Compal

In Partnership with Compal, Ventiva to Debut Silent Cooling Technology at Computex 2024

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星期四, 五月 30, 2024
Technology, Mobile, Wireless, Hardware, Consumer Electronics, Partnership, Computer, TDP, ICE9, Silicon, Engineering, Senior, AI, Physics, Original equipment manufacturer, Compal, Electronics

This collaboration marks a significant milestone in the public adoption of a new air movement technology in a mainstream, high-volume laptop computer.

Key Points: 
  • This collaboration marks a significant milestone in the public adoption of a new air movement technology in a mainstream, high-volume laptop computer.
  • Andy Lee, Senior Vice President of Compal, expressed his views on the technology partnership, stating, "We have been working closely with the Ventiva team for almost a year to integrate the ICE9 thermal technology into our products.
  • ICE9 laptops enable us to create a thin, utterly silent device that is also an ideal platform for AI workloads.
  • Compal will be demonstrating a 20W TDP reference design with Ventiva’s ICE9 silent cooling technology at Computex 2024.

Auden Unveils a Comprehensive Satellite Communication Solution at the Satellite 2024

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星期二, 三月 19, 2024
LEO, Radio access network, Communication, Size, Swap, 3GPP, Artificial intelligence, R18, HF, NTN, Exhibition, GEO, Compal, Communications satellite

Auden has significantly advanced its decades of expertise in array antenna communication system design, introducing groundbreaking enhancements in shared antenna configurations.

Key Points: 
  • Auden has significantly advanced its decades of expertise in array antenna communication system design, introducing groundbreaking enhancements in shared antenna configurations.
  • Auden is also proactively adopting the 3GPP R18 standards, incorporating NTN communication protocols, and facilitating the integration of next-generation base-band modules with satellite operators.
  • Daniel Chang, Chairman of Auden, said, "We are delighted to collaborate with Compal, leveraging the strengths of both parties to introduce a comprehensive satellite communication solution.
  • We invite you to visit us at the exhibition to learn more about this groundbreaking satellite communication solution.

Marvell to Showcase Carrier Infrastructure at MWC 2024

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星期一, 二月 26, 2024
Samsung Electronics, Compal, Physics, Growth, MWC, RANS, MIMO, DU, MRVL, Marvell Technology, Dell Technologies, Wi-Fi 6, DSP, 6E, Mobile World Congress

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest product and partner portfolio for carrier infrastructure at MWC Barcelona 2024, the world's largest connectivity event, taking place February 26-29, 2024.

Key Points: 
  • BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest product and partner portfolio for carrier infrastructure at MWC Barcelona 2024, the world's largest connectivity event, taking place February 26-29, 2024.
  • To address massive mobile data growth, carriers are accelerating 5G deployment and evolving their Radio Access Networks (RANs) to open and virtualized architectures.
  • To speed this transition, Marvell partners are applying its accelerated compute technology to yield greater network flexibility and efficiency.
  • As traffic growth drives the need for higher bandwidth transmission, Marvell optical and copper connectivity technology is powering advances from fronthaul to metro.

Colley Hwang: Taiwan-Japan best match in semiconductor synergy

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星期一, 二月 19, 2024
IDM, Huang, TSMC, ICT, Sony, Internet, Intel, Compal, Multimedia, United Microelectronics Corporation, Car, Research, Nintendo, Health, Dell, Electronics, Plant, Denso, Samsung, Foxconn, Delta Electronics, HP, Gartner, Risk, Communication, UMC, Pegatron, Apple, Interview, Software, Parity, LG, Hyundai, Video game

In an interview, DIGITIMES President Colley Hwang, a seasoned expert and consultant in the semiconductor industry, stated that the semiconductor industry is undergoing structural changes.

Key Points: 
  • In an interview, DIGITIMES President Colley Hwang, a seasoned expert and consultant in the semiconductor industry, stated that the semiconductor industry is undergoing structural changes.
  • TSMC (Taiwan Semiconductor Manufacturing Company) recently announced its investment plan for the Kumamoto Fab 2 plant, collaborating with local companies like Sony, Denso, and Toyota.
  • Hwang emphasized the compatibility between Taiwan and Japan and highlighted Japan's dominance in semiconductor materials and equipment, accounting for 52% and 36% of the global market share, respectively.
  • Therefore, the best approach is a highly integrated collaboration between Southeast Asian/South Asian countries and East Asian traditional production systems.

