PIC

Africa Data Center Construction Market Industry Outlook & Forecast 2024-2029: 13% CAGR Forecast, with Market Set to Reach US$ 2.53 Billion in 2029 - ResearchAndMarkets.com

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화요일, 5월 7, 2024
Technology, Other Construction & Property, Construction & Property, Other Technology, Cloud, Carbon, USD, PIC, Investment, Vodacom, City, Eskom, Electricity, ASHRAE, Ethio telecom, Growth, Eddie O'Connor (businessman), Cloud computing, Digital Realty, PUE, Water, WUE, Ivory, PPA, Telecom, UPS, Government, Huawei, Renewable energy

The "Africa Data Center Construction Market - Industry Outlook & Forecast 2024-2029" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Africa Data Center Construction Market - Industry Outlook & Forecast 2024-2029" report has been added to ResearchAndMarkets.com's offering.
  • The Africa data center construction market by investment is expected to grow at a CAGR of 13.08% from 2023 to 2029, from US$1.21 Billion in 2023, to reach US$ 2.53 Billion in 2029.
  • In Africa, data center providers use renewable energy to power data centers for sustainable data center operations.
  • The deployment of 5G positively affects the demand for data centers and supports the growth of the Africa data center construction market.

Photonic Integrated Circuits Benefit Greatly From AI Data Center Demand, but Other Applications Are Now Emerging, Says IDTechEx

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화요일, 5월 7, 2024
Lithium, Photon, Silicon photonics, Miniaturization, Programmable interrupt controller, PIC, Photonics, Coherence, CMOS, Candy, Artificial intelligence, FMCW, Jabil, Nvidia, Quantum, Silicon, Intel, Wearable computer, GPU, Die (integrated circuit), TFLN, Glass, Atmosphere, Lidar, Quantum computing, Microscope

What are the benefits and challenges for Silicon Photonics and Photonic Integrated Circuits?

Key Points: 
  • What are the benefits and challenges for Silicon Photonics and Photonic Integrated Circuits?
  • Photonic Integrated Circuits (PICs) are tiny optical systems made of materials such as Silica (Glass), Silicon, or Indium Phosphide.
  • However, there are still significant challenges for the PIC market, such as material limitations, integration complexity, and cost management.
  • The rise of Artificial Intelligence (AI) has spurred an unprecedented demand for high-performance transceivers capable of supporting the massive data rates required by AI accelerators and data centers.

Photonic Integrated Circuits Benefit Greatly From AI Data Center Demand, but Other Applications Are Now Emerging, Says IDTechEx

Retrieved on: 
화요일, 5월 7, 2024
Lithium, Photon, Silicon photonics, Miniaturization, Programmable interrupt controller, PIC, Photonics, Coherence, CMOS, Candy, Artificial intelligence, FMCW, Jabil, Nvidia, Quantum, Silicon, Intel, Wearable computer, GPU, Die (integrated circuit), TFLN, Glass, Atmosphere, Lidar, Quantum computing, Microscope

What are the benefits and challenges for Silicon Photonics and Photonic Integrated Circuits?

Key Points: 
  • What are the benefits and challenges for Silicon Photonics and Photonic Integrated Circuits?
  • Photonic Integrated Circuits (PICs) are tiny optical systems made of materials such as Silica (Glass), Silicon, or Indium Phosphide.
  • However, there are still significant challenges for the PIC market, such as material limitations, integration complexity, and cost management.
  • The rise of Artificial Intelligence (AI) has spurred an unprecedented demand for high-performance transceivers capable of supporting the massive data rates required by AI accelerators and data centers.

IDTechEx Release New Global Silicon Photonics and Photonic Integrated Circuits Market Report

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금요일, 4월 19, 2024
Lithium, PIC, AI, Coherence, Research, Photonic integrated circuit, Silicon, Die (integrated circuit), TFLN, Lidar, Growth, Microscope

BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".

Key Points: 
  • BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".
  • This new report looks at key market players, emerging materials (such as TFLN, and BTO), and new applications such as AI, to forecast the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market.
  • Detailed examination of the latest innovations in Silicon Photonics and Photonic Integrated Circuits is provided, alongside key technical trends, analysis across the value chain, major player analysis, and granular market forecasts.
  • This PIC and Silicon Photonics market report provides the following information:
    Benchmarks and comparisons of photonic materials, with an industry breakdown by material.

IDTechEx Release New Global Silicon Photonics and Photonic Integrated Circuits Market Report

Retrieved on: 
금요일, 4월 19, 2024
Lithium, Programmable interrupt controller, PIC, AI, Coherence, Research, Photonic integrated circuit, Silicon, Die (integrated circuit), TFLN, Lidar, Growth, Microscope

BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".

Key Points: 
  • BOSTON, April 19, 2024 /PRNewswire/ -- IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, " Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts ".
  • This new report looks at key market players, emerging materials (such as TFLN, and BTO), and new applications such as AI, to forecast the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market.
  • Detailed examination of the latest innovations in Silicon Photonics and Photonic Integrated Circuits is provided, alongside key technical trends, analysis across the value chain, major player analysis, and granular market forecasts.
  • This PIC and Silicon Photonics market report provides the following information:
    Benchmarks and comparisons of photonic materials, with an industry breakdown by material.

