Embedded

LDRA Launches Productivity Packages to Optimize Workflows for Functional Safety and Security Standards Compliance

Retrieved on: 
måndag, april 8, 2024
LDRA, Embedded, Certification, Artifact, Workflow, Documentation, Environment, Running, Transport, Medical device

WIRRAL, UK, April 08, 2024 (GLOBE NEWSWIRE) -- WIRRAL, UK—April 8, 2024— LDRA , the leader in automated software verification, traceability and standards compliance, today launched domain-specific software productivity packages for the LDRA tool suite :.

Key Points: 
  • WIRRAL, UK, April 08, 2024 (GLOBE NEWSWIRE) -- WIRRAL, UK—April 8, 2024— LDRA , the leader in automated software verification, traceability and standards compliance, today launched domain-specific software productivity packages for the LDRA tool suite :.
  • LDRA’s new productivity packages provide all the necessary software tools to demonstrate compliance with each industry’s highest required assurance levels.
  • The LDRA Productivity Packages offer capabilities ranging from static and dynamic analysis with unit and integration testing to complete compliance reporting for specific industry standards and assurance levels.
  • Functional safety and security are fundamental to each of the productivity packages and include capabilities such as coding standards compliance, security assessments, automatic test case generation, execution, artifact generation and compliance reporting.

LDRA Launches LDRAvault to Simplify Enterprise-Wide Software Verification Activities and Artifacts, Accelerate Certification

Retrieved on: 
måndag, april 8, 2024
LDRA, Risk, Embedded, Certification, Artifact, Organization, Engineering, Audit

WIRRAL, UK, April 08, 2024 (GLOBE NEWSWIRE) -- WIRRAL, UK—April 8, 2024— LDRA , the leader in automated software verification, traceability and standards compliance, today introduced LDRAvault to simplify the analysis and management of software certification activities and artifacts.

Key Points: 
  • WIRRAL, UK, April 08, 2024 (GLOBE NEWSWIRE) -- WIRRAL, UK—April 8, 2024— LDRA , the leader in automated software verification, traceability and standards compliance, today introduced LDRAvault to simplify the analysis and management of software certification activities and artifacts.
  • LDRAvault generates visualizations of verification results and trends and automatically maintains project snapshots and user-defined milestones.
  • In the embedded market, there are increasing demands for transparency and visibility in software development and verification workflows, particularly in the evolving certification and regulatory landscape.
  • LDRAvault ultimately helps organizations reduce the cost, time and risk of managing their certification artifacts and their verification and validation activities.

Advanced Cybersecurity Platform Now Integrates Six Vulnerability Management Tools Into One Interactive Dashboard

Retrieved on: 
torsdag, april 4, 2024
Internet of things, Automation, Risk, Embedded, Workflow, OP, Risk management, Software, Original equipment manufacturer, Medical device

These new capabilities are now available through a private beta program that allows users to test the flagship vulnerability management tool for free using their own device firmware.

Key Points: 
  • These new capabilities are now available through a private beta program that allows users to test the flagship vulnerability management tool for free using their own device firmware.
  • “Our primary aim with this release is to simplify cybersecurity risk management for OEMs across the embedded systems and smart device landscape,” said Irby Thompson, CEO and co-founder, OP[4].
  • The platform distinguishes between exploitable and benign threats at the binary code level and provides detailed insights and informed risk scoring through an interactive security dashboard.
  • Executives from OP[4] will be at Embedded World April 9-11, 2024 to showcase the expanded product security platform.

Cavli Wireless Gears Up to Introduce the 5G RedCap CQM220 Cellular IoT Module Alongside the Flagship CQS290 Android Module at Embedded World 2024

Retrieved on: 
onsdag, april 3, 2024
Cortex, SBAS, Connectivity, POS, LGA, USB 2.0, Bluetooth, GPU, Galileo Galilei, QZSS, BDS, M.2, LTE, Internet of things, Embedded, SAN, ESIM, 3GPP, Qualcomm, Telemetry, ARM, GPS, Transport, Asset tracking, Linux, OTG, PCI, City, Architecture, ARM Cortex-A53, USB, Android (operating system), GLONASS, Fourth Industrial Revolution, CPU, Redcap, M2M, GNSS, Mobile phone

SAN JOSE, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.

