MIPI

GOWIN Semiconductor to Attend InfoComm 2024

Retrieved on: 
torsdag, maj 9, 2024
FPGA, PCB, IP, Arora, HDMI, UREI, MIPI, Infocommunications, SerDes, SAN, Management

SAN JOSE, Calif. and GUANGZHOU, China, May 09, 2024 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, a global leader in FPGA technology and the fastest-growing provider in the industry, is thrilled to announce its debut participation at InfoComm 2024, taking place from June 12th to 14th in Las Vegas, United States.

Key Points: 
  • SAN JOSE, Calif. and GUANGZHOU, China, May 09, 2024 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, a global leader in FPGA technology and the fastest-growing provider in the industry, is thrilled to announce its debut participation at InfoComm 2024, taking place from June 12th to 14th in Las Vegas, United States.
  • Join us at booth W1352, where we will unveil our latest FPGA innovations and demonstrate their transformative capabilities.
  • InfoComm stands as North America's premier audiovisual trade show, uniting manufacturers, integrators, dealers, and end-users worldwide to explore cutting-edge technologies, products, and services.
  • For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/
    For more information about and to register for the conference, visit https://www.infocommshow.org/

Arasan’s Total MIPI Camera IP Solution With CSI and C-PHY Achieves ISO26262 Certification

Retrieved on: 
onsdag, maj 8, 2024
Mobile, Wireless, Technology, Semiconductor, Engineering, Automotive Manufacturing, Photography, Aerospace, Manufacturing, Hardware, IOT (Internet of Things), Ethernet, Total, IP, Certification, CSI, MIPI, Multimedia, USB, Socs

Arasan, a leading provider of mobile storage and connectivity IP solutions, is proud to announce the ISO26262 functional certification for its Total MIPI Camera IP solution as a single product - a seamlessly integrated combination configured either in Transmit mode with its MIPI CSI-2 IP and MIPI C-PHY Tx IP or in Receive mode with its MIPI CSI-2 Rx IP and MIPI C-PHY Rx IP enabling speeds of up to 54.72Gbps.

Key Points: 
  • Arasan, a leading provider of mobile storage and connectivity IP solutions, is proud to announce the ISO26262 functional certification for its Total MIPI Camera IP solution as a single product - a seamlessly integrated combination configured either in Transmit mode with its MIPI CSI-2 IP and MIPI C-PHY Tx IP or in Receive mode with its MIPI CSI-2 Rx IP and MIPI C-PHY Rx IP enabling speeds of up to 54.72Gbps.
  • View the full release here: https://www.businesswire.com/news/home/20240508415865/en/
    MIPI CSI-2 TX with C-PHY & D-PHY IP ISO26262 ASIL-C Certification (Graphic: Business Wire)
    The certification also includes use of our MIPI D-PHY Tx IP or MIPI D-PHY Rx IP with the respective MIPI CSI Controller IP.
  • Arasan's MIPI D-PHY + CSI IP continues to be extensively used in low resolution camera sensor applications.
  • The ISO26262 certified Total MIPI Camera IP Solution with its CSI IP & C-PHY IP or D-PHY IP are readily available for licensing.

Introspect Technology's Best-Selling Products Now Enable MIPI Camera Service Extensions℠ Roadmap

Retrieved on: 
onsdag, maj 1, 2024
Society, Functional safety, Communication, ADAS, MIPI, ADS, Automation, Fusa, Privacy, Introspection, Confidentiality, Security, MIPI Alliance, Medical device

MONTREAL, May 1, 2024 /PRNewswire/ -- Introspect Technology, leading manufacturer of electronic test and measurement instruments for high-speed digital applications, announced the addition of the upcoming MIPI Camera Service Extensions (CSE) v2.0 specification to its entire line of SV5C MIPI C-PHY and D-PHY Generators and Analyzers. The extended features, which can be activated by license on existing hardware, pave the way for higher levels of automation with advanced driver-assistance systems.

