Through Glass Via (TGV): The Next Generation Advanced Packaging Solution
KAOHSIUNG, Oct. 23, 2023 /PRNewswire/ -- On September 19, 2023, Intel announced one of the industry's first glass substrates for next-generation advanced packaging.
- KAOHSIUNG, Oct. 23, 2023 /PRNewswire/ -- On September 19, 2023, Intel announced one of the industry's first glass substrates for next-generation advanced packaging.
- The industry believes that glass substrates are emerging as a promising alternative interposer material, especially for heterogeneous packaging such as 2.5D or 3D packages.
- E&R, an advanced laser innovation provider, has dedicated a self-developed accelerated optics solution (ACES) combined with advanced laser technology to delivering total solutions for glass substrates for several years, including TGV, Laser Glass Polishing, and multi-beam path Laser cutting solutions for glass.
- TGV, an essential method for glass substrates to achieve 2.5D/3D packaging, involves internal modification for subsequent wet etching processes.