BANC3 wins multi-year Department of Defense (DoD) contract for the Defense digital modernization effort
BANC3 will use Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high performance, low power Intel® Agilex™ FPGAs in the chiplets.
- BANC3 will use Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high performance, low power Intel® Agilex™ FPGAs in the chiplets.
- The STAMP program seeks to advance the transition of multichip packages built through the SHIP program to military systems.
- BANC3 is a developer and manufacturer of extremely wide instantaneous bandwidth software defined receivers for radio frequency spectrum monitoring.
- "This new contract represents our company's dedication to the warfighter; developing innovative systems for critical next-generation space monitoring platforms.