Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packaging for AI
This represents an increase from the previously estimated customer demand reflecting the critical role the Dragonfly G3 system plays in support of advanced packaging for the expanding AI device market.
- This represents an increase from the previously estimated customer demand reflecting the critical role the Dragonfly G3 system plays in support of advanced packaging for the expanding AI device market.
- The orders are from leading logic and memory manufacturers for heterogeneous integrated (HI) packages that combine a graphics processor (GPU) and numerous high bandwidth memory (HBM) devices to create an AI GPU in a single package.
- “The system’s range of high-performance optical capabilities enables it to monitor multiple parameters at high throughput.
- To learn more about the Dragonfly G3 system, visit Onto Innovation at SEMICON® Taiwan September 6-8 in Booth M0656-4F or send us a message .