Amkor Technology

Demand for NVIDIA’s Blackwell Platform Expected to Boost TSMC’s CoWoS Total Capacity by Over 150% in 2024, Says TrendForce

Retrieved on: 
금요일, 5월 3, 2024
Semiconductor, Data Management, Technology, Software, Artificial Intelligence, Hardware, Blog, Table, AMD, TSMC, HBM, News, AI, Amkor Technology, H100, Communication, Intel, NVIDIA, ASIC, GPU, Graphics processing unit, HBM3, Video game

The inclusion of the GB200, B100, and B200 in NVIDIA’s B-series will boost demand for CoWoS capacity, leading TSMC to raise its total CoWoS capacity needs for 2024.

Key Points: 
  • The inclusion of the GB200, B100, and B200 in NVIDIA’s B-series will boost demand for CoWoS capacity, leading TSMC to raise its total CoWoS capacity needs for 2024.
  • The estimated monthly capacity by the end of the year is expected to reach nearly 40K—a staggering 150% year-over-year increase.
  • By 2025, the planned total capacity could nearly double, with NVIDIA's demand expected to make up more than half of this capacity.
  • Secondly, there will be a continued expansion in HBM capacity to boost the overall computational efficiency and system bandwidth of AI servers.

Amkor Technology Reports Financial Results for the First Quarter 2024

Retrieved on: 
월요일, 4월 29, 2024
Semiconductor, Hardware, Manufacturing, Technology, Packaging, Amkor Technology, Investment, GAAP

The reconciliation to the comparable GAAP measure is included below under “Selected Operating Data.”

Key Points: 
  • The reconciliation to the comparable GAAP measure is included below under “Selected Operating Data.”
    At March 31, 2024, total cash and short-term investments was $1.6 billion, and total debt was $1.2 billion.
  • The company paid a quarterly dividend of $0.07875 per share on April 1, 2024.
  • The declaration and payment of future dividends, as well as any record and payment dates, are subject to the approval of the Board of Directors.
  • To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com .

EPC Power names Jim Fusaro as CEO

Retrieved on: 
수요일, 4월 24, 2024
Alternative Energy, Energy, Environment, Other Energy, Utilities, Assembly, Acceleration, ATI Technologies, Solar energy, EVP, M series, Amkor Technology, Culture, Bloomberg L.P., Array, Honeywell, EPC, Growth, Advanced Materials, Renewable energy

“I look forward to working with Jim to grow EPC into the premier global provider of utility-scale digital power conversion.

Key Points: 
  • “I look forward to working with Jim to grow EPC into the premier global provider of utility-scale digital power conversion.
  • The proliferation of renewable generation requires new technologies to ensure the stability, security and reliability of our power infrastructure.
  • EPC Power is equally well positioned to serve the massive and growing solar energy market with the upcoming release of its groundbreaking M Series inverter.
  • “On behalf of the Board of Directors, it is my pleasure to welcome Jim as CEO of EPC Power.

Amkor Technology to Announce First Quarter 2024 Financial Results on April 29, 2024

Retrieved on: 
화요일, 4월 9, 2024
Technology, Hardware, Semiconductor, Webcast, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the first quarter of 2024 after the close of trading on the Nasdaq Global Select Market on Monday, April 29, 2024.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the first quarter of 2024 after the close of trading on the Nasdaq Global Select Market on Monday, April 29, 2024.
  • Amkor management will host a conference call and webcast to review the results on Monday, April 29, 2024, at 5:00 p.m. Eastern Time (ET).
  • To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com .
  • An archived replay of the webcast will be available after completion of the call.

Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions

Retrieved on: 
월요일, 4월 8, 2024
Professional Services, Semiconductor, Consumer Electronics, Technology, Other Technology, Outsourcing Business, Hardware, Amkor Technology, Partnership, Internet of things, Automotive industry, Engineering

With this long-term agreement, Infineon and Amkor further strengthen their partnership, extending the classical outsourced semiconductor assembly and test (OSAT) business model.

Key Points: 
  • With this long-term agreement, Infineon and Amkor further strengthen their partnership, extending the classical outsourced semiconductor assembly and test (OSAT) business model.
  • The cooperation further strengthens the European semiconductor supply chain and contributes to making it more resilient – especially for automotive customers.
  • “Infineon and Amkor are jointly increasing geographical resilience and supply security for our customers.
  • This collaboration represents another milestone for both companies in enhancing supply chain resiliency for advanced products supporting Automotive & Industrial end markets.”

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Retrieved on: 
화요일, 3월 19, 2024
CHIPS, Intel, Arizona State University, FOWLP, Development, Amkor Technology, Research, Electronics, Artificial intelligence, ASU, SWAP, Science, Faculty, Student, Heart, Deca, Machine learning, Government, TSMC, Telescopic sight

TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.

Key Points: 
  • TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
  • The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale.
  • In collaboration with Deca, ASU is committed to establishing onshore access to these advanced-packaging capabilities.
  • The Gen 2 M-Series including Adaptive Patterning technology brings unprecedented scaling to higher densities for heterogeneous integration and chiplet applications.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
월요일, 3월 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
월요일, 3월 25, 2024
Polychlorinated biphenyl, Growth, Kyocera, IC, Amkor Technology, Internet of things, LG Chem, Tablet, Electronics, AI, Texas Instruments, SOP, SMT, PCB, Ceramic

They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.

Key Points: 
  • They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices.
  • In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.
  • Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management.
  • This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics.

Amkor Technology to Present at Upcoming Conferences

Retrieved on: 
화요일, 2월 27, 2024
Apps, Applications, Technology, Mobile, Wireless, Semiconductor, Software, Networks, Internet, Hardware, Data Management, Kimpton Clocktower Hotel, KeyBank, Conference, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its participation in the following upcoming investor conferences:

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its participation in the following upcoming investor conferences:
    Morgan Stanley Technology, Media & Telecom Conference on Tuesday, March 5, 2024.
  • Amkor’s presentation will occur at 1:20 pm Pacific Time (4:20 pm Eastern Time) at The Palace Hotel in San Francisco, CA.
  • KeyBanc Capital Markets Emerging Technology Summit on Wednesday, March 6, 2024.
  • Live webcasts and replays of the presentations will be available on the Investor Relations section of Amkor’s website at ir.amkor.com.

Amkor Technology Declares Quarterly Dividend

Retrieved on: 
화요일, 2월 20, 2024
Electronic Design Automation, Semiconductor, Engineering, Technology, Manufacturing, Hardware, Amkor Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a quarterly cash dividend of $0.07875 per share on the company’s common stock.

Key Points: 
  • Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that its Board of Directors has approved a quarterly cash dividend of $0.07875 per share on the company’s common stock.
  • The dividend will be payable on April 1, 2024 to stockholders of record as of the close of business on March 12, 2024.