Embedded

Embedded World 2024 — Cincoze Will Showcase Industrial Edge AI Computing Solutions

Retrieved on: 
tisdag, mars 19, 2024
Hardware, Electronic Design Automation, Manufacturing, Technology, Other Transport, Trucking, Rail, Artificial Intelligence, Maritime, Transport, Other Technology, Other Manufacturing, Software, Logistics, Supply Chain Management, Public Transport, Temperature, GPU, Artificial intelligence of things, CRYSTAL, GOLD, MXM, Embedded, Computer, AI, Graphics processing unit, Machine learning, Multimedia, Video game

Rugged embedded computing brand - Cincoze, will be at Embedded World 2024 (Hall 1, Booth 1-260) in Nuremberg, Germany, on April 9-11, 2024.

Key Points: 
  • Rugged embedded computing brand - Cincoze, will be at Embedded World 2024 (Hall 1, Booth 1-260) in Nuremberg, Germany, on April 9-11, 2024.
  • Cincoze will display its range of world-class industrial embedded computing products around the theme of “Comprehensive AI Edge Computing Solutions,” encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Fanless Computers, Industrial Panel PCs & Monitors, Embedded GPU Computers, and New Products.
  • View the full release here: https://www.businesswire.com/news/home/20240319923810/en/
    Embedded World 2024 — Cincoze Will Showcase Industrial Edge AI Computing Solutions (Graphic: Business Wire)
    Cincoze Rugged Computing – DIAMOND product line is for harsh industrial environments where many computers would struggle.
  • Cincoze GPU Computing – GOLD product line is for rapidly evolving AI technologies by providing the computing power needed for machine learning and AIoT in industrial environments.

L&T Technology Services (LTTS) Secures Landmark ∼$100 Million Program in Cybersecurity

Retrieved on: 
fredag, mars 15, 2024
Data Management, Technology, Manufacturing, Blockchain, Security, Telecommunications, Software, Networks, Internet, Engineering, Mobile, Wireless, SOAR, Deepfake, SOC, Communication, ZTNA, KPMG, DNS, Hardware, Image, NAC, APT, Intelligence, Internet of things, Embedded, COE, Social media, Mobile malware, Acquisition, AI, DLP, City, DTAC, CCTV, CASB, CERT, L&T Technology Services, Multimedia, Consultant, Information, Computer security, State, PAM, Medical device

L&T Technology Services Limited (LTTS) (BSE: 540115, NSE: LTTS), a leading global pure-play engineering and technology services company, announced today that it has won a first-of-its-kind program in India worth around $100 million from Maharashtra State Cyber Department, under the Government of Maharashtra.

Key Points: 
  • L&T Technology Services Limited (LTTS) (BSE: 540115, NSE: LTTS), a leading global pure-play engineering and technology services company, announced today that it has won a first-of-its-kind program in India worth around $100 million from Maharashtra State Cyber Department, under the Government of Maharashtra.
  • This initiative extends LTTS’ commitment to developing secure, digitally interconnected smart and safe cities through premier Cyber Security and Digital Forensic solutions consolidated under one umbrella.
  • View the full release here: https://www.businesswire.com/news/home/20240314467779/en/
    First-of-its-kind program in India entails designing a sophisticated cybersecurity system using AI & Digital Forensic tools.
  • Commenting on the milestone win, Amit Chadha, CEO and Managing Director of L&T Technology Services, said, "This first-of-its-kind deal is more than just a business achievement for us.

Altium to Exhibit Latest Innovations at Embedded World 2024, April 9-11

Retrieved on: 
tisdag, mars 12, 2024
Software, Hardware, Electronic Design Automation, Data Management, Engineering, Technology, Semiconductor, Manufacturing, Altium Designer, Intelligence, Embedded, Travel, Electronics, ASX, Booth, Ecosystem, Multimedia

Altium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer, Altium 365, Octopart, and Altium Electronics Lifecycle Management, the company’s enterprise-grade digitally integrated system for electronics hardware.

Key Points: 
  • Altium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer, Altium 365, Octopart, and Altium Electronics Lifecycle Management, the company’s enterprise-grade digitally integrated system for electronics hardware.
  • Altium’s agile electronics development platform, Altium 365, enables Altium to deliver value across its entire product portfolio and ecosystem.
  • Altium is encouraging all Embedded World attendees to experience their booth.
  • Embedded World is this year’s most anticipated gathering of embedded experts and players, where thousands of embedded business, technology, and thought leaders travel from 75 countries to meet and exchange ideas.