Key Points: 
  • SAN JOSE, Calif., April 03, 2024 (GLOBE NEWSWIRE) -- Cavli Wireless , a pioneer in the IoT solutions landscape, is all set to announce its flagship 5G RedCap CQM220 Cellular IoT Module at Embedded World 2024.
  • The event represents the premier stage for global innovators like Cavli Wireless to showcase the innovative CQM220 to the world.
  • The CQM220 is the flagship 5G RedCap cellular IoT module from Cavli Wireless, compatible with 3GPP release 17 standards, specifically designed for advanced IoT and M2M applications.
  • With the unveiling of the CQM220 and the showcase of the CQS290 at Embedded World 2024, Cavli Wireless reaffirms its commitment to delivering cost-effective, uninterrupted, and superior cellular IoT solutions.

Think Silicon to Showcase its Latest Ultra-Low-Power 3D Graphics and AI in One IP Architecture at Embedded World 2024

Retrieved on: 
onsdag, april 3, 2024
SOC, GPU, Sport, Rotation, Artificial intelligence of things, Memory, Library, Embedded, SAN, MCU, 3D, AI, Linux, Silicon, Architecture, Animation, VG, Lighting, SDK, Collection, GPGPU, TensorFlow, Video game

ATHENS, Greece and SAN JOSE, Calif., April 02, 2024 (GLOBE NEWSWIRE) -- Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2024 taking place in Nuremberg, Germany from April 9-11.

Key Points: 
  • ATHENS, Greece and SAN JOSE, Calif., April 02, 2024 (GLOBE NEWSWIRE) -- Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2024 taking place in Nuremberg, Germany from April 9-11.
  • Think Silicon’s NEOX® | GA100 is a GPGPU solution for the MCU market based on RISC-V, offering the unique combination of performing both 3D graphics and ΑΙ in one IP architecture.
  • The processor can be programmed using graphics and AI libraries independently or together.
  • Think Silicon’s experts will be available for meetings and demonstrations of the NEMA® and NEOX® product series at Embedded World.

Quectel unveils its HCM511S high performance MCU Bluetooth module to power Low Energy compact connected devices

Retrieved on: 
tisdag, april 9, 2024
Hardware, IOT (Internet of Things), Building Systems, Semiconductor, Security, Construction & Property, Consumer Electronics, Technology, Audio, Video, Apps, Applications, Wearables, Mobile Technology, Telecommunications, Software, Networks, Mobile, Wireless, Cortex, Blood pressure, Temperature, PC, USART, Sport, Internet of things, SPI, Bluetooth Special Interest Group, Embedded, Secure, ARM, Bluetooth mesh networking, LCC, Engineering, PWM, RAM, VEX, Thermometer, I2S, CSO, Multimedia, ADC, Lethargy, Bluetooth

Embedded World – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of the HCM511S high-performance MCU Bluetooth module for compact connected devices such as digital keys, portable devices and battery-operated motion sensors.

Key Points: 
  • Embedded World – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of the HCM511S high-performance MCU Bluetooth module for compact connected devices such as digital keys, portable devices and battery-operated motion sensors.
  • Utilizing Bluetooth Low Energy 5.4, the module accommodates an ARM Cortex-M33 processor and features built-in 32KB RAM and either 352KB or 512KB flash memory to deliver efficient performance.
  • View the full release here: https://www.businesswire.com/news/home/20240409992885/en/
    Quectel unveils its HCM511S high performance MCU Bluetooth module to power Low Energy compact connected devices (Graphic: Business Wire)
    The HCM511S module features excellent receiver sensitivity, a maximum transmit power of +6 dBm to achieve long distance transmission and has been designed to enable compact, low-power devices to connect cost effectively.
  • “We’re delighted to bring the compact, high-performance HCM511S Bluetooth Low Energy MCU module to the market,” says Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

Renesas Introduces New Entry-Level RA0 MCU Series with Best-in-Class Power Consumption

Retrieved on: 
tisdag, april 9, 2024
Software, Hardware, Data Management, Consumer Electronics, IOT (Internet of Things), Technology, Other Manufacturing, Construction & Property, Artificial Intelligence, Semiconductor, Security, Building Systems, Manufacturing, Combination, Arm, Automation, Temperature, M23, Environment, Internet of things, Business, LQFP, Embedded, Library, Internet, BOM, MCU, Renesas Electronics, TRNG, Family, QFN, HOCO, Ecosystem, BSP, Series, Multimedia, HMI, FSP, AES, Building, Mobile phone

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0 microcontroller (MCU) Series based on the Arm® Cortex®-M23 processor.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0 microcontroller (MCU) Series based on the Arm® Cortex®-M23 processor.
  • The new, low-cost RA0 devices offer the industry’s lowest overall power consumption for general purpose 32-bit MCUs.
  • In addition, Renesas offers a Software Standby mode in the new MCUs that reduces power consumption by a further 99 percent to a miniscule 0.2 µA.
  • Renesas is now shipping the first group in the RA0 Series, the RA0E1 Group.

