Integrated circuits

Samsung Electronics Announces Availability of Its Next Generation 2.5D Integration Solution ‘I-Cube4’ for High-Performance Applications

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星期四, 五月 6, 2021
Telecommunications, Software, Networks, Hardware, Data management, Technology, Semiconductor, Mobile, Wireless, Home appliances, Technology, Companies, Integrated circuits, Interposer, Multi-chip module, Samsung Electronics

View the full release here: https://www.businesswire.com/news/home/20210506005483/en/\nSamsung\xe2\x80\x99s I-Cube4 for high-performance applications (Photo: Business Wire)\nSamsung\xe2\x80\x99s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.)

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20210506005483/en/\nSamsung\xe2\x80\x99s I-Cube4 for high-performance applications (Photo: Business Wire)\nSamsung\xe2\x80\x99s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.)
  • \xe2\x80\x9cWith the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers\xe2\x80\x99 product implementations.\xe2\x80\x9d\nIn general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs.
  • The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions.
  • For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .\nView source version on businesswire.com: https://www.businesswire.com/news/home/20210506005483/en/\n'

Samsung Electronics Announces Availability of Its Next Generation 2.5D Integration Solution ‘I-Cube4’ for High-Performance Applications

Retrieved on: 
星期四, 五月 6, 2021
Electronic design automation, Engineering, Consumer electronics, Automotive Manufacturing, General Automotive, Technology, Aerospace, Manufacturing, Mobile, Wireless, Office Products, Semiconductor, Retail, Photography, Nanotechnology, Audio, Video, Automotive, Home Goods, Other Technology, Telecommunications, Other Manufacturing, Internet, Hardware, Technology, Computing, Electronics industry, Integrated circuits, Smartphones, Interposer, Samsung Electronics, Multi-chip module, Smartphone

View the full release here: https://www.businesswire.com/news/home/20210505006213/en/\nSamsung Foundry's I-Cube4 (Interposer Cube) Package Structure.

Key Points: 

EPC Launches 400 W Motor Drive Demonstration Powered by Gallium Nitride (GaN) Integrated Power Stage for More Efficient, Quieter, and Smaller Motors

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星期二, 五月 4, 2021
Semiconductor, Engineering, Technology, Manufacturing, Other Manufacturing, Hardware, Electronics industry, Electrical engineering, Inventions, Digital electronics, Integrated circuits, Semiconductor devices, Power electronics, Electric power conversion, Power inverter, Gate driver, MOSFET, Field-effect transistor

b'EPC announces the availability of the EPC9146 , a 400 W motor drive demonstration.

Key Points: 
  • b'EPC announces the availability of the EPC9146 , a 400 W motor drive demonstration.
  • The EPC9146 power board contains three independently controlled half bridge circuits, featuring the EPC2152 monolithic ePower\xe2\x84\xa2 Stage with integrated gate driver, 80 V maximum device voltage, 15 A (10 ARMS) maximum output current.
  • The inverter board measures just 81 mm x 75 mm and achieves an efficiency of greater than 98.4% at 400 W output power.\nThe EPC9146 can be paired with individually designed mating boards allowing the user to control the power board directly through various mainstream microcontroller boards leveraging existing resources for quick development.
  • eGaN FETs and integrated circuits provide performance many times greater than the best silicon power MOSFETs in applications such as DC-DC converters , remote sensing technology (lidar) , motor drives for emobility, robotics, and drones, and low cost satellites\neGaN is a registered trademark of Efficient Power Conversion Corporation, Inc.\nView source version on businesswire.com: https://www.businesswire.com/news/home/20210504005286/en/\n'

Worldwide Semiconductor Memory Industry to 2026 - Increasing Proliferation of Electronics is Driving Growth - ResearchAndMarkets.com

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星期二, 五月 4, 2021
Technology, Semiconductor, Computer memory, Digital electronics, MOSFETs, Technology, Computing, Electronic engineering, Integrated circuits, SEMI, Semiconductor memory, Non-volatile memory

The growth in the market can be attributed to new technological advancements in portable memory-based electronics in the forecast years.\nThe Global Semiconductor Memory Market can be bifurcated into type, volatile type, non-volatile type, application and region.

