Fonon Highlights BlackStar Wafer Dicing Machine for Semiconductor Industry Applications
Fonon Corporation , a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive manufacturing, highlights its BlackStar Wafer Dicing Machine for applications in the semiconductor industry.
- Fonon Corporation , a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive manufacturing, highlights its BlackStar Wafer Dicing Machine for applications in the semiconductor industry.
- The manufacturing of semiconductor chips involves cutting, or singulating, small-scale dies out of silicon wafers.
- Fonon’s FWLD technology allows for the production of multiple size dies on the same wafer and the dicing of complex shapes.
- The BlackStar can dice a wide variety of semiconductor materials, including silicon, gallium arsenide, germanium, indium phosphide, silicon carbide, gallium nitride, gallium phosphide and other compound materials.