SiMa.ai, CVEDIA and Supermicro Announce Collaboration to Bring Smart City Solutions to the Edge

Retrieved on: 
tisdag, april 9, 2024
Data Management, IOT (Internet of Things), Technology, Audio, Video, Software, Artificial Intelligence, Independent software vendor, Original equipment manufacturer, Partnership, Embedded, Supermicro, Sis, Originality, Machine learning, Medical device

SiMa.ai , the software centric, embedded edge machine learning system-on-chip company, today announced a joint collaboration with CVEDIA and Supermicro to bring smart city solutions to the embedded edge.

Key Points: 
  • SiMa.ai , the software centric, embedded edge machine learning system-on-chip company, today announced a joint collaboration with CVEDIA and Supermicro to bring smart city solutions to the embedded edge.
  • The companies will deliver a solution that combines CVEDIA’s AI Video analytics solutions with Supermicro’s (NASDAQ: SMCI) edge appliances, powered by SiMa.ai’s Machine Learning System on Chip (MLSoC) platform.
  • This partnership enables customers to deploy high-performance, scalable edge AI solutions for a broad range of market segments.
  • Local municipalities will be able to improve the performance and cost of their applications such as object detection, anomaly detection, vehicle classification, and line crossing at the edge.

VeriSilicon Showcased Its Latest Power-Efficient IP Applications at Embedded World 2024

Retrieved on: 
tisdag, april 9, 2024
Telecommunications, Electronic Design Automation, Artificial Intelligence, Data Management, Consumer Electronics, Technology, IOT (Internet of Things), Semiconductor, Dai, Consumer electronics, BLE, IPS, Speech, Machine learning, GM, DSP, Bluetooth Low Energy, GPU, Drone, Internet of things, ISP, GUI, Embedded, Internet, Image, Smart camera, Silicon, Embedded system, Electronics, Home automation, Data center, Digital signal, Automotive Electronics Council, IP, NPU, Perception, VPU, Smart device, GPGPU, Central processing unit, Artificial intelligence, Hall, Video game

VeriSilicon (688521.SH) today announced its demonstration at Embedded World 2024 in Nuremberg, Germany, booth numbered Hall 4A-518, where it is showcasing customers’ various leading products leveraging the company’s latest technologies and advanced solutions.

Key Points: 
  • VeriSilicon (688521.SH) today announced its demonstration at Embedded World 2024 in Nuremberg, Germany, booth numbered Hall 4A-518, where it is showcasing customers’ various leading products leveraging the company’s latest technologies and advanced solutions.
  • IoT: VeriSilicon’s LE Audio compliant complete Bluetooth Low Energy IP solution, LE Mesh system solution based on VeriSilicon’s BLE technology.
  • Among the top ten IP companies globally, VeriSilicon’s number of IP categories ranks top two2.
  • “We are thrilled to present our latest and innovative IP solutions at Embedded World 2024.

Everspin Technologies Unveils PERSYST, Simplifying Persistent Memory Solutions

Retrieved on: 
tisdag, april 9, 2024
Professional Services, Data Management, Security, Technology, Data Analytics, Hardware, Automation, Stand, Embedded, AI, MRAM, Robotics, STT-MRAM

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced today the new brand name PERSYST for its persistent memory product family.

Key Points: 
  • Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced today the new brand name PERSYST for its persistent memory product family.
  • Everspin’s initiative to simplify product identification beyond conventional alphanumeric identifiers promises to make selecting the right solutions easier for clients.
  • “Known for unparalleled persistence, durability, and performance our PERSYST products are used for critical applications where data security is essential,” said Sanjeev Aggarwal, president and CEO of Everspin Technologies.
  • Everspin also will collaborate with Synaptic Labs to showcase EMxxLX’s integration with the xSPI controller on an FPGA evaluation board.