SOI

Media Alert: Atomera to Present Joint Paper with Soitec and San Jose State University on Advanced RF Technologies at 8th IEEE Electronic Devices Technology and Manufacturing (EDTM) Conference 2024

Retrieved on: 
Thursday, February 22, 2024

Rapid out-diffusion of boron from the SOI layer into BOX (buried oxide) layer has been observed for regular RF-SOI substrates.

Key Points: 
  • Rapid out-diffusion of boron from the SOI layer into BOX (buried oxide) layer has been observed for regular RF-SOI substrates.
  • The new SSROI substrate reduces body resistance for power handling improvement of RF switch devices, in addition to reducing the surface channel doping and thus impurity scattering for cutoff frequency improvement of LNA (low noise amplifier) devices.
  • The benefits of SSROI substrate will be demonstrated via >20% improvement in Rdson at the same DC-breakdown from experimental data as well as extension of SOI thickness and gate length scaling from 3D-TCAD simulation data for RF switch devices and via >50% gm (trans-conductance) improvement from TCAD simulation data for LNA devices.
  • Atomera’s RF-optimized Mears Silicon Technology (MST) is epitaxially deposited onto ultra-thin RF-SOI wafers, providing improvements in critical RF switch characteristics for 5G Advanced and 6G applications.

Merlin Awarded Part 135 Organizational Certification for Air Freight Operations in New Zealand

Retrieved on: 
Wednesday, February 21, 2024

Merlin , the leading developer of safe, autonomous flight technology for fixed-wing aircraft, today announced it received a Part 135 Air Operators Certificate to support future operational freight routes in New Zealand.

Key Points: 
  • Merlin , the leading developer of safe, autonomous flight technology for fixed-wing aircraft, today announced it received a Part 135 Air Operators Certificate to support future operational freight routes in New Zealand.
  • Merlin opened this Kerikeri center for operations in May 2023, and has been progressing both organizational and product certification since its Project Specific Certification Plan (PSCP) was first approved in August 2021 by the CAA.
  • In May 2023, Merlin also achieved its state of involvement (SOI) 1 milestone with the CAA, putting the Merlin Pilot on a viable path to certification and commercial operation.
  • “Achieving an organizational Part 135 certification gives us the opportunity to work with a forward-thinking regulator as well as leverage New Zealand as a sandbox for our current and future products.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

Radiation Hardened Electronics Market worth $2.1 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Wednesday, March 6, 2024

Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

Key Points: 
  • Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
  • Analog devices play a crucial role in the semiconductor industry, where analog-to-digital conversion is extensively required in microcontrollers and signal processing.
  • The system can be implemented as a hybrid microcircuit, a single IC chip, or a printed circuit board.
  • For use in space and other related applications, these devices need to be hardened against the effects of radiation in digital and analog circuits.

MHI Develops an Onboard AI-Based Object Detector Utilizing a Next-Generation Space-Grade MPU

Retrieved on: 
Wednesday, March 6, 2024

AIRIS is scheduled to be launched aboard the small demonstration satellite "RAISE-4"(3) in FY2025, after which it will conduct an in-orbit demonstration.

Key Points: 
  • AIRIS is scheduled to be launched aboard the small demonstration satellite "RAISE-4"(3) in FY2025, after which it will conduct an in-orbit demonstration.
  • AIRIS is a satellite-mounted device consisting of an AI-equipped data processor and an earth observation camera developed by the Tokyo University of Science.
  • It detects objects by taking images of objects on the earth's surface from orbit and then processing the images with AI.
  • AIRIS operations will be controlled with a next-generation space-grade MPU "SOISOC4" that is the product of development undertaken by JAXA and MHI.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, February 8, 2024

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Thursday, February 8, 2024

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

pSemi Introduces New Automotive-Grade Ultra-Wideband RF Switch

Retrieved on: 
Tuesday, January 9, 2024

pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced it is expanding its automotive connectivity product portfolio by introducing the PE423211, an automotive-grade ultra-wideband (UWB) RF switch.

Key Points: 
  • pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced it is expanding its automotive connectivity product portfolio by introducing the PE423211, an automotive-grade ultra-wideband (UWB) RF switch.
  • The PE423211 features fast switching speed, high-power handling, and robust ESD and temperature performance, all in a compact 6-lead 1.6 × 1.6 mm DFN package.
  • Its suitability for BLE and UWB applications includes secure car access, telematics, sensing, infotainment, in-cabin monitoring systems (ICMS), and general-purpose switching.
  • “The automotive market continues to be a massive growth driver for pSemi as consumers demand a more robust connected car experience,” says Vikas Choudhary, vice president of global sales, marketing, and system engineering, pSemi.

Keysight EDA Strengthens Design and Simulation Support for Tower Semiconductor RF Process Technologies

Retrieved on: 
Wednesday, November 15, 2023

Keysight Technologies, Inc. (NYSE: KEYS) expanded the simulation capabilities in its Electronic Design Automation (EDA) software suite to include electro-thermal simulation for the Tower Semiconductor SiGe Power Amplifier (PA) process.

Key Points: 
  • Keysight Technologies, Inc. (NYSE: KEYS) expanded the simulation capabilities in its Electronic Design Automation (EDA) software suite to include electro-thermal simulation for the Tower Semiconductor SiGe Power Amplifier (PA) process.
  • Together with process design kits (PDKs) for Tower radio frequency (RF) technologies for circuit and physical designs, the new electro-thermal simulation enables integrated circuit (IC) designers to achieve first pass success.
  • Using this new capability, customers can ensure that their ICs perform within acceptable operating temperatures prior to manufacturing.”
    Visit the Tower Semiconductor foundry page for more information about Keysight EDA support for Tower technologies.
  • Credentialed Tower customers can find the RF PDKs for use in Keysight EDA software available in the Tower eBizz portal .

Salem Media Group, Inc. Announces Third Quarter 2023 Total Revenue of $63.5 Million

Retrieved on: 
Monday, November 13, 2023

Digital media revenue decreased 2.2% to $10.0 million from $10.2 million; and

Key Points: 
  • Digital media revenue decreased 2.2% to $10.0 million from $10.2 million; and
    Digital Media Operating Income (1) decreased 20.9% to $1.5 million from $1.9 million.
  • Publishing revenue decreased 17.5% to $4.6 million from $5.5 million; and
    Publishing Operating Loss (1) increased 36.6% to $1.4 million from $1.0 million.
  • Digital media revenue increased 0.1% to $31.3 million; and
    Digital media operating income (1) decreased 22.4% to $4.8 million from $6.2 million.
  • For the fourth quarter of 2023, the company is projecting total revenue to decline between 6% and 8% from the fourth quarter 2022 total revenue of $68.8 million.