SDIO

GigaDevice Launches GD32F5 Series Cortex®-M33 Core MCUs for High-Performance Applications

Retrieved on: 
Dienstag, April 9, 2024
ECC, GD32, GigaDevice, RWW, SRAM, DSP, OTA, SDRAM, IAR, IEC61508, Communication, SDIO, PLC, GUI, MCU, Software, Power management, OTG, Spacecraft, PWM, Update, Flash, Programmable logic controller, Sensor, Ecosystem, The, Automotive engineering, FMEDA, KEIL, Video game

The GD32F5 series high-performance MCUs offer significantly expanded storage space, excellent processing efficiency, and a wide array of interface options.

Key Points: 
  • The GD32F5 series high-performance MCUs offer significantly expanded storage space, excellent processing efficiency, and a wide array of interface options.
  • The GD32F5 series high-performance MCUs adopt the Arm® Cortex® -M33 core with a maximum operating frequency of 200MHz and a working performance of up to 3.31 CoreMark®/MHz.
  • The GD32F5 series high-performance MCUs are equipped with up to 7.5MB on-chip Flash and 1MB SRAM.
  • GigaDevice provides the new high-performance GD32F5 series MCU with free development environment GD32 IDE, debugging and download tool GD-LINK, and the programming tool GD32 All-In-One Programmer.

Revolutionizing Connectivity: Ezurio introduces wide portfolio of new Wireless and System on Modules product ranges in collaboration with Texas Instruments

Retrieved on: 
Dienstag, April 9, 2024
TI, SDIO, Original equipment manufacturer, Wi-Fi, Internet of things, UART, Software, Bluetooth Low Energy, Texas Instruments, SMT, Semiconductor, SOM, Silicon, Mobile phone

AKRON, Ohio, April 9, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces new product portfolios leveraging embedded processing products from Texas Instruments (TI), the global semiconductor leader known for its design, manufacture and test of analog and embedded semiconductors that are the essential building blocks of electronic systems.

Key Points: 
  • Ezurio will introduce its first new TI based product range the Sona™ TI351 family, which is a Wi-Fi 6 & Bluetooth 5.4 wireless module offering based on TI's SimpleLink™ CC33x1 Wi-Fi portfolio.
  • This solution becomes a key wireless enabler to Ezurio's next portfolio of System-on-Modules (SOM) – the Carbon series.
  • Additionally, this SOM line incorporates TI analog and power components, showcasing a synergy of Ezurio design and development capabilities and TI Semiconductors resources.
  • The close collaboration with TI will offer next-generation solutions that not only enhance connectivity and performance but also significantly simplify the development process for OEMs and product innovators.

Ezurio Announces the Sona™ MT320: The First Industrial Grade Wi-Fi 6 + Bluetooth Module Powered by MediaTek Filogic 320 Technology

Retrieved on: 
Donnerstag, April 4, 2024
Sona, OS, FCC, Certification, MediaTek, CE, Bed, SDIO, Wi-Fi, Partnership, Internet of things, Tungsten, UKCA, Linux, SMARC, SMT, Wi-Fi 6, WPA3, HD, Pump, Bluetooth Special Interest Group, Bluetooth, Mobile phone

AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.

Key Points: 
  • AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.
  • The Sona MT320 is the first industrial grade Wi-Fi + Bluetooth module based on the segment leading MediaTek Filogic 320 (MT7921) Wi-Fi 6 chipset.
  • This embedded module series has been designed to work seamlessly with the MediaTek Genio processor family targeted at the industrial IoT sector.
  • The Sona MT320 provides a rugged, compact, and globally certified solution that ensures reliable connectivity and easy integration.

Telit Cinterion and Alif Semiconductor Unveil the Vision AppKit: A Postage Stamp-Sized, Intelligent Connected Camera Platform

Retrieved on: 
Dienstag, Januar 9, 2024
Entrepreneurship, UART, Face, The Palazzo, LTE-M, AI, Communication, PSM, MCU, Vision, Ultra, Wi-Fi, CES, SPI, Discontinuous reception, Bluetooth Low Energy, Palace, Logic, SDIO

Alif's E3 Series MCU — known for its EdgeAI capabilities in battery-operated IoT devices — powers this groundbreaking design.