Micron First to Market With LPDDR5X-based LPCAMM2 Memory, Transforming User Experiences for PCs

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星期二, 一月 9, 2024
Artificial intelligence, DRAM, SODIMM, Crucial, Compal, AI, Ecosystem, Micrometre, GAI, Original equipment manufacturer, PC, Personal computer, Micron Technology, Intel, Video game

Sampling now with production in the first half of 2024, LPCAMM2 is the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMMs) in 1997.

Key Points: 
  • Sampling now with production in the first half of 2024, LPCAMM2 is the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMMs) in 1997.
  • “Micron is transforming the laptop user’s experience with the LPCAMM2 product that will deliver best-in-class performance per watt in a flexible, modular form factor,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group.
  • “We are proud of our strong relationship and joint development effort with Micron to be one of the first to market in bringing this flexible memory offering to our customers.
  • To learn more about the innovative features and advantages of Micron’s LPCAMM2 offering, visit: www.micron.com/LPDRAM .

First 5G-ACIA General Assembly in Taiwan to Unlock Global 5G Market

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星期五, 十二月 29, 2023
Quanta, Cloud, ITRI, 3GPP, Ecosystem, Director general, Compal, Telecommunications, TTC, General assembly, Lion, Pegatron, Industrial internet of things, Internet of things, Lite, Memorandum of understanding, NXP, Mitsubishi Electric, Quanta Cloud Technology, QCT, Communication, Industrial Technology Research Institute, Ericsson, Mobile phone

The Industrial Technology Research Institute ( ITRI ) facilitated the signing of a memorandum of understanding (MoU) between 5G-ACIA and Taiwan Association of Information and Communication Standards (TAICS), aligning Taiwanese manufacturers with global 5G Industrial Internet of Things (IIoT) standards.

Key Points: 
  • The Industrial Technology Research Institute ( ITRI ) facilitated the signing of a memorandum of understanding (MoU) between 5G-ACIA and Taiwan Association of Information and Communication Standards (TAICS), aligning Taiwanese manufacturers with global 5G Industrial Internet of Things (IIoT) standards.
  • "As a world-class think tank with global connections, ITRI facilitated the 5G-ACIA General Assembly to take place in Taiwan and promote global standards for 5G smart manufacturing through the collaboration between 5G-ACIA and TAICS.
  • Bringing together leading telecommunications players is advantageous for Taiwan to access the global supply chain and market," said Ting.
  • This collaboration enables us to exchange technical documents, industrial standards, and current developments in 5G smart manufacturing.

Keysight Demonstrates Open RAN Deployment Readiness Testing Leadership at O-RAN Spring 2023 Global PlugFest

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星期四, 六月 29, 2023
Technology, Telecommunications, Software, Networks, Internet, Hardware, Electronic Design Automation, Data Management, Consumer Electronics, Quanta, Cloud, Compal, KT Corporation, Quanta Cloud Technology, Pegatron, ITRI, Illinois Security Lab, OTA, ABI Solid Sequencing, Denial-of-service attack, RAN, ETRI, GNB, Machine learning, UE, Radio, Artificial intelligence, Plugtest, KORA, UES, 3GPP, Research, Keysight, SCAS, QCT, RF, RIC, Rail transport, Medical device, Askey, Inventec

As wireless networks move to virtualized, disaggregated Open RAN architectures, Keysight has been working with its industry partners to develop and deploy testing specifications based on 3GPP and O-RAN ALLIANCE standards.

Key Points: 
  • As wireless networks move to virtualized, disaggregated Open RAN architectures, Keysight has been working with its industry partners to develop and deploy testing specifications based on 3GPP and O-RAN ALLIANCE standards.
  • Keysight’s test setups were facilitated by the hosts, Auray OTIC and Security Lab and KT Corporation, at their Spring 2023 Global PlugFest locations.
  • Peng Cao, Vice President and General Manager for Keysight's Wireless Test Group, said: “With our participation in O-RAN ALLIANCE’s Spring 2023 Global PlugFest, Keysight continues to lead the development, adoption, and testing of 5G Open RAN architectures.
  • Thanks to our comprehensive Open RAN testing solutions and our deep network emulation and RF expertise, we will enable the industry to confidently speed its Open RAN products to market.”

VIAVI Supports Ecosystem Expansion, Security Validation and RAN Intelligence at Spring 2023 O-RAN PlugFest

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星期三, 六月 14, 2023
Compal, Pegatron, EAP-TLS, Senior, Chapter Seven, TLS, Rayna Rapp, Spectrum analyzer, Denial-of-service attack, Intelligence, Transport layer, Cell, VSA, RAN, Rohde & Schwarz, Energy, QOS, SSH, Secure Shell, Denial, UE, VSG, Plugtest, Security assurance, R, SCAS, Rapp, RIC, Transport Layer Security, Medical device, Radisys, Inventec, Capgemini

CHANDLER, Ariz., June 14, 2023 /PRNewswire/ -- Viavi Solutions Inc. (VIAVI) (NASDAQ: VIAV) today shared the company's role in the Spring 2023 O-RAN PlugFest organized by the O-RAN ALLIANCE and hosted by industry leaders.