Enclustra Showcases Coin-Sized FPGA Embedded Chip Innovations with Life-Saving, Life-Changing, and Dream-Making Capabilities at Embedded World 2024

Retrieved on: 
torsdag, april 4, 2024
Pluto, Environmental monitoring, Altera, MRI, VR, Communication, Unmanned aerial vehicle, Health, Embedded, Artificial intelligence, 3D, Measurement, Acquisition, Feature, Wireless, AMD, Som, Integrated circuit, Andromeda, FPGA, Facial recognition, Surveying

NÜRNBERG, Germany, April 4, 2024 /PRNewswire/ -- At Embedded World 2024, Enclustra will showcase limitless potential to innovate the next big thing with over 20 FPGA (Field Programmable Gate Array) embedded system on module (SoM) technology solutions.

Key Points: 
  • NÜRNBERG, Germany, April 4, 2024 /PRNewswire/ -- At Embedded World 2024, Enclustra will showcase limitless potential to innovate the next big thing with over 20 FPGA (Field Programmable Gate Array) embedded system on module (SoM) technology solutions.
  • "Enclustra leverages strategic partnerships with AMD, Altera and Microchip to provide customers with a comprehensive ecosystem of cutting-edge FPGA solutions optimized for performance and cost.
  • "The future is bright for innovation with FPGA embedded chip technologies, creating life-saving, life-changing, and dream-making solutions."
  • Experience Pluto launch event April 10, 2024, 14:30 – 15:30 in Hall 5-210 or virtually via LinkedIn.

Enclustra Showcases Coin-Sized FPGA Embedded Chip Innovations with Life-Saving, Life-Changing, and Dream-Making Capabilities at Embedded World 2024

Retrieved on: 
torsdag, april 4, 2024
Pluto, Environmental monitoring, Altera, MRI, VR, Communication, Unmanned aerial vehicle, Health, Embedded, Artificial intelligence, 3D, Measurement, Acquisition, Feature, Wireless, AMD, Som, Integrated circuit, Andromeda, FPGA, Facial recognition, Surveying

NÜRNBERG, Germany, April 4, 2024 /PRNewswire/ -- At Embedded World 2024, Enclustra will showcase limitless potential to innovate the next big thing with over 20 FPGA (Field Programmable Gate Array) embedded system on module (SoM) technology solutions.

Key Points: 
  • NÜRNBERG, Germany, April 4, 2024 /PRNewswire/ -- At Embedded World 2024, Enclustra will showcase limitless potential to innovate the next big thing with over 20 FPGA (Field Programmable Gate Array) embedded system on module (SoM) technology solutions.
  • "Enclustra leverages strategic partnerships with AMD, Altera and Microchip to provide customers with a comprehensive ecosystem of cutting-edge FPGA solutions optimized for performance and cost.
  • "The future is bright for innovation with FPGA embedded chip technologies, creating life-saving, life-changing, and dream-making solutions."
  • Experience Pluto launch event April 10, 2024, 14:30 – 15:30 in Hall 5-210 or virtually via LinkedIn.

e-peas showcases complete solutions for batteryless design with industry-leading ecosystem partners at Embedded World

Retrieved on: 
torsdag, april 4, 2024
Socs, PMIC, Conference, SOC, PC, Internet of things, Embedded, RF, PCB, Ecosystem, Consumer electronics

LOUVAIN-LA-NEUVE, Belgium, April 4, 2024 /PRNewswire/ -- e-peas, a leader in energy harvesting power management technology, invites engineers to its booth located Hall 4A -301 at Embedded World 2024 to see just how easy it is to use e-peas PMICs to power wirelessly connected designs using harvested ambient energy. With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.

Key Points: 
  • With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.
  • This year, e-peas will be showcasing its collaboration with several industry-leading partners in the fields of wireless Systems-on-Chip (SoCs), energy harvesting sources, and energy storage elements.
  • Geoffroy Gosset, CEO and co-founder of e-peas, stated: "e-peas PMICs ideally complement industry-leading wireless SoCs and other parts of the energy harvesting ecosystem to optimise the overall performance of our customer applications.
  • See the complete design journey from PMIC to end product on booth 4A-301 at the Embedded World Exhibition & Conference on 9-11 April at Nuremburg Messe, Germany.

e-peas showcases complete solutions for batteryless design with industry-leading ecosystem partners at Embedded World

Retrieved on: 
torsdag, april 4, 2024
Socs, PMIC, Conference, SOC, PC, Internet of things, Embedded, RF, PCB, Ecosystem, Consumer electronics

LOUVAIN-LA-NEUVE, Belgium, April 4, 2024 /PRNewswire/ -- e-peas, a leader in energy harvesting power management technology, invites engineers to its booth located Hall 4A -301 at Embedded World 2024 to see just how easy it is to use e-peas PMICs to power wirelessly connected designs using harvested ambient energy. With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.

