SMT

Revolutionizing Connectivity: Ezurio introduces wide portfolio of new Wireless and System on Modules product ranges in collaboration with Texas Instruments

Retrieved on: 
Dienstag, April 9, 2024
TI, SDIO, Original equipment manufacturer, Wi-Fi, Internet of things, UART, Software, Bluetooth Low Energy, Texas Instruments, SMT, Semiconductor, SOM, Silicon, Mobile phone

AKRON, Ohio, April 9, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces new product portfolios leveraging embedded processing products from Texas Instruments (TI), the global semiconductor leader known for its design, manufacture and test of analog and embedded semiconductors that are the essential building blocks of electronic systems.

Key Points: 
  • Ezurio will introduce its first new TI based product range the Sona™ TI351 family, which is a Wi-Fi 6 & Bluetooth 5.4 wireless module offering based on TI's SimpleLink™ CC33x1 Wi-Fi portfolio.
  • This solution becomes a key wireless enabler to Ezurio's next portfolio of System-on-Modules (SOM) – the Carbon series.
  • Additionally, this SOM line incorporates TI analog and power components, showcasing a synergy of Ezurio design and development capabilities and TI Semiconductors resources.
  • The close collaboration with TI will offer next-generation solutions that not only enhance connectivity and performance but also significantly simplify the development process for OEMs and product innovators.

Sierra Metals Announces Intention to List on the Lima Stock Exchange

Retrieved on: 
Donnerstag, April 4, 2024
Mining, Minerals, Natural Resources, Lima Stock Exchange, TSX, SMT, BVL

Sierra Metals Inc. (TSX: SMT | OTCQX: SMTSF) (“Sierra Metals” or the “Company”) announces that the Company will commence a process to obtain a secondary listing of common shares on the Bolsa de Valores de Lima ("BVL" or the “Lima Stock Exchange”).

Key Points: 
  • Sierra Metals Inc. (TSX: SMT | OTCQX: SMTSF) (“Sierra Metals” or the “Company”) announces that the Company will commence a process to obtain a secondary listing of common shares on the Bolsa de Valores de Lima ("BVL" or the “Lima Stock Exchange”).
  • The process is expected to take up to four months to complete.
  • Ernesto Balarezo, CEO of Sierra Metals, commented, “The BVL is part of the Latin American Integrated Market (MILA) which is an agreement among the Chilean, Colombian, Mexican, and Peruvian stock exchanges.
  • Our potential listing on the BVL should increase Sierra’s potential investor exposure and market liquidity, giving access to participate in the Company’s growth plans to Latin American funds, institutions, retail investors, and Peruvian pension funds, that have estimated assets under management of over US$50 billion, of which 50% must be invested in Peru.”

Hyve Solutions Showcases Next-Generation AI Lifecycle Solutions at NVIDIA GTC AI Conference

Retrieved on: 
Montag, März 18, 2024
Hardware, Electronic Design Automation, Security, Data Management, Satellite, Manufacturing, Photography, Technology, Nanotechnology, Audio, Video, Artificial Intelligence, Other Technology, Machinery, Networks, Internet, Mobile, Wireless, Sales, ODM, AI, Computing, SMT, Booth, San Jose Convention Center, NVIDIA, Synnex

Hyve Solutions Corporation , a wholly owned subsidiary of TD SYNNEX Corporation (NYSE: SNX) and a leading provider of hyperscale digital infrastructures, is showcasing at the NVIDIA GTC AI conference this week an array of products tailored for the entire AI lifecycle and catering to the demands of AI datacenters, hybrid cloud, and edge deployments.

Key Points: 
  • Hyve Solutions Corporation , a wholly owned subsidiary of TD SYNNEX Corporation (NYSE: SNX) and a leading provider of hyperscale digital infrastructures, is showcasing at the NVIDIA GTC AI conference this week an array of products tailored for the entire AI lifecycle and catering to the demands of AI datacenters, hybrid cloud, and edge deployments.
  • Hyve’s offerings underscore its dedication to the design and deployment of advancements in AI and underscore its collaborations with industry leaders such as NVIDIA.
  • “Our commitment to technology leadership, coupled with our innovative building block strategy, uniquely positions us to meet the evolving AI needs of our customers,” said Steve Ichinaga, President, Hyve Solutions.
  • Explore Hyve’s innovative solutions firsthand at Booth 1129 during the 2024 NVIDIA GTC AI conference running March 18-21 at the San Jose Convention Center, located in San Jose, California.

Ezurio Announces the Sona™ MT320: The First Industrial Grade Wi-Fi 6 + Bluetooth Module Powered by MediaTek Filogic 320 Technology

Retrieved on: 
Donnerstag, April 4, 2024
Sona, OS, FCC, Certification, MediaTek, CE, Bed, SDIO, Wi-Fi, Partnership, Internet of things, Tungsten, UKCA, Linux, SMARC, SMT, Wi-Fi 6, WPA3, HD, Pump, Bluetooth Special Interest Group, Bluetooth, Mobile phone

AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.

