Chiplet | Jotup

Generative AI Surge Triggers Nationwide Rush for New Data Center Infrastructure

Retrieved on:

måndag, april 29, 2024

VANCOUVER, British Columbia, April 29, 2024 /PRNewswire/ -- USA News Group News Commentary – Demand for new AI Data Centers which are powering the rise of such popular AI platforms as OpenAI's ChatGPT is being grossly underestimated according to analysts at this year's Bloomberg Intelligence summit. The ongoing generative AI boom is kicking off a rush for new data centers, and the providers of the infrastructure behind them. With this boom comes many challenges including power supplies and the price of necessary hardware. For 9 of the top 10 US electric utilities, data centers have been the main source of customer growth, according to analysis made by Reuters. The booming Global Data Center Market is expected to hit US$792.3 billion by 2032, according to Astute Analytica, while analysts at Christian & Timbers have identified what they believe will be a 27% increase in AI data center talent demand in 2024 over 2023. Behind the scenes are several developers advancing the data center surge, who over the last week updated the market with recent developments, including: Avant Technologies Inc. (OTC: AVAI), Alphabet Inc. (NASDAQ: GOOG) (NASDAQ: GOOGL) (NEO: GOOG), Meta Platforms, Inc. (NASDAQ: META) (NEO: META), Pegasystems Inc. (NASDAQ: PEGA), and Advanced Micro Devices, Inc. (NASDAQ: AMD).

Key Points:

The ongoing generative AI boom is kicking off a rush for new data centers , and the providers of the infrastructure behind them.
Avant Technologies to Implement AI-Empowered, Zero Trust Architecture in Its Data Centers
Avant Technologies, Inc. (OTCQB: AVAI) ("Avant" or the "Company"), an artificial intelligence technology (AI) company specializing in the development of advanced AI and data center infrastructure solutions, announced today its plans to implement a Zero Trust Architecture (ZTA) framework powered by AI within its data center operations.
"This combined approach ensures the highest level of security for our customers' data while optimizing data center operations for efficiency and cost-effectiveness.
Such advantages are vital for businesses aiming to upgrade their data center infrastructure and enhance computational capacity while actively striving to meet sustainability objectives.

Generative AI Surge Triggers Nationwide Rush for New Data Center Infrastructure

Retrieved on:

måndag, april 29, 2024

VANCOUVER, British Columbia, April 29, 2024 /PRNewswire/ -- USA News Group News Commentary – Demand for new AI Data Centers which are powering the rise of such popular AI platforms as OpenAI's ChatGPT is being grossly underestimated according to analysts at this year's Bloomberg Intelligence summit. The ongoing generative AI boom is kicking off a rush for new data centers, and the providers of the infrastructure behind them. With this boom comes many challenges including power supplies and the price of necessary hardware. For 9 of the top 10 US electric utilities, data centers have been the main source of customer growth, according to analysis made by Reuters. The booming Global Data Center Market is expected to hit US$792.3 billion by 2032, according to Astute Analytica, while analysts at Christian & Timbers have identified what they believe will be a 27% increase in AI data center talent demand in 2024 over 2023. Behind the scenes are several developers advancing the data center surge, who over the last week updated the market with recent developments, including: Avant Technologies Inc. (OTC: AVAI), Alphabet Inc. (NASDAQ: GOOG) (NASDAQ: GOOGL) (NEO: GOOG), Meta Platforms, Inc. (NASDAQ: META) (NEO: META), Pegasystems Inc. (NASDAQ: PEGA), and Advanced Micro Devices, Inc. (NASDAQ: AMD).

Key Points:

The ongoing generative AI boom is kicking off a rush for new data centers , and the providers of the infrastructure behind them.
Avant Technologies to Implement AI-Empowered, Zero Trust Architecture in Its Data Centers
Avant Technologies, Inc. (OTCQB: AVAI) ("Avant" or the "Company"), an artificial intelligence technology (AI) company specializing in the development of advanced AI and data center infrastructure solutions, announced today its plans to implement a Zero Trust Architecture (ZTA) framework powered by AI within its data center operations.
"This combined approach ensures the highest level of security for our customers' data while optimizing data center operations for efficiency and cost-effectiveness.
Such advantages are vital for businesses aiming to upgrade their data center infrastructure and enhance computational capacity while actively striving to meet sustainability objectives.

Global Micro and Nanoelectronics Report 2024-2035, Featuring 1100+ Company Profiles of Start-ups to Industry Leaders Across Devices, Circuits, Packaging, End-use Applications and Enabling Technologies - ResearchAndMarkets.com

Retrieved on:

måndag, april 22, 2024

Micro- and nanoelectronics refer to the study, design, and fabrication of electronic devices and systems at the micro- and nanoscale levels.

Key Points:

Micro- and nanoelectronics refer to the study, design, and fabrication of electronic devices and systems at the micro- and nanoscale levels.
These fields encompass a wide range of technologies and applications, leveraging the unique properties and behaviours of materials and structures at these scale levels.
It includes the design and manufacture of integrated circuits (ICs), microprocessors, microcontrollers, and other microscale electronic devices.
As such, micro- and nanoelectronics is the key and enabling technology for innovation in all areas of life.

ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets

Retrieved on:

onsdag, mars 20, 2024

This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced microbump technology.

Key Points:

This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced microbump technology.
As the chiplet design approach accelerates, ASE’s advanced interconnect technology allows designers to consider innovative, high density chiplet integration options where there might normally be chip IO density limitations for true 3D layered IP block considerations.
ASE’s microbump technology allows for a reduction in pitch from 40um down to 20um using a new metallurgical stack.
Fine pitch interconnect capabilities enable a 3D integration capability as well as a higher density for high IO memory considerations.

Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem

Retrieved on:

onsdag, mars 13, 2024

The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and interface interoperability to foster industry-wide collaboration, enable heterogeneous integration and expand system innovation.

Key Points:

The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and interface interoperability to foster industry-wide collaboration, enable heterogeneous integration and expand system innovation.
The solution is architected and built using the latest generation of Arm® Automotive Enhanced technologies and Cadence® IP.
Coupled with the need to quickly customize 3D-IC systems for a plethora of automotive applications, chiplets are an increasingly attractive solution.
The new solution architecture and reference design provide a standard for chiplet interface interoperability, addressing a critical industry need.

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Retrieved on:

tisdag, mars 12, 2024

ROME, March 12, 2024 /PRNewswire/ -- Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

Key Points:

This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028.
Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.
"We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution.
Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale.

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Retrieved on:

tisdag, mars 12, 2024

ROME, March 12, 2024 /PRNewswire/ -- Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

Key Points:

This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028.
Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.
"We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution.
Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale.

Ceva Joins Arm Total Design to Accelerate Development of End-to-End 5G SoCs for Infrastructure and NTN Satellites

Retrieved on:

onsdag, februari 28, 2024

CEVA, Chiplet, Socs, Silicon, PHY, Internet of things, MWC, CPU, L1, Risk, COTS, High-pass filter, Ecosystem, NTN, IP, SOC, DSPS, CSS, FPGA, Video game

BARCELONA, Spain, Feb. 28, 2024 /PRNewswire/ -- MWC Barcelona 2024 - Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced today that it has joined Arm Total Design, with the aim of accelerating the development of end-to-end 5G custom SoCs based on Arm® Neoverse™ Compute Subsystems (CSS) and the Ceva PentaG-RAN 5G platform, for wireless infrastructure including 5G base stations, Open RAN equipment and 5G non-terrestrial-networks (NTN) satellites.

Key Points:

Neoverse CSS are optimized, integrated and verified platforms which enable custom silicon designs at lower cost and a faster time-to-market.
"Arm Total Design enables a new era of innovation and collaboration on Neoverse CSS, empowering the ecosystem built around Arm to design custom silicon optimized for any application," said Eddie Ramirez, vice president of go-to-market, Infrastructure Line of Business, Arm.
"The Neoverse compute subsystem incorporating our Ceva PentaG-RAN 5G platform delivers a compelling solution to the market, lowering the entry barriers for companies looking to address new 5G markets like Open RAN and 5G NTN satellite networks."
The Ceva PentaG-RAN platform is RF front-end agnostic, ensuring it can be utilized for the development of 5G systems targeting mmWave and sub-6-GHz networks.

Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan

Retrieved on:

tisdag, februari 27, 2024

Workload, Rapidus, Chiplet, Silicon, Intelligence, LSTC, IPad, CPU, MOC, Organization, AMD, Apple, Partnership, Video game

In addition to the IP licensing portion of this deal, Tenstorrent will work with LSTC as a collaborative innovation partner to co-design the chip that will redefine AI performance in Japan.

Key Points:

In addition to the IP licensing portion of this deal, Tenstorrent will work with LSTC as a collaborative innovation partner to co-design the chip that will redefine AI performance in Japan.
Long known to offer the highest performing RISC-V CPU technology in the market, Tenstorrent will leverage its Ascalon RISC-V CPU core technology to co-develop a RISC-V CPU chiplet for LSTC's new edge AI accelerator.
"The edge AI accelerator will incorporate LSTC's AI chiplet along with Tenstorrent's RISC-V and peripheral chiplet technology.
"As a next-generation semiconductor design technology, we will promote the development of edge AI accelerators dedicated to edge inference processing applications, including generative AI, through international collaboration.

$148 Billion Chiplet Market by Processor, Packaging Technology - Global Forecast to 2028

Retrieved on:

måndag, februari 19, 2024

This research report categorizes the chiplet market on the basis of processor, packaging technology, end-use application, and region.

Key Points:

This research report categorizes the chiplet market on the basis of processor, packaging technology, end-use application, and region.
The report describes the major drivers, restraints, challenges, and opportunities pertaining to the chiplet market and forecasts the same till 2028.
Asia Pacific is expected to hold a major market share for chiplet market during the forecast period.
Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the chiplet market