Key Points: 
  • With complete ecosystem solutions for efficient power conversion, storage, and delivery using ambient light, thermal, or RF energy, e-peas and its partners provide a single point of contact for designers looking to move towards a greener IoT with a smaller PCB footprint, downsized storage element, and maintenance-free operation.
  • This year, e-peas will be showcasing its collaboration with several industry-leading partners in the fields of wireless Systems-on-Chip (SoCs), energy harvesting sources, and energy storage elements.
  • Geoffroy Gosset, CEO and co-founder of e-peas, stated: "e-peas PMICs ideally complement industry-leading wireless SoCs and other parts of the energy harvesting ecosystem to optimise the overall performance of our customer applications.
  • See the complete design journey from PMIC to end product on booth 4A-301 at the Embedded World Exhibition & Conference on 9-11 April at Nuremburg Messe, Germany.

Telit Cinterion Unveils High-Precision Global Navigation Satellite System IoT Module with Centimeter-Level Accuracy at Embedded World 2024

Retrieved on: 
torsdag, april 4, 2024
Satellite navigation, Swift, RTK, Embedded, Senior, Radio, Immunity, Wireless, Heart, Family, IMU, RTCM, GNSS, Surveying

IRVINE, Calif., April 4, 2024 /PRNewswire/ -- Telit Cinterion, an end-to-end IoT solutions enabler, announces the launch of its SE868K5-RTK module, a high-precision Global Navigation Satellite System (GNSS) receiver capable of centimeter-level accuracy.

Key Points: 
  • IRVINE, Calif., April 4, 2024 /PRNewswire/ -- Telit Cinterion, an end-to-end IoT solutions enabler, announces the launch of its SE868K5-RTK module, a high-precision Global Navigation Satellite System (GNSS) receiver capable of centimeter-level accuracy.
  • As the first GNSS module to provide centimeter-level accuracy in Telit Cinterion's extensive portfolio, the SE868K5-RTK is a multifrequency and multiconstellation positioning receiver module fortified by Real-Time Kinematics (RTK) capabilities that enhances positioning accuracy.
  • "The SE868K5-RTK demonstrates Telit Cinterion's unwavering commitment to delivering cutting-edge GNSS technology," said Marco Argenton, VP Product Management, IoT Modules at Telit Cinterion.
  • To learn more about the new SE868K5-RTK, visit Telit Cinterion at Embedded World April 9-11 in Hall 3 Stand 3-519.

SensiML at Embedded World 2024

Retrieved on: 
torsdag, april 4, 2024
Knowledge, Internet of things, Embedded, Developer, Peter Hancock (professor), Data management, Algorithm, Classification, Engineering, Running

PORTLAND, Ore., April 4, 2024 /PRNewswire/ -- SensiML™ Corporation, a leader in AI software for IoT and a subsidiary of QuickLogic (NASDAQ: QUIK), today announced that it is exhibiting at Embedded World 2024 in Nuremberg, Germany.

Key Points: 
  • PORTLAND, Ore., April 4, 2024 /PRNewswire/ -- SensiML™ Corporation, a leader in AI software for IoT and a subsidiary of QuickLogic (NASDAQ: QUIK), today announced that it is exhibiting at Embedded World 2024 in Nuremberg, Germany.
  • Smart Boxing Glove Game: Attendees can try their skills at SensiML's boxing game with real-time classification generated using a SensiML Knowledge Pack .
  • Smart Drill Demo: SensiML excels in the development of customized anomaly detection algorithms .
  • Don't miss the opportunity to explore how SensiML is paving the way for innovations in sensor data management and AI at Embedded World 2024.

DFI Revolutionizes the Computing Landscape with Windows on ARM Products

Retrieved on: 
onsdag, april 3, 2024
WOA, Microsoft, DFI, Automation, Growth, Embedded, Software, User interface, Windows on ARM, NXP, HMI, Video game

TAIPEI, April 3, 2024 /PRNewswire/ -- DFI, the world's leading brand in embedded motherboards and industrial computers, proudly announced the launch of its innovative product lineup featuring Windows on Arm (WoA) at Embedded World 2024. DFI NXP products deliver high power efficiency and seamlessly integrate Windows on Arm, introducing a new era in computing where the traditional stronghold of Windows on x86 processors is evolving.

Key Points: 
  • DFI NXP products deliver high power efficiency and seamlessly integrate Windows on Arm, introducing a new era in computing where the traditional stronghold of Windows on x86 processors is evolving.
  • Arm and Microsoft revealed a compelling study that projected an 81% growth in the Windows on Arm market within the next five years.
  • DFI's commitment to embracing this dynamic landscape is evident in its latest product offerings, designed to unlock the true potential of WoA.
  • This marks a significant step forward in entering the Windows on Arm field, with the promise of enhancing device computing performance, cost-effectiveness, and deployment flexibility in the future."