Key Points: 
  • AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.
  • The Sona MT320 is the first industrial grade Wi-Fi + Bluetooth module based on the segment leading MediaTek Filogic 320 (MT7921) Wi-Fi 6 chipset.
  • This embedded module series has been designed to work seamlessly with the MediaTek Genio processor family targeted at the industrial IoT sector.
  • The Sona MT320 provides a rugged, compact, and globally certified solution that ensures reliable connectivity and easy integration.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Montag, März 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
Montag, März 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Delta Thailand Opens Its New Delta Plant 8 and R&D Center for EV Production and Innovation

Retrieved on: 
Freitag, März 22, 2024
CDP, Delta Electronics, EV, Dow Jones, Growth, PWBA, PCL, Environment, BOI, Component, Electronics, Investment, SMT, Instrument, Traction, Ministry

BANGKOK, March 22, 2024 /PRNewswire/ -- Delta Electronics (Thailand) PCL., a subsidiary of Delta Group, today inaugurated its new Delta Plant 8 and R&D Center at Bangpoo Industrial Estate, Thailand, to facilitate Delta's expansion of production and development of electric vehicle (EV) power electronics products for global customers.

Key Points: 
  • BANGKOK, March 22, 2024 /PRNewswire/ -- Delta Electronics (Thailand) PCL., a subsidiary of Delta Group, today inaugurated its new Delta Plant 8 and R&D Center at Bangpoo Industrial Estate, Thailand, to facilitate Delta's expansion of production and development of electric vehicle (EV) power electronics products for global customers.
  • Delta management from headquarters along with key industry partners and media also attended the grand opening and explored the advanced production lines.
  • Mr. Victor Cheng, Delta Thailand CEO, said, "Today is a milestone in Delta's 35 years of development in Thailand.
  • Since 2010, Delta Thailand has produced EV power electronics products for global customers at Delta Plant 1 with a floor space of 25,000 square meters.

Omron to Showcase Cutting-Edge Inspection and Factory Automation Solutions at IPC APEX EXPO 2024

Retrieved on: 
Donnerstag, März 14, 2024
Automation, EV, Learning, Electronics, Omron, Traceability, SMT, IPC

HOFFMAN ESTATES, Ill., March 14, 2024 /PRNewswire/ -- OMRON Automation Americas, a global leader in industrial automation solutions will be exhibiting at IPC APEX 2024, taking place at the Anaheim Convention Center from April 9th to April 11th. Attendees are invited to visit Omron's booth #2647 to hear how AI powers Omron's latest technology, in addition to learning more about our newest X-Ray inspection machine, the VT-X850. This new 3D CT X-Ray inspection system is designed specifically for electric vehicle (EV) surface mount technology (SMT) manufacturing lines.

Key Points: 
  • Explore Omron's advanced technology in 3D inspection machines at IPC APEX EXPO 2024 offering speed, reliability, and accuracy for various industries.
  • HOFFMAN ESTATES, Ill., March 14, 2024 /PRNewswire/ -- OMRON Automation Americas, a global leader in industrial automation solutions will be exhibiting at IPC APEX 2024, taking place at the Anaheim Convention Center from April 9th to April 11th.
  • "We are excited to showcase our cutting-edge inspection solutions at IPC APEX EXPO 2024," said Brad Ward, Technical Manager - Traceability & Inspection Solutions at Omron.
  • To learn more about IPC APEX EXPO 2024, please visit here.

EQS-News: SMT Scharf AG announces preliminary 2023 results 

Retrieved on: 
Mittwoch, März 13, 2024
CFO, Spare Parts, Mining, Transport, Platinum, Growth, Metal, Gold, SMT, WKN, Hamm, Rail transport

Significant growth in After-Sales business, but New Equipment business down

Key Points: 
  • Significant growth in After-Sales business, but New Equipment business down
    Hamm, February 28, 2024 – SMT Scharf AG (WKN 575198, ISIN DE000A3DRAE2), one of the world’s leading suppliers of customised transport solutions and logistics systems for underground mining, reports revenue of EUR 73.2 million for the 2023 fiscal year, on the basis of preliminary results (2022: EUR 93.7 million).
  • The operating profit (EBIT) for the 2023 fiscal year amounts to EUR 3.6 million, on the basis of preliminary figures (2022: EUR 14.3 million).
  • As Volker Weiss, CFO of SMT Scharf AG, commented: “In the fourth quarter, we continued with our sales activities in our core markets worldwide.
  • Overall, the SMT Scharf Group is active with subsidiaries in seven countries, as well as commercial agencies worldwide.

EQS-News: Yankuang Energy Group becomes new strategic core shareholder of SMT Scharf AG

Retrieved on: 
Mittwoch, März 13, 2024
CFO, Acquisition, Coal mining, Mining, Transport, Platinum, Government, EUR, Metal, Gold, Regulated market, SMT, WKN, Hamm, Frankfurt Stock Exchange

52.66% of SMT Scharf AG by Yankuang Energy Group Company Limited, at a price of EUR 11.10 per share.

Key Points: 
  • 52.66% of SMT Scharf AG by Yankuang Energy Group Company Limited, at a price of EUR 11.10 per share.
  • The Managing and Supervisory Boards of SMT Scharf AG welcome the fact that Yankuang, as a strategic investor, intends to acquire a majority interest in SMT Scharf AG.
  • As Volker Weiss, CFO of SMT Scharf AG, commented: "We aim to maintain a close and regular dialogue with our new core shareholder in order to successfully further develop and advance SMT Scharf Group's business activities.
  • Yankuang Energy Group Company Limited focuses on the sectors of mining, high-end chemicals and new materials, new energy, high-end equipment manufacturing and intelligent logistics.