DRAM

Micron Samples Next-Gen Graphics Memory for Gaming and AI

Retrieved on: 
tisdag, juni 4, 2024
GPU, NPU, Silicon, Cadence, Micrometre, AMD, GDDR, DRAM, DDR, LPDDR, PAM4, GDDR6, RAS, Data-rate units, Success, Calendar, TB, CPU, FPS, Sleep, HBM, Video game

With over 1.5 TB/s of system bandwidth,2 which is up to 60% higher bandwidth than GDDR6,3 and four independent channels to optimize workloads, Micron GDDR7 memory enables faster response times, smoother gameplay and reduced processing times.

Key Points: 
  • With over 1.5 TB/s of system bandwidth,2 which is up to 60% higher bandwidth than GDDR6,3 and four independent channels to optimize workloads, Micron GDDR7 memory enables faster response times, smoother gameplay and reduced processing times.
  • Micron GDDR7 memory offers high performance that increases throughput by up to 33% and reduces response time by up to 20% for generative AI workloads6 such as text to image creation.
  • For gaming applications, Micron GDDR7 memory enables AI-enhanced gameplay with adaptable landscapes, players and storylines through performance and frame buffer scaling.
  • “The best-in-class capabilities of Micron GDDR7 memory help bring new levels of realism and performance to the most demanding applications.”
    With over five years of successful high-volume manufacturing of GDDR6X, Micron has consistently delivered world-class performance and quality.

Global Advanced Micro- and Nanoelectronics Market Report 2024, Featuring 1000 Company Profiles of Start-ups to Industry Leaders across Devices, Circuits, Packaging and Enabling Technologies - ResearchAndMarkets.com

Retrieved on: 
måndag, juni 10, 2024
Technology, Nanotechnology, Carbon, Diamond, Silicon, Laser, SiFive, Chiplet, Light-emitting diode, MEMS, 3D, Weebit Nano, SRAM, ICS, Internet of things, College of Engineering (KNUST), TSMC, Health, Artificial intelligence, Electronics, Power, Telecommunications, DRAM, Gesellschaft mit beschränkter Haftung, Field-programmable gate array, AMD, Education minister, Miniaturization, Carbon nanotube, Quantum, Energy and Power, Retail

The "Global Market for Advanced Micro- and Nanoelectronics 2024-2035" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Market for Advanced Micro- and Nanoelectronics 2024-2035" report has been added to ResearchAndMarkets.com's offering.
  • Advanced micro- and nanoelectronics refer to the study, design, and fabrication of advanced electronic devices and systems at the micro- and nanoscale levels.
  • These fields encompass a wide range of technologies and applications, leveraging the unique properties and behaviours of materials and structures at these scale levels.
  • Advanced micro- and nanoelectronics are driving innovations across industries, from consumer electronics and computing to healthcare, energy, and advanced manufacturing.

Patent Litigator Tony Nguyen Returns to Fish & Richardson

Retrieved on: 
måndag, juni 10, 2024
Legal, Professional Services, DRAM, Law, Samsung, Multimedia, Rochester Institute of Technology, Travel, University School, Telecommunications

Tony Nguyen has rejoined Fish & Richardson’s Houston office as a principal in the litigation group, focusing on computer hardware and semiconductor processing.

Key Points: 
  • Tony Nguyen has rejoined Fish & Richardson’s Houston office as a principal in the litigation group, focusing on computer hardware and semiconductor processing.
  • View the full release here: https://www.businesswire.com/news/home/20240610180185/en/
    Fish & Richardson Principal Tony Nguyen (Photo: Business Wire)
    “Tony is a talented litigator and a wonderful colleague,” said Corrin Drakulich, Fish’s global head of litigation.
  • We’re excited to welcome him back to the firm.”
    After 10 years at Fish, Nguyen departed the firm to travel with his wife.
  • After seeing the world, Nguyen decided it was time to return home to Fish, where he has been welcomed with open arms.

