360-MEA is designed to support the frequency bands in the Middle East and Africa, allowing telecom operators and device manufacturers to deploy the 5G solution in a fast and cost-effective manner.

Key Points: 
  • The MediaTek T750-based 5G module FG360 has enabled seamless connectivity for FWA devices and brought a premium 5G experience for end users worldwide.
  • To even the digital divide at the global scale, Fibocom launched the FG360-MEA 5G module dedicated for the 5G FWA deployment in the Middle East and Africa.
  • Fibocom FG360-MEA is a high-performance Sub-6GHz 5G module tailor-made for the Middle East and Africa market.
  • By launching the FG360-MEA, Fibocom enriches the 5G module solution with a comprehensive capability to accelerate the commercialization of 5G FWA in the Middle East and Africa markets.

Microchip Extends its Radiation-Tolerant Family of Gigabit Ethernet PHYs

Retrieved on: 
Dienstag, Mai 23, 2023
PTP, Precision Time Protocol, Interface (computing), Integrated circuit, MCHP, PHY, Synchronous Ethernet, Microchip Technology, SGMII, LEO, Bit, Copper, RT, QSGMII, COTS, Internet service provider, Mobile phone

To streamline the implementation of Ethernet for aerospace and defense customers, Microchip Technology (Nasdaq: MCHP) today announces it has extended its radiation-tolerant (RT) Ethernet PHY devices with the new VSC8574RT PHY .

Key Points: 
  • To streamline the implementation of Ethernet for aerospace and defense customers, Microchip Technology (Nasdaq: MCHP) today announces it has extended its radiation-tolerant (RT) Ethernet PHY devices with the new VSC8574RT PHY .
  • The VSC8574RT PHY supports the Serial Gigabit Media Independent Interface (SGMII) and Quad Serial Gigabit Media-Independent Interface (QSGMII) to reduce the overall signal pins in the design and free up the host device.
  • Space applications operate in environments that require enhanced radiation technology to withstand extreme temperatures and electromagnetic events.
  • Microchip’s family of COTS-based Gigabit Ethernet PHY devices now includes the new VSC8574RT, VSC8541RT and VSC8540RT.

MaxLinear Enables MWave’s Ultra-Flexible G.hn Module for Industrial Applications

Retrieved on: 
Mittwoch, Mai 10, 2023
Semiconductor, Technology, Telecommunications, Mobile, Wireless, Networks, Internet, Hardware, Industrial internet of things, Mwave, M2M, MXL, RGMII, Industrial applications of nanotechnology, Internet of things, Multimedia, IP, SGMII, United Nations Convention on Contracts for the International Sale of Goods, MII, Engineering, Growth, RF microwave CAE CAD, G.hn, Consumer electronics, Mobile phone, MaxLinear

MaxLinear, Inc. (Nasdaq: MXL), a world leader in connectivity technologies, today announced that MWave Consulting, Ltd. (a UK-based RF & Microwave design facility) has selected the MaxLinear G.hn technology for use in its industrial IoT (IIoT) devices.

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a world leader in connectivity technologies, today announced that MWave Consulting, Ltd. (a UK-based RF & Microwave design facility) has selected the MaxLinear G.hn technology for use in its industrial IoT (IIoT) devices.
  • G.hn technology is well suited for a full range of industrial IoT networks and connects any device through Ethernet PHY, MII, SGMII or RGMII interfaces.
  • View the full release here: https://www.businesswire.com/news/home/20230510005305/en/
    MaxLinear Enables MWave’s Ultra-Flexible G.hn Module for Industrial Applications (Graphic: Business Wire)
    According to a 2023 MarketsandMarkets™ research report, the industrial communications market is predicted to grow to US$26.8B by 2027 as companies increasingly turn to technology to deliver significant business improvements.
  • We are pleased to have MaxLinear as our partner for G.hn technology.”

Global and China ADAS Domain Controller Key Component Analysis Report 2023: Focus on Key Components Including CPU, MCU, Storage, and Interface - ResearchAndMarkets.com

Retrieved on: 
Freitag, März 31, 2023
Semiconductor, Other Automotive, Technology, Automotive, Software, Communication, MCU, STP, USB, EMI, Lidar, SGMII, JEDEC, LPDDR5, TI, PCI Express, Infotainment, Certification, MultiMediaCard, UFS, AVP, LPDDR, AEC, Tesla, Gigabit Ethernet, Li Auto L9, RAW, DJI, Infineon Technologies, Radar, NGP, DRAM, Marvell, ASIL, Audiovisual, IMU, IEEE, Volkswagen, CPU, Energy-Efficient Ethernet, TLC, Algorithm, NXP, Acceleration, YUV, Micrometre, LVDS, UFS 3.1, SATA, RGB, GPU, Video game, Computer data storage, Instrumentation, Mobile phone, Camera, Renesas Electronics, YUV444, ADAS, YUV422

The "Global and China ADAS Domain Controller Key Component Trends Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global and China ADAS Domain Controller Key Component Trends Report" report has been added to ResearchAndMarkets.com's offering.
  • The analyst has researched and summarized China's current mainstream high computing power ADAS domain controller products such as Huawei MDC and DJI ADAS domain controller prototype, and technical information.
  • This paper will briefly analyze the key components of ADAS domain controller, including CPU, MCU, storage, and interface.
  • ADAS domain controller needs abundant interfaces (video interface, Ethernet interface, CAN interface, etc.)

