LVDS

ROHM Semiconductor and Nanjing SemiDrive Technology Jointly Develop a Reference Design: Utilizing PMICs and SerDes ICs for SoC

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星期三, 五月 22, 2024
Display board, Partnership, Element, Heart, LED, Rohm, Socs, Silicon carbide, Semiconductor, ADAS, Central processing unit, Certification, LVDS, Intellectual property, ROHM, ICS, PMIC, ASIL, Electronics, ISO, CPU, Development, LDO, SOC, Memory, GPU, SerDes, Video game

The design is primarily based on SemiDrive’s X9M and X9E automotive SoCs, and includes PMICs, SerDes ICs, LED driver IC, and other components from ROHM.

Key Points: 
  • The design is primarily based on SemiDrive’s X9M and X9E automotive SoCs, and includes PMICs, SerDes ICs, LED driver IC, and other components from ROHM.
  • In this context, ROHM PMICs and SerDes ICs achieve a high level of integration in power supply blocks, while supporting increased stability during high-speed data transmission.
  • This resulted in ROHM components, such as PMICs and SerDes ICs, being integrated into the reference board for SemiDrive's X9H In-Vehicle SoC.
  • In particular, ROHM SerDes ICs and PMICs, which leverage original analog technology, are key components in our reference design.

New DART-MX93 System on Module by Variscite Brings Machine Learning to Compact, Cost-Optimized, Rugged Edge Devices

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星期三, 五月 8, 2024
Data Management, Semiconductor, Security, IOT (Internet of Things), Technology, Software, Hardware, Cortex, Wi-Fi 6, Internet of things, LVDS, Som, DART, Machine learning, NXP, System on module, ADC, Gigabit Ethernet, Temperature, USB, Longevity, Video game

Variscite , a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced the newest member of the DART Pin2Pin family for machine learning on edge devices at a competitive price for markets like industrial, IoT, smart devices, and wearables.

Key Points: 
  • Variscite , a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced the newest member of the DART Pin2Pin family for machine learning on edge devices at a competitive price for markets like industrial, IoT, smart devices, and wearables.
  • At only 55 x 30 millimeters—about half the size of a credit card—the DART-MX93 enables machine learning, even in compact devices.
  • Its energy-flex architecture provides efficient processing; built-in security ensures data and applications are protected.
  • DART-MX93 evaluation kits, which include the scalable VAR-DT8M custom board and an optional LVDS display with a touch panel, are also available.

GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment

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星期二, 四月 30, 2024
ISO 14001, TSMC, VHDL, IP, TUV, Safety, LVDS, Certification, PCI Express, Verilog, IEC, ISO, ISO 9001, Original equipment manufacturer, MIPI, Environment, SystemVerilog, Field-programmable gate array, Memory, DDR3, Medical device

LONDON and GUANGZHOU, China, April 30, 2024 /PRNewswire/ -- GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.

Key Points: 
  • Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.
  • Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025.
  • The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs.
  • GOWIN's automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).

GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment

Retrieved on: 
星期二, 四月 30, 2024
ISO 14001, TSMC, VHDL, IP, TUV, Safety, LVDS, Certification, PCI Express, Verilog, IEC, ISO, ISO 9001, Original equipment manufacturer, MIPI, Environment, SystemVerilog, Field-programmable gate array, Memory, DDR3, Medical device

LONDON and GUANGZHOU, China, April 30, 2024 /PRNewswire/ -- GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.

Key Points: 
  • Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.
  • Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025.
  • The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs.
  • GOWIN's automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).

Integrated Actuation Power Solution Aims to Simplify Aviation Industry’s Transition to More Electric Aircraft

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星期三, 四月 17, 2024
Aircraft, Microchip Technology, LVDS, TIA, Integrated circuit, HPD, Silicon, MEA, MCHP, PWM, Field-programmable gate array, PT1000, EMI, TIA/EIA-644, Memory, UVLO, Temperature, Aviation, Electromagnetic interference, Printed circuit board

To satisfy these goals, aviation power systems developers are transitioning to electric actuation systems as the trend towards More Electric Aircraft (MEA) continues to grow.

Key Points: 
  • To satisfy these goals, aviation power systems developers are transitioning to electric actuation systems as the trend towards More Electric Aircraft (MEA) continues to grow.
  • To provide the aviation industry with a comprehensive electric actuation solution, Microchip Technology (Nasdaq: MCHP) today announces a new integrated actuation power solution that combines companion gate driver boards with our expansive Hybrid Power Drive (HPD) modules in silicon carbide or silicon technology with a power range of 5 kVA to 20 kVA.
  • The new integrated actuation power solution maintains the same footprint regardless of the power output.
  • Microchip’s power solutions are designed to scale based on the requirements of the end application, from smaller actuation systems for drones to high-power actuation systems for Electric Vertical Take-Off and Landing (eVTOL) aircraft, MEA and all-electric aircraft.

Automotive-Compliant Video Switch from Diodes Incorporated Cuts Bill of Materials for Leading Interface Standards

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星期二, 四月 30, 2024
Technology, General Automotive, Mobile, Wireless, Audio, Video, Automotive, Other Technology, Networks, Internet, Hardware, Electronic Design Automation, Semiconductor, Data Management, Security, Consumer Electronics, PCB, LVDS, HPD, DDC, HDMI, DIOD, ADAS, AUX, DisplayPort, Sunlight, AC, PPAP, USB, IATF

Diodes Incorporated (Diodes) (Nasdaq: DIOD) has introduced the PI3WVR14412Q , an automotive-compliant* 20Gbps 1:2 video switch for in-cabin infotainment and advanced driver assistance systems (ADAS) applications.

