Embedded

Weebit Nano to demo its ReRAM technology on GlobalFoundries’ 22FDX® platform

Retrieved on: 
måndag, mars 18, 2024
Physics, Resistive random-access memory, Embedded, ASX, HW, HOD, Engineering, Silicon, Computer data storage

HOD HASHARON, Israel, March 18, 2024 (GLOBE NEWSWIRE) -- Weebit Nano Limited (ASX:WBT), a leading developer of advanced memory technologies for the global semiconductor industry, will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX® platform.

Key Points: 
  • HOD HASHARON, Israel, March 18, 2024 (GLOBE NEWSWIRE) -- Weebit Nano Limited (ASX:WBT), a leading developer of advanced memory technologies for the global semiconductor industry, will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX® platform.
  • The demo confirms the capability of ReRAM in this advanced geometry – a process node where embedded flash is unable to scale.
  • It also highlights some of the numerous capabilities of Weebit ReRAM, including ultra-low power consumption, fast programming time and byte addressability.
  • The 8Mb Weebit ReRAM demo chip in 22nm has the largest memory capacity of any Weebit module to-date and is implemented in the most advanced process so far.

Digi International to Unveil the New Digi ConnectCore® MP25 System-on-Module for Next-Gen Computer Vision Applications at Embedded World 2024

Retrieved on: 
torsdag, april 4, 2024
Electronic Design Automation, Semiconductor, IOT (Internet of Things), Technology, Mobile, Wireless, Artificial Intelligence, Hardware, Cortex, Bit, TSN, Temperature, Digi, MPU, Digi International, Intelligence, Internet of things, ISP, Embedded, USB 3.0, Burghart, Transport, AI, USB, NPU, IEEE 802.11ac-2013, Time-Sensitive Networking, Machine learning, SOM, ARM architecture family, Multimedia, Family, STMicroelectronics, Mobile phone

Featuring AI and machine learning capabilities, with an integrated neural processing unit and image signal processor, Digi ConnectCore MP25 is designed for next-generation computer vision applications in critical sectors such as industrial, medical, energy and transportation.

Key Points: 
  • Featuring AI and machine learning capabilities, with an integrated neural processing unit and image signal processor, Digi ConnectCore MP25 is designed for next-generation computer vision applications in critical sectors such as industrial, medical, energy and transportation.
  • View the full release here: https://www.businesswire.com/news/home/20240404695178/en/
    Digi International to unveil the new Digi ConnectCore® MP25 System-on-Module for next-gen computer vision applications at Embedded World 2024.
  • Visit Digi International at booth 4A-131 during Embedded World 2024, taking place from April 9 to 11, in Nuremberg, Germany.
  • For more information about Digi ConnectCore MP25, including a comprehensive list of features, please visit https://www.digi.com/connectcore-mp2 .

SiMa.ai Secures Funds and Readies New Generative Edge AI Platform

Retrieved on: 
torsdag, april 4, 2024
Security, IOT (Internet of Things), Technology, Software, Networks, Artificial Intelligence, Hardware, Speech, GM, Sound, Zebu, Partnership, Deep learning processor, The Next Chapter, Second generation, EDA, Embedded, SVP, Conceptual model, Blog, Business development, Lip-Bu Tan, AI, System, Human, Senior, Architecture, IP, Booth, Maverick Capital, Ecosystem, Machine learning, SNPS, TSMC, Silicon, Medical device

With the release of the second-generation MLSoC, SiMa.ai will unveil one software-centric platform for all edge AI .

Key Points: 
  • With the release of the second-generation MLSoC, SiMa.ai will unveil one software-centric platform for all edge AI .
  • SiMa.ai’s ‘one platform for all edge AI’ scales with customers as their AI/ML journey evolves, from computer vision, to transformers to multimodal generative AI.
  • “AI — particularly the rapid rise of generative AI — is fundamentally reshaping the way that humans and machines work together.
  • For more information on SiMa.ai’s one software-centric platform for all edge AI, please read The Next Chapter at SiMa.ai: One Platform for All Edge AI on the SiMa.ai blog.

