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Greenliant Expands eMMC NANDrive™ Portfolio with Highest Endurance EX Series and Value VX Series SSDs

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수요일, 12월 20, 2023

TLC, Transport, LTA, Yaesu VX series, Marketing, NAND, MultiMediaCard, MLC, POS, SSD, Temperature, Solid-state drive, Computer data storage, Greenliant Systems

Reinforcing its commitment to addressing the most demanding data retention and endurance requirements, Greenliant has upgraded the eMMC NANDrive EX Series using EnduroSLC™ Technology to support even higher endurance levels.

Key Points:

Reinforcing its commitment to addressing the most demanding data retention and endurance requirements, Greenliant has upgraded the eMMC NANDrive EX Series using EnduroSLC™ Technology to support even higher endurance levels.
All 50,000, 100,000 and 250,000 high endurance eMMC NANDrive EX Series SSDs can now achieve 75,000, 150,000 and industry-leading 400,000 P/E cycles, respectively.
eMMC NANDrive MX Series SSDs are available in 100-ball (8GB) and 153-ball (8GB-64GB) packages with endurance of 5,000 P/E cycles.
Greenliant is sampling eMMC NANDrive VX Series SSDs to customers now, and expects to start volume production in January 2024. eMMC NANDrive EX Series SSDs with increased endurance of 75K, 150K and trailblazing 400K P/E cycles are shipping now.

Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports

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월요일, 12월 11, 2023

SEMI, DRAM, Investment, EMDS, NAND, Data collection, Total, HBM, Growth, Renewable energy

TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .

Key Points:

TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .
This contraction marks a significant improvement from the 18.8% decline forecast by SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective.
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market.
A subscription includes three reports:
Monthly SEMI North American Billings Report, an early perspective of equipment market trends
Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports

Retrieved on:

월요일, 12월 11, 2023

SEMI, DRAM, Investment, EMDS, NAND, Data collection, Total, HBM, Growth, Renewable energy

TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .

Key Points:

TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .
This contraction marks a significant improvement from the 18.8% decline forecast by SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective.
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market.
A subscription includes three reports:
Monthly SEMI North American Billings Report, an early perspective of equipment market trends
Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

Czech Republic Semiconductor Market Outlook Report 2023-2028: 5G Adoption to Boost Semiconductor Demand, Market Thrives on IoT and AI Advancements

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금요일, 12월 8, 2023

Czech Republic semiconductor market revenue size is projected to grow at a CAGR of 7.4% during 2022-2028.

Key Points:

Czech Republic semiconductor market revenue size is projected to grow at a CAGR of 7.4% during 2022-2028.
Additionally, as adoption of 5G technology in Czech Republic would increase the demand for semiconductor would also increase, with deployment of 5G technology the usage of smart devices would also surge in the forecast period in Czech Republic.
Czech Republic semiconductor market report thoroughly covers market by components and applications.
Historical Data and Forecast of Czech Republic Semiconductor Market Revenues, By Components for the Period 2018-2028F
Historical Data and Forecast of Czech Republic Semiconductor Market Revenues, By Applications for the Period 2018-2028F
Czech Republic Semiconductor Market Shares, by Companies

NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM

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수요일, 12월 6, 2023

Interest, SAN, DRAM, NEO, FBC, NAND, TCAD, Memory, 3D, IMW, 3D NAND, 3D printing, Computer data storage, South Korea

SAN JOSE, Calif., Dec. 6, 2023 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced findings of 3D X-DRAM™ simulations. Semiconductor manufacturers and engineers use TCAD to simulate emerging technologies and optimize new products.

Key Points:

"We use these same tools to create models and run simulations demonstrating the feasibility of adopting 3D X-DRAM technology to bring 3D DRAM products to market."
3D X-DRAM uses innovative Floating Body Cell (FBC) technology with one transistor and zero capacitors for each data bit.
A simple 3D structure makes 3D X-DRAM less risky and costly than 3D DRAM alternatives.
NEO estimates 3D X-DRAM achieves 128 Gb density with 230 layers—4 times better than 2D DRAM.

Tune in to Bloomberg to Watch Advancements on Saturday, December 9th at 8:00 PM ET.

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월요일, 12월 4, 2023

Siemens Energy Sector, Refrigeration, Algorithm, University, Atmosphere, Heat, HVAC, Electric motor, NAND

JUPITER, Fla., Dec. 4, 2023 /PRNewswire-PRWeb/ -- DMG Productions is excited to announce the upcoming broadcast of Advancements with Ted Danson, scheduled to air on Saturday, December 9th at 8:00 pm ET.