Ambarella’s Next-Gen AI SoCs for Fleet Dash Cams and Vehicle Gateways Enable Vision Language Models and Transformer Networks Without Fan Cooling

Retrieved on: 
tisdag, maj 21, 2024
Well, Sleep, Light, HDR, Collection, LPDDR5, Marketing, SDK, Socs, ADAS, AI, DRAM, MCU, BOM, CPU, Temperature, SOC, Spondias dulcis, DMS, Video game

The CV75AX also provides the AI horsepower for more complex driver-scoring models.

Key Points: 
  • The CV75AX also provides the AI horsepower for more complex driver-scoring models.
  • “Our current generation of AI SoCs has been widely adopted for in-vehicle systems by leading fleet telematics providers, with our unique ability to enable fanless AI dash cams that don’t impede the driver’s view,” said Senya Pertsel, sr. director of automotive marketing at Ambarella.
  • With their increased AI performance, these new SoCs are also bringing Ambarella’s advanced AI-based high dynamic range (HDR) image processing technology to in-vehicle fleet telematics systems.
  • This recently introduced platform provides comprehensive hardware and software solutions for creating edge AI systems, including powerful, safe and secure compute and software capabilities.

Advantest to Exhibit Latest Test Solutions at SEMICON Southeast Asia, May 28-30

Retrieved on: 
måndag, maj 20, 2024
Gold, Gallium nitride, International trade, Automation, CREA, Advantest, Data-rate units, Safety, PKG, Silicon carbide, AI, DRAM, Future Together, Convention center, WLBI, Innovation, HPC, Printed circuit board

TOKYO, May 20, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON Southeast Asia 2024 on May 28-30 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.

Key Points: 
  • TOKYO, May 20, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON Southeast Asia 2024 on May 28-30 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
  • Under the theme of “Facing the Future Together,” Advantest will honor this important milestone with valued customers and industry partners at SEMICON Southeast Asia 2024.
  • In Hall 3 booth #1008, Advantest will exhibit a broad range of test solutions that enable critical applications like high-performance computing (HPC), AI, automotive, and 5G/IoT.
  • HA1200 , offering die test capability with active thermal control to enable at-speed 100% test coverage before the dies are assembled into 2.5D/3D packages.

EdgeCortix Launches SAKURA-II Platform to Power the Next Wave of Generative AI at the Edge

Retrieved on: 
tisdag, maj 21, 2024
Technology, Semiconductor, Artificial Intelligence, Well, Vision transformer, TensorFlow, LVM, DNA, Calibration, Victoria's Voice Foundation 200, M.2, ONNX, Robotics, DETR, TFLOPS, PCI Express, Computation, FP32, AI, DRAM, Power management, Architecture, LLM, Memory, Software, PyTorch, Generative, MERA, Llama, CPU, Multimedia, Video game

EdgeCortix® Inc. , a leading fabless semiconductor company specializing in energy-efficient AI processing at the edge, today unveiled its next-generation SAKURA-II Edge AI accelerator.

Key Points: 
  • EdgeCortix® Inc. , a leading fabless semiconductor company specializing in energy-efficient AI processing at the edge, today unveiled its next-generation SAKURA-II Edge AI accelerator.
  • Featuring low latency, best-in-class memory bandwidth, high accuracy, and compact form factors, SAKURA-II delivers unparalleled performance and cost-efficiency across the diverse spectrum of edge AI applications.
  • The SAKURA-II platform, with its sophisticated MERA software suite, features a heterogeneous compiler platform, advanced quantization, and model calibration capabilities.
  • Key Benefits of SAKURA-II include:
    Optimized for Generative AI: Tailored specifically for processing Generative AI workloads at the edge with minimal power consumption.

HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024, Says TrendForce

Retrieved on: 
måndag, maj 20, 2024
Semiconductor, Technology, Other Technology, Mobile, Wireless, Artificial Intelligence, Hardware, News, DDR5, Blog, Micrometre, TSV, LPDDR5, HBM, M16, AI, DRAM, Table, TB, Samsung, Memory, Renewable energy

It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.