Key Points: 
  • The growth in the market can be attributed to new technological advancements in portable memory-based electronics in the forecast years.\nThe Global Semiconductor Memory Market can be bifurcated into type, volatile type, non-volatile type, application and region.
  • The semiconductor memory market, on the basis of application, can be segmented into Consumer Electronics, IT & Telecommunications, Automotive, Medical Devices, Aerospace & Defence and others (Industrial, Smart Cards, Mp3 Players, etc.).
  • This growth is due to the increasing proliferation of electronics with the need for associated storage in the devices.\nThe largest contributor to the Global Semiconductor Memory Market is Asia-Pacific with 35.56% market share in 2020.
  • The ongoing technological advancements and innovations for microcomputer-based systems are expected to fuel the Global Semiconductor Memory Market over the forecast years.\n'

Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model

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星期一, 五月 3, 2021
Software, Networks, Nanotechnology, Hardware, Data management, Technology, Semiconductor, Other Technology, Software, Electronic design automation, Electronic engineering, OpenAccess, Proprietary software, Integrated circuits, Compact Model Coalition, Silvaco, Synopsys, Integrated circuit design, Spice, the Compact Model Coalition, the Silicon Integration Initiative (Si2), THE COMPACT MODEL COALITION, THE SILICON INTEGRATION INITIATIVE (SI2)

b'The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.

Key Points: 
  • b'The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
  • Participating companies include Analog Devices, Cadence Design Systems, Infineon, Qualcomm, Siemens EDA, Silvaco and Synopsys.
  • CMC funds and supports select university and national laboratory compact model developers.
  • Its primary products include OpenAccess, the world\xe2\x80\x99s most widely used, open reference database for IC design, with a supporting standard APA.

JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices

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星期五, 四月 30, 2021
Mobile, Wireless, Technology, Semiconductor, Publishing, Engineering, Communications, Manufacturing, Hardware, Electronic design automation, Consumer electronics, Transistors, Electronics industry, Semiconductor devices, MOSFETs, Integrated circuits, Digital electronics, Power electronics, Silicon carbide, Gallium nitride, Power semiconductor device, Semiconductor, Field-effect transistor, JC-70, JEDEC, JC-70, JEDEC

b'JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, announces the publication of JEP184: Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor (MOS) Devices for Power Electronic Conversion.

Key Points: 
  • b'JEDEC Solid State Technology Association , the global leader in standards development for the microelectronics industry, announces the publication of JEP184: Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor (MOS) Devices for Power Electronic Conversion.
  • This publication provides guidelines for stress procedures being able to distinguish between different shift components and allowing measurement of their stability over time as affected by gate bias and temperature.
  • JEP184 also closely follows the recent JEDEC publication of JEP183: Guidelines for Measuring the Threshold Voltage (VT) of SiC MOSFETs.
  • Committee members include industry leaders in power GaN and SiC semiconductors, as well as users of wide bandgap power devices, and test and measurement equipment suppliers.

Global Silicon Epitaxial Wafer Market (2021 to 2026) - Growth, Trends, COVID-19 Impact, and Forecasts - ResearchAndMarkets.com

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星期五, 四月 30, 2021
Semiconductor, Hardware, Manufacturing, Other Manufacturing, Technology, Electronics industry, Semiconductor devices, Transistors, Power electronics, MOSFETs, Digital electronics, Integrated circuits, Thyristor, Silicon carbide, Field-effect transistor, Gallium nitride, Wafer

Therefore, the vendors of the market studied are targeting a wide range of industries, to mitigate risk and expand their customer base.

Key Points: 
  • Therefore, the vendors of the market studied are targeting a wide range of industries, to mitigate risk and expand their customer base.
  • Moreover, the demand for power MOSFET is supported by its growing use in replacing insulated-gate, bipolar transistors, and thyristors.
  • The high demand for power electronics devices has also resulted in a shortage of 200 mm wafers, in 2018 and 2019.
  • The high market price of the SiC substrate and the growing LED demand forced many Asian manufacturers to GaN wafers.

Mobix Labs and Richardson RFPD Sign Global Distribution Agreement

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星期三, 四月 28, 2021
Technology, Electronic engineering, Science and technology, Digital electronics, Electronic design, Integrated circuits, MOSFETs, CMOS, Internet of things

b'IRVINE, Calif., April 28, 2021 (GLOBE NEWSWIRE) -- Mobix Labs Inc ., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD , an Arrow Electronics company, today announced they have entered into a global distribution agreement.\nUnder the terms of the agreement, Richardson RFPD will represent Mobix Labs\xe2\x80\x99 high-performance, ultra-compact, highly integrated CMOS-based solutions, including the company\xe2\x80\x99s beamformers, antenna solutions and analog/RF semiconductors.\n\xe2\x80\x9cRichardson RFPD has a long history of supporting leading RF technologies in the global wireless infrastructure and IoT markets,\xe2\x80\x9d said Fabian Battaglia, CEO of Mobix Labs.