Key Points: 
  • "Built upon established, industry recognized products, customers can take advantage of the flexibility of the new Introspect Technology CSE tools to design, develop, and test the way of the future."
  • The new MIPI CSE v2.0 specification, expected to be published in May, is a key component of the forthcoming MIPI Security Framework, a framework designed to provide end-to-end protection of MIPI CSI-2® data streams.
  • The addition of MIPI CSE v2.0 testing features to the Introspect Technology instruments provides leading developers with the early ability to validate and characterize next-generation designs targeting camera applications that require Security (Sec) and Functional Safety (FuSa).
  • The MIPI CSE license can be activated immediately for use on applicable MIPI test systems produced by Introspect Technology.

GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment

Retrieved on: 
tisdag, april 30, 2024
ISO 14001, TSMC, VHDL, IP, TUV, Safety, LVDS, Certification, PCI Express, Verilog, IEC, ISO, ISO 9001, Original equipment manufacturer, MIPI, Environment, SystemVerilog, Field-programmable gate array, Memory, DDR3, Medical device

LONDON and GUANGZHOU, China, April 30, 2024 /PRNewswire/ -- GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.

Key Points: 
  • Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.
  • Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025.
  • The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs.
  • GOWIN's automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).

GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment

Retrieved on: 
tisdag, april 30, 2024
ISO 14001, TSMC, VHDL, IP, TUV, Safety, LVDS, Certification, PCI Express, Verilog, IEC, ISO, ISO 9001, Original equipment manufacturer, MIPI, Environment, SystemVerilog, Field-programmable gate array, Memory, DDR3, Medical device

LONDON and GUANGZHOU, China, April 30, 2024 /PRNewswire/ -- GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.

Key Points: 
  • Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.
  • Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025.
  • The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs.
  • GOWIN's automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).

Valens Semiconductor Partners with Black Sesame Technologies to Add MIPI A-PHY Connectivity to Black Sesame's Innovative ADAS and Cross-Domain Compute Platforms

Retrieved on: 
måndag, april 29, 2024
VLN, Geely, E113, Ecosystem, Valens Semiconductor, Safety, Auto China, SOC, Dongfeng Motor Corporation, FAW Group, OEM, Growth, MIPI, SVP, Immunity, EMC, HOD, A1000, MCU

Leveraging the VA7000 MIPI A-PHY compliant chipsets by Valens, Black Sesame Technologies will offer and support the A-PHY connectivity standard for its automotive OEM and Tier1 customers.

Key Points: 
  • Leveraging the VA7000 MIPI A-PHY compliant chipsets by Valens, Black Sesame Technologies will offer and support the A-PHY connectivity standard for its automotive OEM and Tier1 customers.
  • The Huashan-2 A1000 is an automotive-grade SoC for L2/L2+ ADAS solutions, supported by a comprehensive and mature mass-production ecosystem.
  • "We decided to move forward with this implementation because of the significant interest for MIPI A-PHY connectivity, both within China and globally," said Weihong Liu, co-founder and President of Black Sesame Technologies.
  • The Huashan-2 A1000 autonomous driving computing chip with A-PHY connectivity will be showcased at Black Sesame Technologies' booth (E113) at the Beijing Auto Show from April 25 to May 5.

Kioxia Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on: 
tisdag, april 23, 2024
Semiconductor, Technology, Manufacturing, Mobile, Wireless, Other Manufacturing, Hardware, Sale, MIPI M-PHY, Corporation, Personal computer, Universal Flash Storage, UniPro, Toshiba, MIPI, App Store (iOS/iPadOS), Solid-state drive, JEDEC, Memory, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Computer data storage

Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.

Key Points: 
  • Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.
  • 4.0 embedded flash memory devices (Graphic: Business Wire)
    The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • (2) Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

Advantech Collaborates with Phison to Develop GenAI Computing Platform for Edge and Industrial Applications

Retrieved on: 
tisdag, april 16, 2024
Data Management, IOT (Internet of Things), Technology, Software, Artificial Intelligence, Internet, Hardware, Education, SDA, Artificial intelligence of things, SATA, AI, Partnership, ONFI, Intelligence, UFSA, NVIDIA, SSD, Graphics processing unit, Knowledge, IP, PCI-SIG, JEDEC, Robotics, Memory, Generative, Blog, Ecosystem, VRAM, Nature, SDK, Automotive industry, MultiMediaCard, Multimedia, NVM Express, UFS, USB, IEEE-SA, Internet of things, Edge, LLM, AMR, MIPI, Synthetic media, Electronics, GPU, Fourth Industrial Revolution, Health, Video game

Recognizing this trend, Advantech (2395TT), a global leader in edge computing, announced today a collaboration with Phison (8299TT), a leading provider of NAND controllers and NAND storage solutions, to jointly produce GenAI computing platforms tailored for edge and industrial applications.

