A53

Macronix Non-Volatile Memory Solutions Showcase with Partners NXP, ST at embedded world 2024

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月曜日, 4月 8, 2024
NXP Semiconductors, Intelligence, Macronix, Internet of things, Internet, A53, NXP, STMicroelectronics, Fourth Industrial Revolution, NVM

NUREMBERG, Germany, April 7, 2024 /PRNewswire/ -- Macronix International Co., Ltd. (TSE: 2337), a leading integrated-device manufacturer of non-volatile memory (NVM) solutions, will have its versatile NVM solutions showcased at embedded world 2024 through its partnerships with industry leaders NXP Semiconductors (NXP) and STMicroelectronics (ST).

Key Points: 
  • NUREMBERG, Germany, April 7, 2024 /PRNewswire/ -- Macronix International Co., Ltd. (TSE: 2337), a leading integrated-device manufacturer of non-volatile memory (NVM) solutions, will have its versatile NVM solutions showcased at embedded world 2024 through its partnerships with industry leaders NXP Semiconductors (NXP) and STMicroelectronics (ST).
  • Macronix flash memory will be featured among NXP partners as the processor leader highlights its solutions in Internet of Things (IoT) and S32G Vehicle Network Processors, based on the Arm® Cortex® A53 architecture, in automotive applications.
  • Additionally, Macronix's MX66UW1G45G OctaFlash™ memory will play an integral role in ST's demonstrations of high-end graphics and graphical user interfaces, powered by the new STM32H7Sx/Rx high-performance microcontroller, and the new STM32MP2 microprocessor with neural processing unit targeted at Industry 4.0 and edge artificial intelligence applications.
  • Macronix NVM solutions exhibit with partners at embedded world 2024:

MaxLinear Launches Single Chip for 5G Open RAN Radio Units

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木曜日, 2月 22, 2024
Data Management, Semiconductor, Technology, Mobile, Wireless, 5G, Networks, Hardware, DFE, Intermodulation, Algorithm, Federal Communications Commission, Architecture, Macro, FCC, DSS, SRAM, MXL, 33-centimeter band, Silicon, NB, Original equipment manufacturer, RAN, Picocell, Digital, MIMO, PIM, DDC, CFR, Radio, Ball grid array, DUC, Multimedia, Mobile World Congress, 3GPP, A53, DDR, System, DRAM, SOC, Congress, Gallium nitride, Heart, RF, SCS, DPD, RX, Software, PIMC, CPU, Video game

MaxLinear, Inc. (Nasdaq: MXL), a leader in wireless infrastructure silicon solutions, today announced it has launched the MXL17xxx family of devices (“Sierra”), a highly integrated SoC optimized for 4G/5G Open Radio Access Network (RAN) radio units (RU).

Key Points: 
  • MaxLinear, Inc. (Nasdaq: MXL), a leader in wireless infrastructure silicon solutions, today announced it has launched the MXL17xxx family of devices (“Sierra”), a highly integrated SoC optimized for 4G/5G Open Radio Access Network (RAN) radio units (RU).
  • Designers can rapidly build new macro and picocell O-RUs using just a single Sierra device by adding an appropriate RF front end.
  • “Open RAN momentum continues to build and is set to account for 20 percent to 30 percent of worldwide RAN revenues by 2028,” said Stefan Pongratz, Vice President and Analyst at the Dell’Oro Group.
  • MaxLinear will be conducting briefings on MaxLinear’s radio solutions at Mobile World Congress – Hall 2, meeting rooms 2A54MR and 2A63MR – from February 26 through February 29, 2024.

MulticoreWare Showcases Contactless AI-based Access Control on TI’s AM62 Embedded Chipset Powered by HuBe.ai

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火曜日, 6月 21, 2022
Software, Artificial Intelligence, Data Management, Engineering, Technology, Automotive Manufacturing, Semiconductor, Manufacturing, Solution, Robotics, Medical imaging, Compiler, Human Behaviour, ARM, TI, Library, IOT, API, A53, Growth, Edge device, Global IP Solutions, SOC, National Engineering Services Pakistan, Radar, General manager, Lidar, Facial recognition system, GPS, Software, AI, IP, Assistant, Linux, IMU, MulticoreWare, Engineering, SDK, Video game console, Video, Surveillance, Defense

The demand for contactless AI-based access control systems has been rising for the last couple of years.

Key Points: 
  • The demand for contactless AI-based access control systems has been rising for the last couple of years.
  • As an early adopter, MulticoreWares HuBe.ai, optimized for Edge Devices, powers the AM62 chipset with advanced AI capabilities such as Face Detection & Recognition.
  • MulticoreWare has created an optimized ARM A53 based Linux Face Recognition software IP solution for TIs AM62 processor platform that takes full advantage of the SoCs compute power and performance.
  • MulticoreWare enables optimized AI solutions for TIs AM62x chipset with this showcase of HuBe.ai, optimized for Edge Devices, said Vinod Kannan, Assistant Vice President, Media & AI Analytics, MulticoreWare.