Key Points: 
  • CHANDLER, Ariz., June 14, 2023 /PRNewswire/ -- Viavi Solutions Inc. (VIAVI) (NASDAQ: VIAV) today shared the company's role in the Spring 2023 O-RAN PlugFest organized by the O-RAN ALLIANCE and hosted by industry leaders.
  • The PlugFest involved a series of on-site demonstrations in North America, Europe and Asia, conducted in April and May.
  • VIAVI and Capgemini demonstrated the end-to-end validation of the Capgemini AI-enabled Energy Savings rApp on the Capgemini RIC.
  • VIAVI TeraVM , a virtualized application emulation and security performance platform, used in security and end-to-end testing, and RIC testing and training .

BAPCo® Introduces Linux and Chrome Support to CrossMark, a Cross-Architecture Performance Benchmark

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星期三, 四月 12, 2023
Hardware, Consumer Electronics, Apps, Applications, Technology, Software, Quanta, Compal, ChromeOS, Pegatron, Dell, Hewlett-Packard, Ubuntu version history, Microsoft Windows, Original equipment manufacturer, Crossref, BAPCo, Samsung, Android, Chromebook, PC, IOS, Creativity, Western Digital, ODM, Organization, MacOS, Quanta Computer, Intel, Linux, Acer, ARM64, Bionics, ASUS, Responsiveness, Video game, Computer data storage, Pharmaceutical industry, Chrome, Inventec, Wistron, Lenovo, Government

BAPCo®, a non-profit consortium of leading PC hardware manufacturers, add Linux and Chrome support to the CrossMark® v1.0.1.95 benchmark, a cross-architecture performance benchmark using common and relevant workloads.

Key Points: 
  • BAPCo®, a non-profit consortium of leading PC hardware manufacturers, add Linux and Chrome support to the CrossMark® v1.0.1.95 benchmark, a cross-architecture performance benchmark using common and relevant workloads.
  • CrossMark Linux is also available on x86_64 and aarch64 Chromebooks via Linux, aka Crostini or Crosh shell (in developer mode).
  • CrossMark, a cross-platform benchmark available on most popular operating systems, standardizes the process of measuring system performance under real-world usage models.
  • CrossMark reports an overall system performance, as well as several sub-scores indicative of system performance in a variety of real usage models.

Arctic Semiconductor and Compal Introduce World’s First Universal Small Cell Infrastructure Platform for 5G Networks

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星期一, 二月 27, 2023
Ecosystem, RF, Compal, NXP Semiconductors, Silicon, Mobile World Congress, Multidimensional Digital Pre-distortion, RFIC, Mobile, Electronics, Radio, MIMO, SOC, Digital, Compal Electronics, 3GPP, ODM, CMOS, NXP, Mobile phone, Cable television, Data-rate units

BARCELONA, Spain, Feb. 27, 2023 (GLOBE NEWSWIRE) -- Arctic Semiconductor formerly known as SiTune Corporation, a leader in low-power, universal RF chipsets, today announced that its groundbreaking RF transceiver, IceWings ™ is powering a new universal 5G small cell infrastructure platform from Compal Electronics , one of the world’s largest ODMs.

Key Points: 
  • BARCELONA, Spain, Feb. 27, 2023 (GLOBE NEWSWIRE) -- Arctic Semiconductor formerly known as SiTune Corporation, a leader in low-power, universal RF chipsets, today announced that its groundbreaking RF transceiver, IceWings ™ is powering a new universal 5G small cell infrastructure platform from Compal Electronics , one of the world’s largest ODMs.
  • “The introduction of this universal small cell platform is a pivotal point in 5G infrastructure development, allowing 5G coverage to scale anywhere and everywhere at an exponentially faster pace,” said Vahid Toosi, CEO of Arctic Semiconductor.
  • “Our collaboration with NXP and Compal has created a 5G platform with an unbeatable mix of performance, flexibility and cost that unlocks the true potential of 5G infrastructure and applications.
  • “This new 5G NR platform from Compal is an excellent example of how that growing ecosystem can deliver more choices for our global customers, along with greater flexibility and scalability to accelerate their 5G infrastructure deployments globally.”