Key Points:

JUPITER, Fla., Dec. 4, 2023 /PRNewswire-PRWeb/ -- DMG Productions is excited to announce the upcoming broadcast of Advancements with Ted Danson, scheduled to air on Saturday, December 9th at 8:00 pm ET.
Spectators will see how Siemens Energy's innovative technologies and ability to turn ideas into reality are creating a place where positive change is possible.
Next, hear how the use of green, efficient eco-energy HVAC-R solutions are changing the way heating and cooling systems operate and consume power.
Watch to see how the technology is helping to empower staff and managers to develop flexible schedules that meet evolving demands.

2023 Black Friday Deals on SK hynix SSDs: Up to 30% Off!

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금요일, 11월 17, 2023

TOKYO, Nov. 17, 2023 /PRNewswire/ -- SK hynix, the world's second-largest memory chipmaker, is celebrating this year's Black Friday by offering up to 30% off on its SSD products.

Key Points:

TOKYO, Nov. 17, 2023 /PRNewswire/ -- SK hynix, the world's second-largest memory chipmaker, is celebrating this year's Black Friday by offering up to 30% off on its SSD products.
SK hynix, ranking second globally in DRAM and NAND production (Omdia, 2023), is a subsidiary of SK Group, which ranked 117th on the Fortune Global 500 list for 2022.
In recent years, SK hynix has been leading the memory semiconductor industry, developing the world's first 321-Layer 4D NAND and the fastest mobile DRAM, LPDDR5T.
The promotional period for SK hynix SSDs is set to run from November 20 to 27, and they will be available at discounted prices on Amazon.

2023 Black Friday Deals on SK hynix SSDs: Up to 30% Off!

Retrieved on:

금요일, 11월 17, 2023

TOKYO, Nov. 17, 2023 /PRNewswire/ -- SK hynix, the world's second-largest memory chipmaker, is celebrating this year's Black Friday by offering up to 30% off on its SSD products.

Key Points:

TOKYO, Nov. 17, 2023 /PRNewswire/ -- SK hynix, the world's second-largest memory chipmaker, is celebrating this year's Black Friday by offering up to 30% off on its SSD products.
SK hynix, ranking second globally in DRAM and NAND production (Omdia, 2023), is a subsidiary of SK Group, which ranked 117th on the Fortune Global 500 list for 2022.
In recent years, SK hynix has been leading the memory semiconductor industry, developing the world's first 321-Layer 4D NAND and the fastest mobile DRAM, LPDDR5T.
The promotional period for SK hynix SSDs is set to run from November 17 to 27, and they will be available at discounted prices on Amazon.

ERS electronic introduces "High Power Dissipation" Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

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화요일, 11월 14, 2023

DRAM, Heat, ERS, Artificial intelligence, Central processing unit, Machine learning, NAND, Graphics processing unit, IC, Atmosphere, DUT, Temperature, Printed circuit board, Transformer

MUNICH, Nov. 14, 2023 /PRNewswire/ -- ERS electronic , the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System .

Key Points:

MUNICH, Nov. 14, 2023 /PRNewswire/ -- ERS electronic , the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System .
ERS's new "High Power Dissipation" System can dissipate wattage up to 2.5kW at -40°C on a 300 mm chuck, thereby allowing the testing of single dies as well as tests with full wafer contact.
The thermal chuck consists of several sections that can be controlled individually, thanks to ERS's patented PowerSense software.
For all other major wafer test operations, we continue to favor air as a coolant," says Klemens Reitinger, CTO of ERS electronic.

ERS electronic introduces "High Power Dissipation" Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

Retrieved on:

화요일, 11월 14, 2023

DRAM, Heat, ERS, Artificial intelligence, Central processing unit, Machine learning, NAND, Graphics processing unit, IC, Atmosphere, DUT, Temperature, Printed circuit board, Transformer

MUNICH, Nov. 14, 2023 /PRNewswire/ -- ERS electronic , the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System .

Key Points:

MUNICH, Nov. 14, 2023 /PRNewswire/ -- ERS electronic , the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System .
ERS's new "High Power Dissipation" System can dissipate wattage up to 2.5kW at -40°C on a 300 mm chuck, thereby allowing the testing of single dies as well as tests with full wafer contact.
The thermal chuck consists of several sections that can be controlled individually, thanks to ERS's patented PowerSense software.
For all other major wafer test operations, we continue to favor air as a coolant," says Klemens Reitinger, CTO of ERS electronic.