I-PEX and Teramount Announce Collaboration on Detachable Fiber Interconnect for Silicon Photonics
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Thursday, March 2, 2023
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I-PEX, a leader in the field of high-frequency and high-speed transmission connectors and Teramount Ltd, the leader in silicon photonics fiber packaging, today announced they are collaborating to advance silicon photonics optical detachable connectivity for data centers and for other high-speed datacom and telecom applications.
Key Points:
- I-PEX, a leader in the field of high-frequency and high-speed transmission connectors and Teramount Ltd, the leader in silicon photonics fiber packaging, today announced they are collaborating to advance silicon photonics optical detachable connectivity for data centers and for other high-speed datacom and telecom applications.
- The collaboration between I-PEX and Teramount will provide a breakthrough solution of detachable fiber to chip connectivity based on Teramount’s self-aligning optics technology and I-PEX’s ultra-precision plug and holder systems.
- “Detachable fiber connectivity to silicon photonic chips is a game changer for the industry.
- "We look forward to working with them to help penetrate silicon photonics solutions into data centers and other applications”