Key Points: 
  • b'IRVINE, Calif., April 28, 2021 (GLOBE NEWSWIRE) -- Mobix Labs Inc ., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD , an Arrow Electronics company, today announced they have entered into a global distribution agreement.\nUnder the terms of the agreement, Richardson RFPD will represent Mobix Labs\xe2\x80\x99 high-performance, ultra-compact, highly integrated CMOS-based solutions, including the company\xe2\x80\x99s beamformers, antenna solutions and analog/RF semiconductors.\n\xe2\x80\x9cRichardson RFPD has a long history of supporting leading RF technologies in the global wireless infrastructure and IoT markets,\xe2\x80\x9d said Fabian Battaglia, CEO of Mobix Labs.
  • The company\xe2\x80\x99s CMOS-based technology includes a portfolio of single SKU devices that offer significant advantages in performance, efficiency, cost, size, and time to market.\n\xe2\x80\x9cWe are impressed with Mobix Labs\xe2\x80\x99 CMOS-based solutions,\xe2\x80\x9d said Rafael R. Salmi, Ph.D., president of Richardson RFPD.
  • More information on the company can be found by visiting http://www.mobixlabs.com .\nRichardson RFPD, an Arrow Electronics company, is a global leader in the RF, wireless, IoT and power technologies markets.
  • To subscribe to Richardson RFPD\xe2\x80\x99s New Products e-newsletter, visit www.richardsonrfpd.com/subscribe .\n'

Achronix and Napatech Partner to Target Data Center Networking

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星期二, 四月 27, 2021
Fabless semiconductor companies, Reconfigurable computing, Achronix, Hardware acceleration, Integrated circuits, Computing, Electronics industry, Technology, Field-programmable gate array, Xilinx

Combining Achronix Speedster7t FPGAs, SpeedcoreeFPGAIP and Napatech SmartNIC solutions improves the performance of a wide range of applications and services for cloud data center operators, 5G mobile telecom service providers, enterprise data centers, government, and research organizations.\nAchronix\'s latest Speedster7t FPGA is the ideal fit for SmartNIC applications.

Key Points: 
  • Combining Achronix Speedster7t FPGAs, SpeedcoreeFPGAIP and Napatech SmartNIC solutions improves the performance of a wide range of applications and services for cloud data center operators, 5G mobile telecom service providers, enterprise data centers, government, and research organizations.\nAchronix\'s latest Speedster7t FPGA is the ideal fit for SmartNIC applications.
  • Napatech\'s industry-leading SmartNIC solutions combined with our Speedster7t FPGA is the ideal platform for the most demanding data acceleration applications.
  • "\nJarrod Siket, Chief Marketing Officer, Napatech said,"We are impressed with the full suite of capabilities of Achronix\'s Speedster7t FPGA products.
  • Achronix FPGA and eFPGA IP offerings are further enhanced by ready-to-use accelerator cards targeting AI, machine learning, networking and data center applications.

AONDevices Edge AI Processor Achieves Best-in-Class Voice and Sound Recognition at Ultra-Low Power

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星期一, 四月 26, 2021
Semiconductor, Technology, Other Technology, Mobile, Wireless, Audio, Video, Hardware, Integrated circuits, Hardware acceleration, Computer engineering, Computing, Field-programmable gate array, Intel X99, Application-specific integrated circuit, Electrical engineering

Including front-end processing and all required memory, AONVoice\xe2\x84\xa2 processor consumes less than 150\xc2\xb5W proven in 40nm ULP silicon.

Key Points: 
  • Including front-end processing and all required memory, AONVoice\xe2\x84\xa2 processor consumes less than 150\xc2\xb5W proven in 40nm ULP silicon.
  • This power is measured in 100% constant speech conditions.\n\xe2\x80\x9cOur technology evaluation of AONDevices\xe2\x80\x99 low power voice and sound recognition IP was very positive.
  • Each core can be configured for multiple custom wake words, voice commands, sound events and context detection.
  • AONDevices has licensed its AONVoice\xe2\x84\xa2 edge AI processor technology to top tier semiconductor companies and is currently demonstrating best-in-class performance results in both ASIC and FPGA.\nAONDevices is a fabless semiconductor company specializing in application-specific edge AI processors with high accuracy at ultra-low power.