SOI

QuantalRF Launches Groundbreaking 5-7 GHz Wi-Fi 7 Front-End IC in CMOS SOI

Retrieved on: 
Thursday, April 4, 2024

This cutting-edge product integrates all RF front-end components into an ultra-compact CMOS SOI design, outperforming current GaAs and SiGe products.

Key Points: 
  • This cutting-edge product integrates all RF front-end components into an ultra-compact CMOS SOI design, outperforming current GaAs and SiGe products.
  • The QWX27105 delivers up to +22 dBm of linear transmitted output power, greatly enhancing the range of Wi-Fi.
  • “We are excited to now launch our groundbreaking QWX27105, 5-7GHz FEM in CMOS SOI, and are absolutely delighted to see the keen interest from top names in the Wi-Fi industry,” said Dr. Ali Fard, CEO of QuantalRF.
  • These antennas deliver unparalleled efficiency and true omni-directional radiation for improved range and spatial coverage, thereby greatly enhancing the Wi-Fi user experience.

Global Radio Frequency Front-End (RFFE) Market Analysis Report 2024: Growing Use of RF Front End Components in Automotive Applications Drives Growth - A US$44.94 Billion Forecasted Market by 2029

Retrieved on: 
Friday, March 15, 2024

In 2023, the global RFFE market was valued at US$24.9 billion and is forecast to reach US$44.94 billion by 2029.

Key Points: 
  • In 2023, the global RFFE market was valued at US$24.9 billion and is forecast to reach US$44.94 billion by 2029.
  • The RFFE market awaits the next big growth driver - 6G - which may not fully evolve today.
  • The global RFFE market value is projected to grow at a CAGR of 10.34%, during the forecast period of 2024-2029.
  • Trends: One of the most distinct and pervasive trends observed in the global RFFE market is growing wireless IoT connectivity.

WITTENSTEIN high integrity systems Unveils Aerospace Excellence at Embedded World 2024

Retrieved on: 
Tuesday, March 12, 2024

BRISTOL, England, March 12, 2024 /PRNewswire-PRWeb/ -- WITTENSTEIN high integrity systems is set to showcase its ground breaking aerospace excellence at the Embedded World 2024. At the heart of SAFERTOS lies a responsive, robust, and deterministic embedded RTOS, ideally suited for the demanding needs of aerospace development. However, WHIS goes beyond simply providing a powerful RTOS. SAFERTOS also embraces the challenges of certification, empowering developers with clear and concise certification planning documentation. WHIS supplies a tailored "Plan for Software Aspects of Certification" (PSAC) alongside standard documentation, enabling efficient collaboration with Designated Engineering Representatives (DERs) and smooth progress through Stage Of Involvement (SOI) audits. WHIS also offers comprehensive design and verification evidence, with their high standards and quality guiding the development of design documentation and source code. Regular SOI audits also verify conformance and ensure complete coverage with MC/DC testing. SAFERTOS is also delivered with source code alongside the verified binary library.

Key Points: 
  • WITTENSTEIN high integrity systems (WHIS), a pioneering force in Real-Time Operating Systems (RTOS), is set to showcase its latest aerospace advancements at the highly anticipated Embedded World 2024 in Nuremberg, 9th-11th April.
  • BRISTOL, England, March 12, 2024 /PRNewswire-PRWeb/ -- WITTENSTEIN high integrity systems is set to showcase its ground breaking aerospace excellence at the Embedded World 2024.
  • At the heart of SAFERTOS lies a responsive, robust, and deterministic embedded RTOS, ideally suited for the demanding needs of aerospace development.
  • WHIS invites all Embedded World 2024 attendees to visit our booth 4-337 to experience firsthand the future of real-time operating systems.

Media Alert: Atomera to Present Joint Paper with Soitec and San Jose State University on Advanced RF Technologies at 8th IEEE Electronic Devices Technology and Manufacturing (EDTM) Conference 2024

Retrieved on: 
Thursday, February 22, 2024

Rapid out-diffusion of boron from the SOI layer into BOX (buried oxide) layer has been observed for regular RF-SOI substrates.

Key Points: 
  • Rapid out-diffusion of boron from the SOI layer into BOX (buried oxide) layer has been observed for regular RF-SOI substrates.
  • The new SSROI substrate reduces body resistance for power handling improvement of RF switch devices, in addition to reducing the surface channel doping and thus impurity scattering for cutoff frequency improvement of LNA (low noise amplifier) devices.
  • The benefits of SSROI substrate will be demonstrated via >20% improvement in Rdson at the same DC-breakdown from experimental data as well as extension of SOI thickness and gate length scaling from 3D-TCAD simulation data for RF switch devices and via >50% gm (trans-conductance) improvement from TCAD simulation data for LNA devices.
  • Atomera’s RF-optimized Mears Silicon Technology (MST) is epitaxially deposited onto ultra-thin RF-SOI wafers, providing improvements in critical RF switch characteristics for 5G Advanced and 6G applications.

Merlin Awarded Part 135 Organizational Certification for Air Freight Operations in New Zealand

Retrieved on: 
Wednesday, February 21, 2024

Merlin , the leading developer of safe, autonomous flight technology for fixed-wing aircraft, today announced it received a Part 135 Air Operators Certificate to support future operational freight routes in New Zealand.

Key Points: 
  • Merlin , the leading developer of safe, autonomous flight technology for fixed-wing aircraft, today announced it received a Part 135 Air Operators Certificate to support future operational freight routes in New Zealand.
  • Merlin opened this Kerikeri center for operations in May 2023, and has been progressing both organizational and product certification since its Project Specific Certification Plan (PSCP) was first approved in August 2021 by the CAA.
  • In May 2023, Merlin also achieved its state of involvement (SOI) 1 milestone with the CAA, putting the Merlin Pilot on a viable path to certification and commercial operation.
  • “Achieving an organizational Part 135 certification gives us the opportunity to work with a forward-thinking regulator as well as leverage New Zealand as a sandbox for our current and future products.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

MHI Develops an Onboard AI-Based Object Detector Utilizing a Next-Generation Space-Grade MPU

Retrieved on: 
Wednesday, March 6, 2024

AIRIS is scheduled to be launched aboard the small demonstration satellite "RAISE-4"(3) in FY2025, after which it will conduct an in-orbit demonstration.

Key Points: 
  • AIRIS is scheduled to be launched aboard the small demonstration satellite "RAISE-4"(3) in FY2025, after which it will conduct an in-orbit demonstration.
  • AIRIS is a satellite-mounted device consisting of an AI-equipped data processor and an earth observation camera developed by the Tokyo University of Science.
  • It detects objects by taking images of objects on the earth's surface from orbit and then processing the images with AI.
  • AIRIS operations will be controlled with a next-generation space-grade MPU "SOISOC4" that is the product of development undertaken by JAXA and MHI.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, February 8, 2024

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, February 8, 2024

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.