Polychlorinated biphenyl

EQS-News: XTPL to provide another industrial module for HB Technology

Retrieved on: 
Freitag, Mai 3, 2024

In H1 2024, XTPL will deliver a second industrial module to its South Korean partner HB Technology.

Key Points: 
  • In H1 2024, XTPL will deliver a second industrial module to its South Korean partner HB Technology.
  • The cooperation is targeted at the industrial implementation of the XTPL technology on the production lines of the end customer – a leading global manufacturer of FPDs (Flat Panel Displays).
  • The second order for the industrial module and the construction of another prototype device are expected to accelerate further tests of the XTPL technology, conducted concurrently at HB Technology and at the end customer's facility.
  • HB Technology, listed on KOSDAQ in South Korea, is a manufacturer of equipment for testing and repairing devices for global display makers.

maXTouch® Touchscreen Controller Family Expands with Additional Security Features for Touchscreen Payment Systems

Retrieved on: 
Donnerstag, April 25, 2024

Adding credit card payment options to EV chargers is becoming a standard practice in many countries—and is a mandate in the European Union—and chargers need to meet Payment Card Industry (PCI) security standards.

Key Points: 
  • Adding credit card payment options to EV chargers is becoming a standard practice in many countries—and is a mandate in the European Union—and chargers need to meet Payment Card Industry (PCI) security standards.
  • To help EV charger designers protect their payment architectures, Microchip Technology (Nasdaq: MCHP) has launched the MXT2952TD 2.0 family of secure touchscreen controllers.
  • Typical touch-enabled human machine interface (HMI) and radio frequency identification (RFID) combination-based payment systems are vulnerable to hacking attacks via malicious software updates or man-in-the-middle attacks when a user enters their personal identification number (PIN) on the touchscreen.
  • For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com .

Monsanto Wins Appeal Ruling in Erickson v. Monsanto

Retrieved on: 
Donnerstag, Mai 2, 2024

Today, a decision was issued by the Court of Appeals Division I in the State of Washington in Erickson v. Monsanto, ruling in Monsanto’s favor on multiple grounds.

Key Points: 
  • Today, a decision was issued by the Court of Appeals Division I in the State of Washington in Erickson v. Monsanto, ruling in Monsanto’s favor on multiple grounds.
  • This decision reverses the initial verdict of $185 million in its entirety and remands the case back to trial court for further proceedings.
  • “The Company will consider its legal options regarding the application of this ruling to other SVEC verdicts that are in conflict with it, as well as how this ruling could affect future trials.”
    The SVEC cases represent most of PCB-related personal injury litigation against Monsanto.
  • Erickson is the first personal injury case to go to trial due to alleged PCB exposure at a single school in Washington state.

PCB Manufacturing Equipment Industry Report 2024: Global Trends, Forecasts and Competitive Analysis to 2030 Featuring ASM Pacific Technology, Orbotech, Nordson, Mycronic, and Tokyo Electron - ResearchAndMarkets.com

Retrieved on: 
Mittwoch, April 24, 2024

The "PCB Manufacturing Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "PCB Manufacturing Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030" report has been added to ResearchAndMarkets.com's offering.
  • The global PCB manufacturing equipment market is expected to reach an estimated $7.9 billion by 2030 with a CAGR of 3.8% from 2024 to 2030.
  • Growth Opportunities: Analysis of growth opportunities in different type, application, end use, and regions for the PCB manufacturing equipment market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the PCB manufacturing equipment market.

Conti Federal Awarded Task Order for Remedial Action at the Unimatic Manufacturing Superfund Site

Retrieved on: 
Mittwoch, April 24, 2024

Conti Federal Services, a leading federal construction and engineering firm specializing in environmental remediation, has been awarded a task order contract in an estimated amount of $4,200,000 for remedial action of the Unimatic Manufacturing Corporation Superfund Site, Operable Unit (OU) 2, in Fairfield, Essex County, New Jersey.

