UFS 4.0

KIOXIA Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on: 
星期二, 四月 23, 2024
Electronic Design Automation, Data Management, Semiconductor, Technology, Mobile, Wireless, 5G, Hardware, App Store (iOS/iPadOS), JEDEC, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Engineered wood

KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.

Key Points: 
  • KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.
  • 4.0 embedded flash memory devices.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC standard package.
  • Maitry Dholakia, vice president, Memory Business Unit, for KIOXIA America, Inc. emphasized the company's ongoing leadership in UFS technology, stating, "The newest generation of our UFS 4.0 devices is a testament to our commitment to continually push performance boundaries – and make an improved user experience a reality."

Kioxia Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on: 
星期二, 四月 23, 2024
Semiconductor, Technology, Manufacturing, Mobile, Wireless, Other Manufacturing, Hardware, Sale, MIPI M-PHY, Corporation, Personal computer, Universal Flash Storage, UniPro, Toshiba, MIPI, App Store (iOS/iPadOS), Solid-state drive, JEDEC, Memory, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Computer data storage

Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.

Key Points: 
  • Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.
  • 4.0 embedded flash memory devices (Graphic: Business Wire)
    The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • (2) Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

Global and China Automotive Memory Chip and Storage Industry Report 2024 Featuring 8 Global Chip Vendors and 20 Chinese Vendors - ResearchAndMarkets.com

Retrieved on: 
星期二, 三月 19, 2024
Technology, Vehicle Technology, Hardware, Automotive, Cloud, Socs, Flash memory, GPU, SerDes, LPDDR3, DDR5, BMS, ASP, JEDEC, Personal computer, EDR, PCB, FSD, NXP, PHY, UFS, HBM, SRAM, FRAM, Universal Flash Storage, BGA, DDR4, Electronics, LPDDR5, PCI Express, Memory, DDR, GDDR6, European, SK Hynix, EEPROM, NVM Express, Research, AI, CXL, IVI, Samsung, Compute Express Link, Cloud computing, Rambus, Micrometre, Intel, SOC, SSD, DRAM, MRAM, UFS 4.0, CPU, FPGA, IPS, TSMC, Video game

The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving.
  • Currently, among Tesla's automotive memory chips, the 2nd-generation FSD has the highest bandwidth ranging from 448Gb/s to 1008GB/s.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
星期五, 三月 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Micron Collaborates with Samsung on Galaxy S24 Series to Unlock the Era of Mobile AI Experiences

Retrieved on: 
星期二, 二月 27, 2024
UFS 4.0, LPDDR5X, Artificial intelligence, AI, Mobile, Intelligence, S24, Samsung, Communication, Translation, Mobile World Congress, Universal Flash Storage, Memory, Micron Technology, Creativity, Galaxy, Congress, Micrometre, UFS, Mobile phone

The Galaxy S24 series is underpinned by Samsung’s suite of generative AI tools, Galaxy AI, which helps amplify experiences from enabling barrier-free communication to maximizing creative freedom.

Key Points: 
  • The Galaxy S24 series is underpinned by Samsung’s suite of generative AI tools, Galaxy AI, which helps amplify experiences from enabling barrier-free communication to maximizing creative freedom.
  • Select Samsung Galaxy S24 devices across the S24 Ultra, S24+ and S24 models are shipping with LPDDR5X and UFS 4.0 — the most recent innovations in Micron’s robust mobile portfolio.
  • “Micron’s advanced portfolio of memory and storage solutions were selected to power the innovative Galaxy AI capabilities Samsung is pioneering in the new Galaxy S24 series,” said Mark Montierth, corporate vice president and general manager of Micron’s Mobile Business Unit.
  • “Galaxy AI is leading the way into a new era that will forever change how mobile devices empower users.

Micron Delivers the World’s Most Compact UFS Package to Enable Next-Generation Phone Designs and Larger Batteries

Retrieved on: 
星期二, 二月 27, 2024
UFS 4.0, Data-rate units, OBR, AI, Compact, Original equipment manufacturer, HPM, TB, Feedback, Mobile World Congress, Universal Flash Storage, Micron Technology, Smartphone, Creativity, Micrometre, UFS, Running, Mobile phone

Large language models in generative AI applications can be loaded 40% faster2, resulting in a smoother experience when initializing conversations with AI digital companions.

Key Points: 
  • Large language models in generative AI applications can be loaded 40% faster2, resulting in a smoother experience when initializing conversations with AI digital companions.
  • “Micron’s latest UFS 4.0 solution enables world-class storage performance and reduced power in the world’s smallest UFS package,” said Mark Montierth, general manager and corporate vice president of Micron’s Mobile Business Unit.
  • Zoned UFS (ZUFS): Micron UFS 4.0 now allows the host to specify different zones where data can be stored, improving the usefulness of the device over time.
  • Micron is now shipping samples of its upgraded UFS 4.0 in capacities of 256 gigabytes (GB), 512GB and 1TB.

DreamSmart Group launched open AI terminal MEIZU 21 PRO and other new products, fully embracing AI

Retrieved on: 
星期一, 三月 4, 2024
Titan, RMB, TB, Human, History, UFS, Car, Software, Black Friday, Apple Watch, Glass, Ultra Black, Ecosystem, Portrait, Qualcomm, Huawei, OpenAI, Water, LPDDR5X, Multimedia, API, IP68, Image, System, Head, Smartphone, MP3, UFS 4.0, Human voice, Intelligence, R & D, IOS, MEIZU, Customer service

MEIZU 21 PRO is a futuristic device crafted for the AI era, incorporating the pinnacle of design, interaction, and craftsmanship of classic smartphones, embracing the AI era.