Key Points: 
  • Diodes Incorporated (Diodes) (Nasdaq: DIOD) has introduced the PI3WVR14412Q , an automotive-compliant* 20Gbps 1:2 video switch for in-cabin infotainment and advanced driver assistance systems (ADAS) applications.
  • The switch has four high-speed lanes with a 10GHz bandwidth to handle DisplayPort™ 2.1, HDMI™ 2.1, MIPI® DPHY/CPHY, USB 3.2, and LVDS connections.
  • In addition, there are switches for hot-plug detect (HPD), HDMI display data channel (DDC), and DisplayPort auxiliary (AUX) signals.
  • The wide ambient operating-temperature range, from -40°C to 105°C, permits deployment in challenging environments or locations exposed to direct sunlight.

indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications

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星期一, 四月 22, 2024
Software, Audio, Video, Hardware, EV, Electric Vehicles, Automotive, Technology, Vehicle Technology, Semiconductor, Safety, LVDS, SOC, Radar, HDMI, DisplayPort, Family, Multimedia, USB, Socs, Video game

indie Semiconductor, Inc. (Nasdaq: INDI), an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable in-cabin connectivity applications, including audio and video transport and device interfacing.

Key Points: 
  • indie Semiconductor, Inc. (Nasdaq: INDI), an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable in-cabin connectivity applications, including audio and video transport and device interfacing.
  • These new capabilities expand indie’s innovative lineup of in-cabin solutions, empowering global Tier 1 system integrators to deliver best-in-class in-vehicle experience to automakers.
  • View the full release here: https://www.businesswire.com/news/home/20240422365668/en/
    indie Launches Advanced Smart Connectivity Solutions for In-Cabin Applications (Graphic: Business Wire)
    Effective interpretation and presentation of high-bandwidth data is essential for multi-screen, multi-zone applications, including in-cabin audio-video entertainment, camera, radar and other sensor-information for parking and safety features, and more.
  • “By offering our high performance, highly integrated smart connectivity SoCs, indie is enabling tier 1s and leading automakers to deliver on driver and passenger demand for a more immersive in-cabin experience and to capitalize on this rapidly emerging Autotech application.”
    indie’s smart connectivity solutions are set to ramp in 2025.

SiTime Continues to Advance Precision Timing with an Integrated Clock Chip for AI Datacenters

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星期三, 四月 17, 2024
Data Management, Semiconductor, Consumer Electronics, Technology, Nanotechnology, Artificial Intelligence, Hardware, MEMS, LVDS, SiTime, AI, PCI Express, LVCMOS, Silicon, Footprint, Noise, Electronics, Multimedia, LVPECL, Marketing, QFN, SITM, Data center, NIC, Electric motor

SiTime Corporation (NASDAQ: SITM), the precision timing company, today introduced its Chorus™ family of clock generators for AI datacenter applications.

Key Points: 
  • SiTime Corporation (NASDAQ: SITM), the precision timing company, today introduced its Chorus™ family of clock generators for AI datacenter applications.
  • Chorus’ new approach includes clock, oscillator and resonator technologies in an integrated chip, simplifying system clock architecture and accelerating design time by up to six weeks.
  • Chorus, combined with recently acquired timing products from Aura Semiconductor, builds on our strategy to offer a complete portfolio of highly differentiated solutions.
  • SiTime’s Chorus family of clock generators is sampling to strategic customers now, with general sampling availability in 2H 2024.

Advance Beyond Boundaries with Corelis

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星期三, 四月 3, 2024
Consumer Electronics, Technology, Manufacturing, IOT (Internet of Things), Robotics, Semiconductor, Other Technology, Other Manufacturing, Software, Engineering, Hardware, Conference, Embedded, Electronics, BSDL, PCI eXtensions for Instrumentation, Telecommunications, LVDS, JTAG, IPC, Printed circuit board

Corelis will showcase its latest embedded hardware test solutions, bus analyzer tools, and other JTAG boundary-scan products, renowned for their ease-of-use, and exceptional features.

Key Points: 
  • Corelis will showcase its latest embedded hardware test solutions, bus analyzer tools, and other JTAG boundary-scan products, renowned for their ease-of-use, and exceptional features.
  • Join us as we advance beyond boundaries and drive the future of test in the rapidly evolving electronics industry.
  • For more than three decades, Corelis has been empowering customers with innovative automated test solutions for debugging, testing, and in-system programming of embedded hardware.
  • Corelis’ customers comprise the foremost global manufacturers of electronic products in industries such as military-aerospace, consumer electronics, telecommunications, semiconductors, networking, and medical.

Cervoz at Embedded World 2024: Empowering Industry with Future-Ready Solutions

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星期一, 三月 25, 2024
ECC, Automation, Temperature, Communication, M.2, Memory, Data loss, Internet of things, NVM Express, DDR5, AI, PCI Express, Gigabit Ethernet, Solid-state drive, LVDS, Hall, Mobile phone

TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.

Key Points: 
  • TAIPEI, March 25, 2024 /PRNewswire/ -- Cervoz Technology, a leader in industrial-grade storage, memory, and expansion solutions, is excited to announce its participation in Embedded World 2024.
  • At the event, Cervoz will showcase its advanced solutions in themes echoing today's industrial trends, highlighting edge and advanced computing, compact design, interconnectivity, and more.
  • Acknowledging the surge in edge computing, Cervoz introduces M.2 2230 (A+E Key) NVMe Gen3x2 solutions, the T425 series .
  • Lead the future of industries—join Cervoz at Embedded World 2024 in Hall 1, Booth 1-401.