Global and China Intelligent Cockpit Domain Control Unit and Head Unit Dismantling Report 2023 with Focus on NIO ET7 Cockpit DCU as an Example

Retrieved on: 
Freitag, März 31, 2023
Great Wall Motor, UFS 2.1, AMOLED, DCU, MCU, Human, MIPI, Parameter, RGMII, USB 3.0, Housing, PHY, DAB, Marvell, Fisker, Digital Audio Broadcasting, UWB, NDA, USB, DSI, Micrometre, Key, Temperature, Qualcomm, HDR, HUD, SOC, NIO, RJ45, Wi-Fi, SFP, SGMII, DisplayPort, IEEE, MAC, GMII, RMII, SMII, MII, ADI, Intel, NIO ET7, PCB, Banyan, Polychlorinated biphenyl, MST, MAXIM, Compact Camera Port 2, TSN, AR, GB, Television, Video game, Electronics, Printed circuit board, Instrumentation, Samsung

DUBLIN, March 31, 2023 /PRNewswire/ -- The "Global and China Intelligent Cockpit Domain Control Unit (DCU) and Head Unit Dismantling Report, 2023" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 31, 2023 /PRNewswire/ -- The "Global and China Intelligent Cockpit Domain Control Unit (DCU) and Head Unit Dismantling Report, 2023" report has been added to ResearchAndMarkets.com's offering.
  • The report highlights the dismantling of Toyota's MT2712-based head unit, Fisker's Intel A2960-based head unit, Great Wall Motor's Qualcomm 8155-based head unit and NIO ET7 cockpit DCU, and estimates and analyzes Great Wall Motor's head unit and NIO's DCU.
  • This article takes NIO ET7 cockpit DCU we dismantle as an example.
  • Compared with the first-generation, the SoC chip of the second-generation cockpit DCU is changed from Nvidia Parker to Qualcomm SA8155P.

Global and China Intelligent Cockpit Domain Control Unit and Head Unit Dismantling Report 2023: Focus on Toyota's MT2712, Fisker's Intel A2960, Great Wall Motor's Qualcomm 8155, NIO ET7 Cockpit DCU - ResearchAndMarkets.com

Retrieved on: 
Donnerstag, März 30, 2023
Aerospace, Manufacturing, Great Wall Motor, UFS 2.1, AMOLED, DCU, MCU, Human, MIPI, Parameter, RGMII, USB 3.0, Housing, PHY, DAB, Marvell, Fisker, Digital Audio Broadcasting, UWB, NDA, USB, DSI, Micrometre, Key, Temperature, Qualcomm, HDR, HUD, SOC, NIO, RJ45, Wi-Fi, SFP, SGMII, DisplayPort, IEEE, MAC, GMII, RMII, SMII, MII, ADI, Intel, NIO ET7, PCB, Banyan, Polychlorinated biphenyl, MST, MAXIM, Compact Camera Port 2, TSN, AR, GB, Television, Video game, Electronics, Printed circuit board, Instrumentation, Samsung

The report highlights the dismantling of Toyota's MT2712-based head unit, Fisker's Intel A2960-based head unit, Great Wall Motor's Qualcomm 8155-based head unit and NIO ET7 cockpit DCU, and estimates and analyzes Great Wall Motor's head unit and NIO's DCU.

Key Points: 
  • The report highlights the dismantling of Toyota's MT2712-based head unit, Fisker's Intel A2960-based head unit, Great Wall Motor's Qualcomm 8155-based head unit and NIO ET7 cockpit DCU, and estimates and analyzes Great Wall Motor's head unit and NIO's DCU.
  • This article takes NIO ET7 cockpit DCU we dismantle as an example.
  • Compared with the first-generation, the SoC chip of the second-generation cockpit DCU is changed from Nvidia Parker to Qualcomm SA8155P.
  • This will affect efficiency and quality stability, and will also push up the overall cost of the cockpit DCU.

Global and China ADAS Domain Controller Key Component Industry Report 2023 Featuring Huawei, Desay SV, DJI Automotive, Tesla, Haomo.AI, & FreeTech

Retrieved on: 
Mittwoch, März 29, 2023
Communication, MCU, STP, USB, EMI, Lidar, SGMII, JEDEC, LPDDR5, TI, PCI Express, Infotainment, Certification, MultiMediaCard, UFS, AVP, LPDDR, AEC, Tesla, Gigabit Ethernet, Li Auto L9, RAW, DJI, Infineon Technologies, Radar, NGP, DRAM, Marvell, ASIL, Audiovisual, IMU, IEEE, Volkswagen, CPU, Energy-Efficient Ethernet, TLC, Algorithm, NXP, Acceleration, YUV, Micrometre, LVDS, UFS 3.1, SATA, RGB, GPU, Video game, Computer data storage, Instrumentation, Mobile phone, Camera, Television, Renesas Electronics, YUV444, ADAS, YUV422

DUBLIN, March 29, 2023 /PRNewswire/ -- The "Global and China ADAS Domain Controller Key Component Trends Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 29, 2023 /PRNewswire/ -- The "Global and China ADAS Domain Controller Key Component Trends Report" report has been added to ResearchAndMarkets.com's offering.
  • The analyst has researched and summarized China's current mainstream high computing power ADAS domain controller products such as Huawei MDC and DJI ADAS domain controller prototype, and technical information.
  • This paper will briefly analyze the key components of ADAS domain controller, including CPU, MCU, storage, and interface.
  • Generally, the MCUs for ADAS domain controllers are provided by Infineon or NXP, especially Infineon TC297X/397X series with a high market share.