Onto Innovation

Onto Innovation Invites Customers and Investors to Schedule Meetings at SEMICON® West

Retrieved on: 
星期三, 六月 22, 2022
Software, Nanotechnology, Other Manufacturing, Hardware, Packaging, Technology, Semiconductor, Manufacturing, Innovation, Solution, Exhibition, Thought, Mark (given name), Onto Innovation, 3D, Printed circuit board

Onto Innovation is proud to connect across the supply chain and focuses on solving complex problems with actionable information.

Key Points: 
  • Onto Innovation is proud to connect across the supply chain and focuses on solving complex problems with actionable information.
  • Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues.
  • Onto Innovation strives to optimize customers critical path of progress by making them smarter, faster and more efficient.
  • Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

Onto Announces New EB40 All-Surface Inspection Module for Wafer Fabs and Advanced Packaging

Retrieved on: 
星期四, 六月 9, 2022
Packaging, Semiconductor, Technology, Manufacturing, Nanotechnology, Other Manufacturing, Hardware, Coronavirus, Company, SAM, Dragonfly, Classification, 3D, Surjective function, Onto Innovation, AI, Security (finance), HPC, U.S. Securities and Exchange Commission, Innovation, Growth, Memory, Mark (given name), Private Securities Litigation Reform Act, NYSE, COVID-19, Weather, Â, Prevalence, G3, BEOL, IDMS, Logic, Renewable energy, Printed circuit board, Video game console

Together, the system and module offer all-surface wafer inspection to address the yield loss caused by defects on the wafer edge and backside across front-end and back-end processes.

Key Points: 
  • Together, the system and module offer all-surface wafer inspection to address the yield loss caused by defects on the wafer edge and backside across front-end and back-end processes.
  • All-surface inspection is becoming critical for quality assurance at foundries and IDMs producing advanced packages.
  • Thats where the 30% greater sensitivity and twice the throughput of the integrated Dragonfly G3 system and EB40 module come in.
  • He continued, Early inspection of the wafer edge is especially critical since small edge cracks can potentially propagate into the die near the wafer perimeter.

Onto Innovation to Participate in Three Upcoming Investor Conferences

Retrieved on: 
星期三, 五月 18, 2022
Electronic Design Automation, Semiconductor, Technology, Other Technology, Nanotechnology, Hardware, UN, Onto Innovation, The Beverly Hilton, Lotte New York Palace Hotel, Surjective function, Conference, 3D, NYSE, Innovation, Hotel, Stifel

Cowens 50th Annual Technology, Media & Telecom Conference: The Onto management team will participate in the conference at the Lotte New York Palace in New York City on June 1, 2022.

Key Points: 
  • Cowens 50th Annual Technology, Media & Telecom Conference: The Onto management team will participate in the conference at the Lotte New York Palace in New York City on June 1, 2022.
  • Stifels 2022 Cross Sector Insight Conference: The Onto management team will participate in the conference at the InterContinental Boston Hotel in Boston, Massachusetts on June 9, 2022.
  • Onto Innovation strives to optimize customers critical path of progress by making them smarter, faster and more efficient.
  • Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

Onto Innovation Appoints Boston Scientific Senior Financial Executive as Chief Financial Officer

Retrieved on: 
星期二, 五月 17, 2022
Nanotechnology, Other Manufacturing, Hardware, Electronic Design Automation, Technology, Semiconductor, Manufacturing, Other Technology, CPA, Company, Private Securities Litigation Reform Act, Boston Scientific, Strategic planning, U.S. Securities and Exchange Commission, COVID-19, Surjective function, Accounting, Weather, Mark (given name), GE, Providence College, Onto Innovation, IPO, Security (finance), GE Healthcare, 3D, Growth, CFO, NYSE, PricewaterhouseCoopers, Innovation, Management, Science

Onto Innovation Inc. (NYSE: ONTO) (Onto Innovation, Onto, or the Company) today announced the appointment of Mark Slicer to succeed Steve Roth as Onto Innovations chief financial officer.

Key Points: 
  • Onto Innovation Inc. (NYSE: ONTO) (Onto Innovation, Onto, or the Company) today announced the appointment of Mark Slicer to succeed Steve Roth as Onto Innovations chief financial officer.
  • Mr. Slicer joins Onto from Boston Scientific Corporation, a global medical technology manufacturer, where he spent 14 years in various senior financial roles, most recently as senior vice president and global operations controller.
  • Prior to his tenure at Boston Scientific, Mr. Slicer held various financial leadership roles at GE and GE Healthcare.
  • Mike Plisinski, chief executive officer, commented, Mark is another strong addition to the Onto Innovation team bringing the scale and experience necessary for Onto Innovations next phase of growth.

Onto Innovation Schedules 2022 First Quarter Financial Results Conference Call for May 3, 2022

Retrieved on: 
星期三, 四月 13, 2022
Semiconductor, Hardware, Nanotechnology, Other Technology, Technology, NYSE, Onto Innovation, UN, Innovation, Internet, 3D

Onto Innovation Inc. (NYSE: ONTO) will release its 2022 first quarter financial results after the market closes on Tuesday, May 3, 2022.

Key Points: 
  • Onto Innovation Inc. (NYSE: ONTO) will release its 2022 first quarter financial results after the market closes on Tuesday, May 3, 2022.
  • Onto Innovation will host a conference call in connection with its release of the financial results, which will be broadcast live over the internet.
  • Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will host the call.
  • To access the replay, please dial (888) 203-1112 and reference conference ID 9289193 at any time during that period.