OMNIVISION Debuts OAX4600 AI-Enabled ASIC at AutoSens―Industry’s Most Robust Integrated ISP and NPU for Simultaneous DMS/OMS

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水曜日, 5月 4, 2022
Hardware, Automotive, Engineering, Technology, Automotive Manufacturing, General Automotive, Semiconductor, Manufacturing, A53, IMS, DDR, Original equipment manufacturer, DMS, NPU, ISP, BGA, Safety, NPU terminology, ASIL, Industry, DDR3, Mark (given name), TOPS, TERA, Solution, ASIC, Multimedia, Video game console, Medical device, Television

The OAX4600 is a next generation ASIC that uses OMNIVISIONs dedicated NPU with 2 tera operations per second (TOPS).

Key Points: 
  • The OAX4600 is a next generation ASIC that uses OMNIVISIONs dedicated NPU with 2 tera operations per second (TOPS).
  • The OAX4600 features 2Gb of embedded DDR stacked memory and utilizes the tri-ARM Cortex A53 with NEON core subsystem.
  • It uses OMNIVISIONs ISP processing technology and dedicated NPU to ensure robust, latency-free image processing, even in the case of RGB-IR.
  • OMNIVISION and the OMNIVISION logo are trademarks or registered trademarks of OMNIVISION.

Orbbec Announces Persee+ 3D Camera With Built-In Neural Network Processing

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月曜日, 4月 25, 2022
A53, SDK, Robotics, SOC, Amlogic, RGB, NPU, Software, GB, Linux, SD card, Machine learning, Artificial intelligence, World, Android, Computer, HDMI, Artificiality, 3D, ARM, AI, Integrated computational materials engineering, Learning, Wi-Fi, Bluetooth, RAM, Television, 3D printing, Video game console, Persée

TROY, Mich., April 25, 2022 /PRNewswire/ -- Orbbec, a leading global 3D camera provider, today announced the availability of its new Persee+, a 3D Camera Computer, bringing AI capability to the world's original 3D camera by adding onboard computing capability. Featuring a specialized hardware accelerator for artificial intelligence and machine learning applications, among many other improvements, the Persee+ helps researchers, engineers and hobbyists achieve a new level of advanced uses for 3D imaging.

Key Points: 
  • World's First 3D Camera with Integrated Computer is Now Upgraded to Provide Up to 10X Processing Power, Improved Imaging, Plus NPU for Artificial Intelligence/Deep Learning
    TROY, Mich., April 25, 2022 /PRNewswire/ -- Orbbec , a leading global 3D camera provider, today announced the availability of its new Persee+, a 3D Camera Computer, bringing AI capability to the world's original 3D camera by adding onboard computing capability.
  • Other improvements in the Persee+ include the higher 3D imaging capability of the company's Astra+ structured light camera, with an RGB resolution up to 1920 x 1080 pixels @30fps.
  • The Persee+ is the first 3D camera computer to respond with an onboard neural processing capability," said David Chen, co-founder and chief technology officer of Orbbec.
  • Orbbec designs and manufactures state-of-the-art 3D cameras and the world's most advanced 3D camera-computer, Orbbec Persee+.

SolidRun's SOM Based On TI's AM64x Processor Fast Tracks Industrial IoT, Robotics and Mission Critical Communications Hardware Development

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火曜日, 12月 7, 2021
Cortex, ECC, TI, Profinet, Radio, ARM Cortex-M, SOM, CAN, Automation, HVAC, Single-board computer, Family, ARM, SBC, MCU, PCI Express, ADC, EtherCAT, Time-Sensitive Networking, A53, CEO, EtherNet/IP, SBCS, UART, SOM (missile), SOC, Original equipment manufacturer, TEL, Texas Instruments, MultiMediaCard, PRU, ARM Cortex-A53, TSN, IOT, DDR4, Solution, USB, Single-board, Communication, Video game console, Internet service provider

Featuring best-in-class real-time and low-latency processing, this new SOM targets industrial IoT and industrial machinery applications.

Key Points: 
  • Featuring best-in-class real-time and low-latency processing, this new SOM targets industrial IoT and industrial machinery applications.
  • Measuring in at just 47 x 30mm in size, these SOMs pack far more than the AM64x processor.
  • SolidRun also offers Hummingboard-T AM64X Base and Hummingboard-T AM64X Pro carrier boards that are perfect for prototyping with the AM64X processor SOM.
  • With a mission to simplify application development while overcoming deployment challenges, SolidRun proudly provides customers faster time-to-market and lower costs.

Faraday Announces the Success of Its ARM-based SoCs in Wide Ranging Applications

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火曜日, 9月 28, 2021
Software, Technology, Networks, Internet, Cortex, Technology, TWSE, ISO, Projector, USB, List of ARM microarchitectures, Serial ATA, ASIC, In Loving Memory (compilation album), PCI Express, Multi-function printer, CM7, MIPI, LinkedIn, A53, IP, Sales (accounting), SerDes, IOT, MCU, Risk, Central processing unit, CPU, Silicon, ARM, History, CM4, Time, COO, Faraday Technology, Video game console

Faraday has an extensive history of success with a wide range of CPU for design service and has become expert in CPU core hardening optimized to meet specific customer expectations.

Key Points: 
  • Faraday has an extensive history of success with a wide range of CPU for design service and has become expert in CPU core hardening optimized to meet specific customer expectations.
  • Faraday provides expertise in value-added CPU Sub-system service to achieve each customers SoC configuration and performance requirements, said Flash Lin, COO of Faraday Technology.
  • Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certified to ISO 9001 and ISO 26262.
  • Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China.