Acorn and UCLouvain Professor Collaborate on Groundbreaking Silicon-on-Insulator Research Project
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Tuesday, November 16, 2021
Other Manufacturing, Technology, Mobile, Wireless, Research, Semiconductor, Engineering, Telecommunications, Manufacturing, Science, Efficiency, VP, Technology, CEO, Doctor of Philosophy, ABS, IOT, Telecommunication, Electronics, Research, IEEE, SOI, FinFET, Research institute, Smart Grid Energy Research Center, High-pass filter, RF, Institute of Electrical and Electronics Engineers, Algorithm, Institute, Silicon, Pharmaceutical industry, Mobile phone, Jean-Pierre Raskin, Acorn Technologies Inc., JEAN-PIERRE RASKIN, ACORN TECHNOLOGIES INC.
Acorn Technologies , a groundbreaking innovator in the semiconductor and telecommunications markets since 1998, today announced a research collaboration with Jean-Pierre Raskin, PhD, a full professor at the Universit catholique de Louvain (UCLouvain), Belgium's largest French-speaking university.
Key Points:
- Acorn Technologies , a groundbreaking innovator in the semiconductor and telecommunications markets since 1998, today announced a research collaboration with Jean-Pierre Raskin, PhD, a full professor at the Universit catholique de Louvain (UCLouvain), Belgium's largest French-speaking university.
- Acorn is funding a research project led by Professor Raskin to assess and quantify the performance potential of the companys Acorn Buried Stressor (ABS) technology for RF semiconductor manufacturing.
- Jean-Pierre Raskin has contributed to groundbreaking scientific research demonstrating that Silicon-on-Insulator (SOI) technology can enable affordable, high-performance mobile devices.
- Acorn Technologies is a product-oriented company that has been providing groundbreaking innovations for the semiconductor and telecom markets since 1998.