Key Points: 
  • It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.
  • However, limited yields of around 50–60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required.
  • Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.
  • Overall, with a higher proportion of wafer input allocated to HBM production, the output of advanced processes will be limited.

NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM during IEEE IMW 2024 in Seoul, Republic of Korea

Retrieved on: 
måndag, maj 13, 2024
3D, NEO, IMW, TCAD, SAN, DRAM, BCM, Modulation, Technology CAD, Memory, Computer data storage

SAN JOSE, Calif., May 13, 2024 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM. Andy Hsu, Founder & CEO presented groundbreaking Technology CAD (TCAD) simulation results for NEO's 3D X-DRAM™ during the 16th IEEE International Memory Workshop (IMW) 2024 in Seoul, Republic of Korea.

Key Points: 
  • SAN JOSE, Calif., May 13, 2024 /PRNewswire/ -- NEO Semiconductor , a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM.
  • Neo Semiconductor reveals a unique performance boosting mechanism called Back-gate Channel-depth Modulation (BCM) for Floating Body Cell that can increase data retention by 40,000X and sensing window by 20X.
  • "Unlike the traditional 2D Floating Body Cell that uses body effect to change the cell current, our BCM mechanism employs a back-gate voltage to modulate the channel depth.
  • NEO Semiconductor's 3D X-DRAM™ is a first-of-its-kind 3D NAND-like DRAM cell array structure based on floating body cell technology.

Thin Films, Big Impact: Navigating a 13.5% CAGR Landscape: BCC Research

Retrieved on: 
fredag, maj 10, 2024
Copper, Cloud computing, Gallium nitride, Internet, Biology, Metal, Instrument, Glass, Research fellow, Deposition, Logic, Element, Chemical vapor deposition, Tokyo Electron, Semiconductor, Silicon carbide, DRAM, ASM International, Key market, Growth, Silicon, Medicine, Coat, Memory, Brain, Research, Artificial intelligence, Physical, Material, Electronics

BOSTON, May 10, 2024 /PRNewswire/ -- "According to the latest research study, the demand for Global Markets, Technologies and Materials for Thin and Ultrathin Films expected to grow from $20.6 billion in 2023 and will reach $38.8 billion by the end of 2028 at a compound annual growth rate (CAGR) of 13.5% from 2023 through 2028"

Key Points: 
  • In Optical Coatings, they're used to enhance the performance of optical devices.
  • Moreover, demand is higher owing to the presence of many key players from the thin and ultrathin film deposition marketplace.
  • Who are the key companies/players in the global markets, technologies, and materials for thin and ultrathin films?
  • The key companies/players in the market include LAM Research Corp., Applied Materials, Inc., Tokyo Electron Limited, ASM International N.V., ULVAC, Inc., AIXTRON SE, and Advanced Micro-Fabrication Equipment Inc. among others.

Lattice to Showcase Advanced Edge AI Solutions at Embedded Vision Summit 2024

Retrieved on: 
onsdag, maj 8, 2024
Software, Networks, Internet, Hardware, Data Management, Apps, Applications, Technology, Semiconductor, Security, Engineering, Audio, Video, Manufacturing, Lattice Semiconductor, FPGA, Field-programmable gate array, LSCC, Artificial intelligence, DRAM

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it will showcase its latest FPGA technology at Embedded Vision Summit 2024 .

Key Points: 
  • Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it will showcase its latest FPGA technology at Embedded Vision Summit 2024 .
  • The Lattice booth will feature industry-leading low power, small form factor FPGAs and application-specific solutions enabling advanced embedded vision, artificial intelligence, and connectivity capabilities.
  • Joined by a strong lineup of innovation partners, Lattice will showcase its latest FPGA advancements that enable engineers to future-proof their designs for Automotive, Industrial, and Security applications at the Edge.
  • Additionally, Lattice will deliver a technical presentation titled “ Optimize Endpoint Smart Cameras with Low Power FPGA and DRAM offerings ,” to share how advanced, power-optimized FPGAs can dramatically reduce power consumption for endpoint cameras used in Automotive, Industrial, and other applications.