Key Points: 
  • Alif's E3 Series MCU — known for its EdgeAI capabilities in battery-operated IoT devices — powers this groundbreaking design.
  • Telit Cinterion supports communication in the Vision AppKit with the ME310 LTE Cat-M and WE310 Wi-Fi and Bluetooth Low Energy 5.0 modules.
  • "The Vision AppKit AI camera reference design incorporates highly efficient processing capability to deliver small form factor camera solutions for object detection and image classification in a secure way," said Reza Kazerounian, Co-Founder and President at Alif Semiconductor.
  • For more information and to see a demo of the Vision AppKit in action at CES 2024, visit Alif Semiconductor's suite at The Palazzo and Telit Cinterion's booth #10662.

Laird Connectivity Brings Wi-Fi 6/6E to Their Extensive Portfolio of Wi-Fi Modules with the New Sona™ IF573 Product Line

Retrieved on: 
Donnerstag, Juni 8, 2023
HD, CE, Partnership, Wi-Fi, MIC, FCC, Bed, Internet of things, Pump, RCM, PCIE, BT, Wireless, Sona College of Technology, SMT, SDIO, Linux, Bluetooth Special Interest Group, Sona, ISED, Partner, Amplifier, Infineon Technologies, LNA, Radio, Silicon, WPA3, AI, Mobile phone

AKRON, Ohio, June 8, 2023 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology and Premium Partner for Infineon Technologies, today announces the upcoming Sona™ IF573 Wi-Fi 6/6E family of modules to their extensive portfolio of Wi-Fi solutions. Powered by Infineon Technologies' leading AIROC™ CYW55573 chipset, the Sona IF573 is a truly robust industrial IoT module that is rugged, small, globally certified, has reliable connectivity, and is easy to integrate. 

Key Points: 
  • The Sona IF573 delivers a fully featured Wi-Fi 6E radio, answering the call for next-generation wireless IoT.
  • "Adding the Sona IF573 to our Wi-Fi portfolio demonstrates Laird Connectivity's commitment to providing the latest technology and wireless capabilities to our customer base," said Andrew Ross, Senior Product Manager, Laird Connectivity.
  • "Infineon is pleased to build on its strategic partnership with our Premium Partner, Laird Connectivity," said Sivaram Trikutam, Vice President of Wi-Fi Product Line, Infineon Technologies.
  • For more information about the Sona IF573, visit: www.lairdconnect.com/sona-if573-series
    To learn more about Laird Connectivity, visit: www.lairdconnect.com

Quectel Launches Wi-Fi HaLow Module to Address Extensive Indoor and Outdoor IoT Applications

Retrieved on: 
Mittwoch, März 15, 2023
Telecommunications, Satellite, Networks, Batteries, Hardware, Technology, IOT (Internet of Things), Mobile, Wireless, Radius, Multimedia, SPI, Data-rate units, IEEE, Embedded, IEEE 802.11n-2009, PWM, Internet of things, CSO, IEEE 802.11ah, SDIO, OTA, UART, WPA3, Wi-Fi 6, IEEE 802.11ac-2013, Engineering, Wi-Fi, AES, Mobile phone, Internet service provider

Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of its FGH100M Wi-Fi HaLow module, providing long range data transmission, low power consumption, less complexity as well as improved penetration through walls and other obstructions for a wide range of IoT applications.