Key Points: 
  • MEIZU 21 PRO is a futuristic device crafted for the AI era, incorporating the pinnacle of design, interaction, and craftsmanship of classic smartphones, embracing the AI era.
  • Based on the powerful AI capabilities of the FlymeOS operating system, MEIZU 21 Pro has rich new AI features including the AI Portal, AI-Assisted Input, AI Gallery and AI Voice, refreshing user experience, making itself standing out among AI terminals.
  • MEIZU 21 PRO uses a 2K+ colourful display on the front, whose colours are super delicate and rich.
  • The MEIZU brand under DreamSmart Group has enjoyed a history of 21 years and boasts over 30 million MEIZU fans.

KIOXIA Introduces Industry’s First UFS Ver. 4.0 Embedded Flash Memory Devices for Automotive Applications

Retrieved on: 
星期一, 一月 29, 2024
Vehicle Technology, Data Management, Consumer Electronics, Automotive, Technology, Software, Sequence, UFS 4.0, BICS, UniPro, UFS 3.1, Temperature, Multimedia, Memory, ADAS, MIPI M-PHY, JEDEC, MIPI, Internet of things

4.0 embedded flash memory devices3 designed for automotive applications.

Key Points: 
  • 4.0 embedded flash memory devices3 designed for automotive applications.
  • These new, higher performing devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation automotive applications, including telematics, infotainment systems and ADAS4.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • “KIOXIA continues to demonstrate its leadership in UFS memory with the introduction of the industry’s first UFS Ver.

Pixelworks X7 Gen 2 Visual Processor Makes Debut in OnePlus Ace 3 Smartphone

Retrieved on: 
星期四, 一月 4, 2024
Moonlight, OnePlus, HESR, UFS 4.0, High frame rate, Partnership, LPDDR5X, Crystal, 3D LUT, Call, Deep learning, UFS, Pixelworks, Certification, RAM, Architecture, AI, GPU, 3D, Temperature, PXLW, Smartphone, Distribution, Calibration, Qualcomm, Google Images, Video game

SHANGHAI, Jan. 4, 2024 /PRNewswire/ -- Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of visual processing solutions, today announced the newly launched OnePlus Ace 3 smartphone incorporates the Pixelworks X7 Gen 2 visual processor. With the adoption of neural network algorithms, the visual processor's AI-based distributed computing architecture delivers highly immersive gaming experiences featuring both 120fps and 1.5K super resolution with low power consumption. Also, the first to integrate Pixelworks' AI-based High Efficiency Super-Resolution (HESR) technology, which was developed on the Company's dedicated neural network, the X7 Gen 2 visual processor scales resolution through deep learning techniques to achieve natural and clear picture quality. This contributes to game characters featuring smoother lines and richer details, increasing the perceived realism of games. Additionally, Pixelworks also offers dedicated performance and image quality tuning services for individual mobile games that are specifically tailored to content characteristics from the game creators' perspective, allowing end users to realize the smoothest, high frame rate and end-to-end IRX gaming experience.

Key Points: 
  • "This year, we continue our partnership and innovation with Pixelworks on the OnePlus Ace 3 smartphone, by introducing the AI-based distributed computing architecture of Pixelworks' X7 Gen 2 visual processor into our new-generation Super Frame Rate and Picture Quality Engine solution.
  • "The OnePlus Ace 3 smartphone is the first high-performance flagship from OnePlus in 2024," said Ting Xiong, President of Pixelworks China.
  • "Equipped with Pixelworks' X7 Gen 2 visual processor, this smartphone is primed to provide users with a superior gaming experience.
  • We believe that users will see and feel the shared commitment and extensive efforts of OnePlus and Pixelworks to elevate the gaming visual experience on the OnePlus Ace 3 smartphone."

OnePlus Unveils its First Foldable Smartphone in the U.S. and Canada - the OnePlus Open

Retrieved on: 
星期四, 十月 19, 2023
Emerald, Well, OnePlus, ROM, Anatomical terms of motion, Microsoft, Architecture, Sony, Durability, IEEE 802.11be, Glass, Partnership, Lens, XCD, OLED, USD, UFS, Sale, Smartphone, Mobile operating system, Hasselblad, Carbon, Immersion, UFS 4.0, Amazon, AMOLED, OIS, CAD, Microsoft OneNote, SONY, Heart, Autofocus, Light, Gmail, WhatsApp, OpenCanvas, HBM, Pixel, Open, LPDDR5X, Camera, Video game, Television, Online shopping

NEW YORK, Oct. 19, 2023 /PRNewswire/ -- Global technology brand OnePlus today announced the global launch of its new folding flagship smartphone, the OnePlus Open. As the first of its kind for OnePlus, the OnePlus Open is set to disrupt the foldable market with its uncompromising specifications. It brings together OnePlus' signature Fast & Smooth user experience, a premium camera experience in partnership with Hasselblad, and immersive spatial entertainment – all in an ultra-portable, modern and elegant foldable design.

Key Points: 
  • As the first of its kind for OnePlus, the OnePlus Open is set to disrupt the foldable market with its uncompromising specifications.
  • "With the launch of the OnePlus Open, we are thrilled to bring an uncompromising flagship foldable experience to users worldwide.
  • As OnePlus' first folding flagship, the OnePlus Open perfectly inherits the brand's iconic design philosophy — industrial minimalism combined with elegant sophistication.
  • The OnePlus Open is the first foldable smartphone to debut the Sony LYT-T808, its new line of revolutionary image sensors.