Variscite Showcases i.MX 95-based System on Module for High-end Edge Computing with NXP at Embedded World 2024

Retrieved on: 
torsdag, april 4, 2024
Technology, Semiconductor, Engineering, Manufacturing, Software, Hardware, Electronic Design Automation, IOT (Internet of Things), Artificial Intelligence, Conference, SOC, JPR, Communication, Acceleration, Internet of things, Risk, Embedded, Secure, Software design, Robotics, Safety, NXP, Platinum, Multimedia, Som, Family, HMI, System on module, Map, Video game

“Variscite is proud to consistently release new System on Module solutions year after year at the embedded industry's most important annual event.

Key Points: 
  • “Variscite is proud to consistently release new System on Module solutions year after year at the embedded industry's most important annual event.
  • This year Variscite will showcase the new DART-MX95 and demonstrate its powerful capabilities at NXP’s booth,” said Ofer Austerlitz, VP Business Development and Sales of Variscite.
  • “The NXP i.MX 95 family is our next generation of edge computing for the industrial IoT platforms that need powerful applications performance, AI/ML acceleration, embedded security, and new safety features,” stated Robert Thompson, Director, Secure Connected Edge ecosystem, NXP.
  • Embedded World Exhibition & Conference is both a global platform and event for the embedded computing community, including leading experts, key players, and industry associations.

Advance Beyond Boundaries with Corelis

Retrieved on: 
onsdag, april 3, 2024
Consumer Electronics, Technology, Manufacturing, IOT (Internet of Things), Robotics, Semiconductor, Other Technology, Other Manufacturing, Software, Engineering, Hardware, Conference, Embedded, Electronics, BSDL, PCI eXtensions for Instrumentation, Telecommunications, LVDS, JTAG, IPC, Printed circuit board

Corelis will showcase its latest embedded hardware test solutions, bus analyzer tools, and other JTAG boundary-scan products, renowned for their ease-of-use, and exceptional features.

Key Points: 
  • Corelis will showcase its latest embedded hardware test solutions, bus analyzer tools, and other JTAG boundary-scan products, renowned for their ease-of-use, and exceptional features.
  • Join us as we advance beyond boundaries and drive the future of test in the rapidly evolving electronics industry.
  • For more than three decades, Corelis has been empowering customers with innovative automated test solutions for debugging, testing, and in-system programming of embedded hardware.
  • Corelis’ customers comprise the foremost global manufacturers of electronic products in industries such as military-aerospace, consumer electronics, telecommunications, semiconductors, networking, and medical.

BrightDrive and SiMa.ai Announce Collaboration to Revolutionize Autonomous Driving Technology

Retrieved on: 
tisdag, april 2, 2024
Software, Mobile, Wireless, Professional Services, Hardware, Start-Up, Technology, Automotive, Autonomous Driving, Vehicles, Artificial Intelligence, Semiconductor, Other Transport, Photography, Transport, Conference, Algorithm, Platform, Partnership, Embedded, Perception, Build automation, ASIL D, Booth, Safety, HW, Machine learning, ISO

BrightDrive, a leader in autonomous driving technology, today announced a strategic partnership with SiMa.ai, the software centric, embedded edge machine learning system-on-chip company, aimed at accelerating innovation in autonomous driving.

Key Points: 
  • BrightDrive, a leader in autonomous driving technology, today announced a strategic partnership with SiMa.ai, the software centric, embedded edge machine learning system-on-chip company, aimed at accelerating innovation in autonomous driving.
  • "This partnership marks the launch of the A-Sample of our advanced BrightDrive autonomous driving Platform, showcasing significant performance capabilities.
  • "Our collaboration with BrightDrive demonstrates our commitment to driving innovation in advanced driver assistance, from level 1 to level 5.
  • Together, BrightDrive and SiMa.ai are poised to redefine the future of autonomous driving technology, delivering solutions that are safer, more efficient, and scalable, transforming transportation as we know it.

ATrack Announces Newest GEO/LEO AI Telematics Box and In-Vehicle Solutions at Embedded World 2024

Retrieved on: 
måndag, april 1, 2024
Technology, Mobile, Wireless, Audio, Video, Fleet Management, Automotive, Vehicle Technology, Autonomous Driving, Vehicles, Artificial Intelligence, Transport, Other Technology, Software, Networks, Logistics, Supply Chain Management, Satellite, LEO, Diagnosis, Hall, AM9, Communication, LTE, Embedded, ADATA, GIS, ADAS, Gyro, GPS, Écu, DMS, Mini, Safety, Multimedia, GNSS, Satellite navigation device

ATrack Technology Inc., a pioneering force in the telematics industry, is set to unveil groundbreaking advancements in AI vision telematics solutions at Embedded World 2024.