Key Points: 
  • Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of its FGH100M Wi-Fi HaLow module, providing long range data transmission, low power consumption, less complexity as well as improved penetration through walls and other obstructions for a wide range of IoT applications.
  • View the full release here: https://www.businesswire.com/news/home/20230315005141/en/
    Quectel launches Wi-Fi HaLow module to address extensive indoor and outdoor IoT applications (Photo: Business Wire)
    Adopting IEEE 802.11ah wireless networking protocol, also known as Wi-Fi HaLow, operating in the license-exempt Sub-1 GHz range, the FGH100M module meets the unique requirements of the Internet of Things (IoT) with its Sub-1 GHz signal coverage, allowing users to control IoT devices in one kilometer radius.
  • “Integrating the game-changing Wi-Fi HaLow technology, our FGH100M module will deliver long range and robust Wi-Fi connections without having to sacrifice simplicity and efficiency,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • To learn more about Quectel’s FGH100M, please visit Quectel at Embedded World 2023 , Hall 3, Booth 318.

Quectel Launches Automotive Grade 5G NR Release 16 Modules to Support Autonomous Driving

Retrieved on: 
Mittwoch, Januar 4, 2023
Automotive, Technology, IOT (Internet of Things), Semiconductor, Autonomous Driving, Vehicles, Vehicle Technology, Telecommunications, Networks, Internet, Mobile, Wireless, Hardware, WCDMA, GSM, SGMII, Tier, Communication, ECDSA, IATF, MIMO, LGA, USB, Ethernet, GNSS, PCI Express, CES, Temperature, SIM, Multimedia, SA, DSDS, Engineering, PCM, LTE, RGMII, I2S, PPE, SPI, ADC, Safety, OEM, IOT, 3GPP, Qualcomm, SDIO, AEC, UART, NSA, Satellite navigation device, Global Sales Law Project

CES, Quectel Wireless Solutions, a global IoT and automotive solutions provider, today announces its new automotive grade 5G NR modules, the AG59x series .

Key Points: 
  • CES, Quectel Wireless Solutions, a global IoT and automotive solutions provider, today announces its new automotive grade 5G NR modules, the AG59x series .
  • Similar to Quectel’s other automotive products, the AG59x modules comply with the international IATF 16949:2016 automotive quality management system to address the demanding requirements of automotive devices.
  • “We are very excited to bring the highly anticipated 5G NR Release 16 module to global automotive markets.
  • Its significant improvements in latency and ultra-reliability are critical in supporting autonomous driving,” said Manfred Lindacher, Vice President of Global Sales, Automotive International, Quectel Wireless Solutions.

Quectel Announces Extended Wi-Fi 6 and Wi-Fi 6E Module Portfolio to Address Smart Home and Commercial Applications

Retrieved on: 
Donnerstag, November 24, 2022
IOT (Internet of Things), Technology, Software, Networks, Internet, Hardware, IEEE 802.11n-2009, Television, IEEE 802.11ax-2021, Bluetooth, Data-rate units, FR4, Temperature, SDIO, DBS, CSO, FPC, POS, GNSS, Acquisition, Health, School, IEEE 802.11ac-2013, IOT, MIMO, WLAN, Multimedia, VR, Real, MCU, Safety, Internet service provider, Mobile phone, Telescope, Wi-Fi

Quectel Wireless Solutions, a global IoT solutions provider, today announces its expanded Wi-Fi module portfolio with the launch of the FC6xE series of Wi-Fi/Bluetooth modules, based on Qualcomms QCA206x Wi-Fi 6E chip.

Key Points: 
  • Quectel Wireless Solutions, a global IoT solutions provider, today announces its expanded Wi-Fi module portfolio with the launch of the FC6xE series of Wi-Fi/Bluetooth modules, based on Qualcomms QCA206x Wi-Fi 6E chip.
  • Designed to deliver faster, more secure, and more robust Wi-Fi experiences than ever before, the FC6xE also features Bluetooth audio functionality.
  • View the full release here: https://www.businesswire.com/news/home/20221113005138/en/
    Quectel announces extended Wi-Fi 6/6E module portfolio to address home and commercial environments (Photo: Business Wire)
    Supporting 2 2 MIMO and DBS, the FC6xE family provides a maximum data rate up to 3000 Mbps.
  • The modules join an already extensive range of Wi-Fi/Bluetooth modules delivering functionality across Wi-Fi 4, Wi-Fi 5, Wi-Fi 6, and Wi-Fi 6E.