Key Points: 
  • Recognizing this trend, Advantech (2395TT), a global leader in edge computing, announced today a collaboration with Phison (8299TT), a leading provider of NAND controllers and NAND storage solutions, to jointly produce GenAI computing platforms tailored for edge and industrial applications.
  • View the full release here: https://www.businesswire.com/news/home/20240416272737/en/
    Phison and Advantech develop GenAI computing platform for edge and industrial applications (Graphic: Phison)
    Leveraging Phison's exclusive patented aiDAPTIV+ technology and seamlessly integrating it with Advantech's Edge AI Solutions, our innovative GenAI computing platform empowers customers in the edge and industrial sectors to construct secure, reliable, and cost-effective computing devices for refining GenAI models.
  • Additionally, to meet the rising industrial Edge AI computing needs, we engage closely with various hardware, software, and application partners.
  • [About Advantech Edge AI Solutions] Advantech's Edge AI Solutions provide a range of platforms, offering scalable computing power and software toolkits for AI analytics at the edge.

M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process

Retrieved on: 
torsdag, april 25, 2024
Internet of things, TSMC, IP, AI, PCI Express, Silicon, IPS, OIP, R&D, PHY, Standard cell, ADAS, Artificial intelligence, ALP, MIPI, GPIO, Intellectual property, Multimedia, M31, Partner, Socs

HSINCHU, April 25, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.

Key Points: 
  • HSINCHU, April 25, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.
  • M31 has been honored with the TSMC Open Innovation Platform® (OIP) Partner of the Year Award for Special Process IP for six consecutive years.
  • M31 also introduced the 5nm MIPI C/D PHY Combo IP that complies with the latest D-PHY v2.5 and C-PHY v2.0 specifications.
  • Looking ahead, M31 will closely follow TSMC's advanced process technology, continue to invest in R&D resources, develop products using advanced process technology, and expand IP solutions in emerging application areas such as AI, IoT, and 5G communication, to help customers accelerate product launches and enhance market competitiveness."

Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes

Retrieved on: 
onsdag, april 24, 2024
Interface, TSMC, IP, N16, UCIe, AI, PCI Express, LPDDR, OIP, Silicon, Socs, MIPI, Engineering, Compiler, EDA, RF, DDR5, SNPS, PPA, USB, Semiconductor

SUNNYVALE, Calif., April 24, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs. Among the newest collaborations is a co-optimized Photonic IC flow, addressing the application of silicon photonics technology in the quest for better power, performance, and transistor density. Synopsys also noted the industry's confidence in its digital and analog design flows, production-ready for TSMC N3/N3P and N2 process technologies. The two companies are collaborating on next-generation AI-driven flows, including Synopsys DSO.ai™, for design productivity and optimization. In addition, Synopsys is developing a broad portfolio of Foundation and Interface IP on TSMC N2/N2P. In a related announcement today, Keysight, Synopsys, and Ansys introduced a new integrated radio frequency (RF) design migration flow from TSMC's N16 process to its N6RF+ technology.

Key Points: 
  • Synopsys also noted the industry's confidence in its digital and analog design flows, production-ready for TSMC N3/N3P and N2 process technologies.
  • In addition, Synopsys is developing a broad portfolio of Foundation and Interface IP on TSMC N2/N2P.
  • A new flow is available for TSMC N5 to N3E migration, adding to Synopsys' established flows for TSMC N4P to N3E and N3E to N2 processes.
  • Synopsys IP for advanced TSMC processes has been adopted by dozens of leading companies to accelerate their development time.