BANC3 wins multi-year Department of Defense (DoD) contract for the Defense digital modernization effort
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Thursday, June 1, 2023
National Reconnaissance Office, State, Research and development, Probability, United States Department of Defense, Record, Multimedia, Defense industry of Turkey, NRO, Naval Surface Warfare Center, Defense industrial base, Department of Defense Cyber Crime Center, Intel, Radio, SDRX, Digital, SHIP, RF, Software, Communications satellite, Vandenberg
BANC3 will use Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high performance, low power Intel® Agilex™ FPGAs in the chiplets.
Key Points:
- BANC3 will use Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high performance, low power Intel® Agilex™ FPGAs in the chiplets.
- The STAMP program seeks to advance the transition of multichip packages built through the SHIP program to military systems.
- BANC3 is a developer and manufacturer of extremely wide instantaneous bandwidth software defined receivers for radio frequency spectrum monitoring.
- "This new contract represents our company's dedication to the warfighter; developing innovative systems for critical next-generation space monitoring platforms.