Arasan Partners with Testmetrix on its 4.5 GSPS C-PHY / D-PHY HDK and Compliance Test Platform

Retrieved on: 
Dienstag, Oktober 18, 2022
Adoption, SAN, Host, HDK, IOT, MMC, Demo, ASIC, DSI, Total, Smartphone, Acceleration, UFS, Solution, Silicon, Original equipment manufacturer, CF, SD, Partnership, PHY, Compliance, SDIO, DFE, CEO, Ecosystem, IP, MIPI Alliance, Global IP Solutions, Combo, MIPI, UFS 2.1, CTO, Mobile phone, Cable television

SAN JOSE, Calif., Oct. 18, 2022 /PRNewswire/ -- Arasan Chip Systems is proud to announce the immediate availability of the Testmetrix C-PHY v2.0 / D-PHY v2.5 Combo HDK and Compliance Test Platform supporting speeds in excess of 4.5gsps built using Arasan's Total MIPI IP Solutions including C-PHY / D-PHY Combo IP cores. The C-PHY / D-PHY Combo IP is implemented in silicon on a TSMC Foundry FINFET Test Chip and forms the backbone of the Testmetrix HDK and Compliance Test Platform.

Key Points: 
  • The C-PHY / D-PHY Combo IP is implemented in silicon on a TSMC Foundry FINFET Test Chip and forms the backbone of the Testmetrix HDK and Compliance Test Platform.
  • Testmetrix will demonstrate its HDK in Arasan's booth during the Demo Day event at the MIPI Member Meeting this week in Vancouver, British Columbia.
  • "We are happy to see this HDK and Compliance Test Platform from Testmetrix based on Arasan's ASIC, which will support compliance efforts within the MIPI ecosystem and help further accelerate the adoption of MIPI specifications."
  • "Arasan is extremely proud of the launch of the Testmetrix HDK and Compliance Test Platform using Arasan's C/D-PHY Combo ASIC.

Arasan Partners with Testmetrix on its 4.5 GSPS C-PHY / D-PHY HDK and Compliance Test Platform

Retrieved on: 
Dienstag, Oktober 18, 2022
Adoption, SAN, Host, HDK, IOT, MMC, Demo, ASIC, DSI, Total, Smartphone, Acceleration, UFS, Solution, Silicon, Original equipment manufacturer, CF, SD, Partnership, PHY, Compliance, SDIO, DFE, CEO, Ecosystem, IP, MIPI Alliance, Global IP Solutions, Combo, MIPI, UFS 2.1, CTO, Mobile phone, Cable television

SAN JOSE, Calif., Oct. 18, 2022 /PRNewswire/ -- Arasan Chip Systems is proud to announce the immediate availability of the Testmetrix C-PHY v2.0 / D-PHY v2.5 Combo HDK and Compliance Test Platform supporting speeds in excess of 4.5gsps built using Arasan's Total MIPI IP Solutions including C-PHY / D-PHY Combo IP cores. The C-PHY / D-PHY Combo IP is implemented in silicon on a TSMC Foundry FINFET Test Chip and forms the backbone of the Testmetrix HDK and Compliance Test Platform.

Key Points: 
  • The C-PHY / D-PHY Combo IP is implemented in silicon on a TSMC Foundry FINFET Test Chip and forms the backbone of the Testmetrix HDK and Compliance Test Platform.
  • Testmetrix will demonstrate its HDK in Arasan's booth during the Demo Day event at the MIPI Member Meeting this week in Vancouver, British Columbia.
  • "We are happy to see this HDK and Compliance Test Platform from Testmetrix based on Arasan's ASIC, which will support compliance efforts within the MIPI ecosystem and help further accelerate the adoption of MIPI specifications."
  • "Arasan is extremely proud of the launch of the Testmetrix HDK and Compliance Test Platform using Arasan's C/D-PHY Combo ASIC.