Onto Innovation Welcomes May Su to Its Board of Directors

Retrieved on: 
星期一, 三月 21, 2022
Semiconductor, Hardware, Nanotechnology, Technology, Software, Private Securities Litigation Reform Act, Company, KLA, Leadership, 3D, Growth, Board, NYSE, Onto Innovation, Austin Aviza, UN, CEO, U.S. Securities and Exchange Commission, OEM, Brooks Automation, Lam Research, Innovation, Technology, Knowledge, Director, COVID-19, Automation, Surjective function, Weather, History, Security (finance), Management

Onto Innovation Inc. (NYSE: ONTO) (Onto Innovation, Onto, or the Company) today announced May Su has joined its board of directors.

Key Points: 
  • Onto Innovation Inc. (NYSE: ONTO) (Onto Innovation, Onto, or the Company) today announced May Su has joined its board of directors.
  • With over 35 years of leadership experience within the semiconductor capital equipment industry, May Su brings a strong background in strategy and strategic marketing to Onto Innovations board of directors.
  • May will bring significant international experience to the Onto Innovation board of directors.
  • We believe her broad technology experience and knowledge of our global customer base will bring applicable knowledge and insights to our board, said Christopher Seams, chairman of Onto Innovations board of directors.

New Study from StrategyR Highlights a $14.7 Billion Global Market for 3D Semiconductor Packaging by 2026

Retrieved on: 
星期五, 二月 18, 2022
Onto Innovation, Consumer electronics, Adoption, Tablet, Internet, Growth, Glass, GIA, SAN, Pop, Efficiency, Silicon, ASE, Amkor Technology, Original equipment manufacturer, Technology, TGV, Method, Geography, Marketing, Forecasting, 3D, Machine learning, CAGR, Investment, ICS, Research, COVID-19, Intelligence, ACE EV Group, Players, TSV, ODM, Video game, Video game console, Others, Telecommunication, Package

SAN FRANCISCO, Feb. 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Feb. 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .
  • This segment currently accounts for a 24.7% share of the global 3D Semiconductor Packaging market.
  • The U.S. Market is Estimated at $1.2 Billion in 2022, While China is Forecast to Reach $4.6 Billion by 2026
    The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.2 Billion in the year 2022.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Onto Innovation Schedules 2021 Fourth Quarter and Full Year Financial Results Conference Call for February 8, 2022

Retrieved on: 
星期四, 一月 20, 2022
Semiconductor, Hardware, Nanotechnology, Other Technology, Technology, ID, UN, Innovation, NYSE, Internet, 3D, Onto Innovation

Onto Innovation Inc. (NYSE: ONTO) will release its 2021 fourth quarter and full year financial results after the market closes on Tuesday, February 8, 2022.

Key Points: 
  • Onto Innovation Inc. (NYSE: ONTO) will release its 2021 fourth quarter and full year financial results after the market closes on Tuesday, February 8, 2022.
  • Onto Innovation will host a conference call in connection with its release of the financial results, which will be broadcast live over the internet.
  • Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will host the call.
  • To access the replay, please dial (888) 203-1112 and reference conference ID 8215502 at any time during that period.

New Study from StrategyR Highlights a $14.7 Billion Global Market for 3D Semiconductor Packaging by 2026

Retrieved on: 
星期二, 一月 18, 2022
Geography, Forecasting, CAGR, Research, Technology, Onto Innovation, SAN, TSV, Tablet, COVID-19, ODM, Adoption, Method, Growth, GIA, Consumer electronics, Intelligence, ICS, ACE EV Group, Glass, Silicon, Marketing, Internet, TGV, Efficiency, Players, Original equipment manufacturer, Pop, Amkor Technology, 3D, ASE, Investment, Machine learning, Video game, Video game console, Others, Telecommunication, Package

SAN FRANCISCO, Jan. 18, 2022 /PRNewswire/ --A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Jan. 18, 2022 /PRNewswire/ --A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics" .
  • This segment currently accounts for a 24.7% share of the global 3D Semiconductor Packaging market.
  • The U.S. Market is Estimated at $1.1 Billion in 2021, While China is Forecast to Reach $4.6 Billion by 2026
    The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.1 Billion in the year 2021.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Onto Innovation Announces Growing $500 Million Order Backlog, Including Solutions for Heterogeneous Packaging

Retrieved on: 
星期四, 二月 10, 2022
Technology, Nanotechnology, Hardware, Semiconductor, UN, CAGR, Technology, R, Private Securities Litigation Reform Act, COVID-19, Innovation, NYSE, Growth, Weather, CIS, Logic, ISP, U.S. Securities and Exchange Commission, G3, Company, Multimedia, 3D, Security (finance), Coronavirus, Surjective function, Onto Innovation, Printed circuit board, Video game console, Technology, Nanotechnology, Hardware, Semiconductor

The key to this market is the ability to increase interconnect density while simultaneously achieving high yields.

Key Points: 
  • The key to this market is the ability to increase interconnect density while simultaneously achieving high yields.
  • Onto Innovation also received over $12 million in orders for its Dragonfly G3 inspection system .
  • Hybrid bonding is a key element in the next-generation of heterogeneous packaging and allows for true 3D die-to-die stacking.
  • Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release.