Key Points: 
  • ATrack Technology Inc., a pioneering force in the telematics industry, is set to unveil groundbreaking advancements in AI vision telematics solutions at Embedded World 2024.
  • Showcasing the revolutionary AK750 AI telematics box, which supports both GEO and LEO connectivity with LTE redundancy, ATrack solidifies its position at the forefront of telematics technology.
  • View the full release here: https://www.businesswire.com/news/home/20240401639372/en/
    The AK750 GEO/LEO AI Telematics Box emerges as a revolutionary solution, specifically designed to tackle the connectivity challenges prevalent in remote environments.
  • ATrack's presence at Embedded World 2024 reaffirms its commitment to pushing the boundaries of telematics technology.

Cavli Wireless All Set to Introduce the 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024

Retrieved on: 
tisdag, mars 26, 2024
Other Manufacturing, Technology, Telecommunications, Manufacturing, Software, Internet, Hardware, IOT (Internet of Things), Data Management, Connectivity, LGA, M.2, Internet of things, Embedded, Wireless, ESIM, 3GPP, MCU, Linux, Creativity, Redcap, M2M, GNSS, Mobile phone

Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.

Key Points: 
  • Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.
  • The event represents the premier stage for global innovators like Cavli Wireless to showcase the innovative CQM220 to the world.
  • The CQM220 is the flagship 5G RedCap cellular IoT module from Cavli Wireless, compatible with 3GPP release 17 standards, specifically designed for advanced IoT and M2M applications.
  • With the unveiling of the CQM220 at Embedded World 2024, Cavli Wireless reiterates its dedication to providing cost-effective, uninterrupted, and superior cellular IoT solutions.

Renesas Introduces Industry’s First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core

Retrieved on: 
tisdag, mars 26, 2024
Apps, Applications, Mobile, Wireless, Technology, Semiconductor, Software, Networks, Internet, Hardware, Electronic Design Automation, Data Management, ISA, FPB, SRAM, Documentation, Face, Growth, Computing, Flasher, Memory, Internet of things, Embedded, ASSP, BOM, MCU, Renesas Electronics, IGBT, IDE, Overalls, Architecture, Engineering, DAC, Completeness, Ecosystem, Business analyst, LLVM, Multimedia, ADC, Integrated development environment, CPU, Video game

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core.
  • Similar to existing general-purpose MCUs, designers will have access to a full-scale development environment for the R9A02G021, provided by Renesas and its extensive network of toolchain partners.
  • The R9A02G021 group represents the first generation of general- purpose MCUs based on the internally developed RISC-V core by Renesas that will roll out over the next several years.
  • The R9A02G021 RISC-V MCUs are fully supported by Renesas’ e² studio Integrated Development Environment (IDE), offered to customers at no cost.

New Renesas MCUs with High-Resolution Analog and Over-the-Air Update Support Help Customer Systems Conserve Energy

Retrieved on: 
torsdag, mars 21, 2024
Apps, Applications, Mobile, Wireless, Technology, Semiconductor, Security, Software, Networks, Internet, Hardware, Data Management, Combination, Electricity, Temperature, M23, Sigma, Acceleration, Internet of things, Embedded, MCU, Renesas Electronics, FOTA, Digital filter, Ecosystem, BSP, Multimedia, ADC, FSP, AES

RA2A2 MCUs contribute to the digitalization of conventional systems with key features including high-level analog sensing, FOTA support, 8KHz/4KHz hybrid sampling, and AES hardware accelerator functions.

Key Points: 
  • RA2A2 MCUs contribute to the digitalization of conventional systems with key features including high-level analog sensing, FOTA support, 8KHz/4KHz hybrid sampling, and AES hardware accelerator functions.
  • When the end-systems are digitalized, it is possible to analyze individual systems status seamlessly for further energy-efficient, streamlining system operation.
  • The adoption of smart meters with NILM is the most cost-effective and scalable solution for increasing energy efficiency and lowering energy consumption.
  • “Renesas has worked closely with our customers to understand their requirements for next-generation systems that can support critical energy conservation goals,” said Akihiro Kuroda, Vice President of the Embedded Processing 2nd Division at Renesas.