Lightwave Logic Demonstrates Thought Leadership with Critical Contributions to Global Integrated Photonics Industry Roadmap

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화요일, 4월 16, 2024
PIC, Polymer, Silicon, Research, Logic, Interconnect, EO, LightWave 3D, Electro, MIT, Microscope

ENGLEWOOD, Colo., April 16, 2024 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic (EO) polymers to transmit data at higher speeds with less power in a small form factor, substantially contributed to the recently published "Integrated Photonics System Roadmap – International" (IPSR-I) to accelerate the high-volume commercial manufacturing of high-value integrated photonics over the next decade and beyond.

Key Points: 
  • These non-competitive industry roadmaps also serve stakeholders, investors and research analysts as a resource for industry trends, research, and commercial opportunities.
  • The IPSR-I describes a route toward building a global, aligned integrated photonics industry with the ability to help solve major societal challenges.
  • Lightwave Logic was instrumental in two chapters of the IPSR-I, serving as co-chair of the "Transceivers" chapter and chair of the "Polymers" chapter.
  • The integrated photonics roadmaps both plan and anticipate commercial opportunities as well as potential roadblocks and/or critical needs on the way to scaling the manufacturing of integrated photonics through 2040.

Statement from President of Treasury Board on Public Interest Commission Hearings for the Border Services Group

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수요일, 4월 10, 2024
PSAC, FB, Government, PIC, Canada Border Services Agency

OTTAWA, ON, April 10, 2024 /CNW/ - This week, as part of the conciliation process, the Government of Canada and the Public Service Alliance of Canada (PSAC) are entering into Public Interest Commission (PIC) hearings for the Border Services (FB) group.

Key Points: 
  • OTTAWA, ON, April 10, 2024 /CNW/ - This week, as part of the conciliation process, the Government of Canada and the Public Service Alliance of Canada (PSAC) are entering into Public Interest Commission (PIC) hearings for the Border Services (FB) group.
  • This will allow for both parties to provide their information and arguments about the matters in dispute.
  • The government is committed to reaching agreements with public service unions that are fair to employees and reasonable to taxpayers.
  • The FB Group is comprised of approximately 9,000 positions at the Canada Border Services Agency that are primarily involved in the planning, development, delivery, or management of the inspection and control of people and goods entering Canada.

Statement - Treasury Board of Canada Secretariat Statement in response to Public Service Alliance of Canada Strike Vote

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금요일, 4월 5, 2024
FB, PIC, Canada Border Services Agency, Government, PSAC

OTTAWA, ON, April 5, 2024 /CNW/ - The government is committed to reaching an agreement with the Public Service Alliance of Canada (PSAC) that is fair for employees and reasonable for Canadians.

Key Points: 
  • OTTAWA, ON, April 5, 2024 /CNW/ - The government is committed to reaching an agreement with the Public Service Alliance of Canada (PSAC) that is fair for employees and reasonable for Canadians.
  • As we move into an important stage of the bargaining process, it is disappointing to see that PSAC has chosen to call a strike vote for employees from the Canada Border Services Agency (Border Services FB group).
  • There is ample room to reach a fair and reasonable agreement with PSAC for members of the FB group.
  • To assist in this, on April 10 and 22, 2024, the employer and PSAC are attending Public Interest Commission (PIC) hearings at the Federal Public Sector Labour Relations and Employment Board.

Luxshare-TECH Preview for OFC 2024: Collaborating with Ecosystem Partners to Explore Cutting-Edge Technologies

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월요일, 3월 25, 2024
MACOM Technology Solutions, Communication, Intelligence, Partnership, Risk, Research, AOC, Die (integrated circuit), POET, Interface, Data center, PIC, Luxshare, Lidar, Keysight, Printed circuit board

The company collaborates with industry leaders like Keysight, MACOM, POET, and Spirent to drive innovation and development in optical interconnect technologies.

Key Points: 
  • The company collaborates with industry leaders like Keysight, MACOM, POET, and Spirent to drive innovation and development in optical interconnect technologies.
  • The rise of artificial intelligence and big data has fueled the widespread adoption of optical interconnect technologies in data centers and communication networks.
  • As a leading player in the optical communications industry, Luxshare-TECH actively collaborates with industry ecosystem partners to jointly research, develop, and deliver cutting-edge technologies and products.
  • At the upcoming OFC 2024, Luxshare-TECH will partner with industry leaders like Keysight Technologies, MACOM Technology Solutions, Inc., POET Technologies and Spirent Communications to showcase the latest advancements in optical interconnect technologies.

Infinera Announces New Line of High-performance 1.6 Tb/s Optics to Reduce Power per Bit by up to 75% for AI-driven Intra-Data Center Connectivity Applications

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목요일, 3월 14, 2024
Cignal, DSP, Convention, Indium phosphide, Intelligence, CPO, SAN, LPO, SVP, AI, Data-rate units, PIC, Computer data storage

ICE-D optics are designed to dramatically lower cost and power per bit while providing intra-data center connectivity at speeds of 1.6 terabits per second (Tb/s) and greater.

Key Points: 
  • ICE-D optics are designed to dramatically lower cost and power per bit while providing intra-data center connectivity at speeds of 1.6 terabits per second (Tb/s) and greater.
  • This technology enables data center operators to cost-effectively keep pace with relentless growth in bandwidth.
  • “Intra-data center bandwidth is growing at an unprecedented rate as artificial intelligence applications transform connectivity demands between processing devices,” said Scott Wilkinson, Lead Analyst, Networking Components at Cignal AI.
  • ICE-D test chips are currently available and have demonstrated a reduction in power per bit by as much as 75 percent while simultaneously increasing connectivity speed.