Singapore’s Capcon Raises Around $50 Million
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星期日, 二月 5, 2023
Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding.
Key Points:
- Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding.
- Ltd. provides a full range of advanced packaging processes, offering die bonders for wafer-level packaging, panel-level packaging, Flip chip, SIP, and Stack Die, etc.
- At the beginning of 2022, Capcon reached a 3-year supply agreement with ASE.
- Capcon is comprehensively engaged in intelligent manufacturing, semiconductors and pan-semiconductor fields.