Key Points: 
  • Conti Federal Services, a leading federal construction and engineering firm specializing in environmental remediation, has been awarded a task order contract in an estimated amount of $4,200,000 for remedial action of the Unimatic Manufacturing Corporation Superfund Site, Operable Unit (OU) 2, in Fairfield, Essex County, New Jersey.
  • Conti Federal will be responsible for the proper excavation and disposal of sediments contaminated with polychlorinated biphenyls (PCBs) and pesticides as well as backfilling the excavated areas with clean soil, wetland restoration, and site restoration.
  • “We’re thrilled to partner with USACE Kansas City again on this critical environmental cleanup,” said Laura Tobin, Vice President of Environmental Remediation for Conti Federal.
  • Conti Federal has extensive environmental remediation and superfund cleanup experience dating back nearly 40 years.

High Performance Rigid PCB Industry Report 2024: Global Trends, Forecasts and Competitive Analysis to 2030 Featuring Ibiden, PCBmay, TTM, Unimicron Technology, Tripod Technology, AT&S, and SEMIKRON - ResearchAndMarkets.com

Retrieved on: 
Mittwoch, April 24, 2024

The "High Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "High Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030" report has been added to ResearchAndMarkets.com's offering.
  • Regional Analysis: High performance rigid pcb market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the high performance rigid PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the high performance rigid PCB market.

E Ink Teams Up with Ecosystem Partners to Develop Next-Generation ePaper Shelf Labels

Retrieved on: 
Montag, April 15, 2024

This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM.

Key Points: 
  • This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM.
  • "Replacing paper labels with ePaper shelf labels brings higher efficiency and lower energy consumption to retailers,” said Johnson Lee, CEO of E Ink.
  • We worked together to develop technology to realize the potential of SoP on ePaper panels and to drive the next generation electronic shelf label.
  • If the information is updated four times a day, the carbon dioxide emissions generated by using paper labels are 32,000 times higher than ePaper labels.

Qualcomm Low Configuration 8295 Based Cockpit Domain Controller Dismantling Analysis Report - ResearchAndMarkets.com

Retrieved on: 
Donnerstag, April 11, 2024

The "Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report" report has been added to ResearchAndMarkets.com's offering.
  • The official name of the cockpit domain controller is "Digital Cockpit Head Unit (DHU)".
  • The cockpit domain controller has two versions, high configuration and low configuration, both of which use Qualcomm SA8295P chips.
  • This article carries out a rough dismantling analysis on the DHU, involving overview, master chip, storage, MCU and radio.

XTPL to provide another industrial module for HB Technology

Retrieved on: 
Mittwoch, April 17, 2024

WROCLAW, Poland, April 17, 2024 /PRNewswire/ -- In H1 2024, XTPL will deliver a second industrial module to its South Korean partner HB Technology.

Key Points: 
  • WROCLAW, Poland, April 17, 2024 /PRNewswire/ -- In H1 2024, XTPL will deliver a second industrial module to its South Korean partner HB Technology.
  • The cooperation is targeted at the industrial implementation of the XTPL technology on the production lines of the end customer – a leading global manufacturer of FPDs (Flat Panel Displays).
  • The second order for the industrial module and the construction of another prototype device are expected to accelerate further tests of the XTPL technology, conducted concurrently at HB Technology and at the end customer's facility.
  • HB Technology, listed on KOSDAQ in South Korea, is a manufacturer of equipment for testing and repairing devices for global display makers.

Fineline Global Group announces the acquisition of IBR Leiterplatten GmbH & Co. KG

Retrieved on: 
Dienstag, April 16, 2024

KIBUTZ HAZOREA, Israel, April 16, 2024 /PRNewswire/ -- IBR Leiterplatten GmbH & Co. KG joins the Fineline Global Group and is now an integral part of one of the leading suppliers of PCBs.

Key Points: 
  • KIBUTZ HAZOREA, Israel, April 16, 2024 /PRNewswire/ -- IBR Leiterplatten GmbH & Co. KG joins the Fineline Global Group and is now an integral part of one of the leading suppliers of PCBs.
  • Fine Line Gesellschaft für Leiterplattentechnik mbH acquired 100% shares of IBR.
  • The successful IBR will continue to operate independently and will now strengthen its position in the market, benefiting from additional production capacities, resources and infrastructure from the strong Fineline network.
  • Together with IBR, Fineline will continue to expand its position as a leading value-added reseller of printed circuit boards in Germany and the DACH region.