Microcontroller

Andes Releases AndeSight™ IDE v5.1 to Simplify Software Development for RISC-V Heterogeneous Multiprocessor and AI

Retrieved on: 
수요일, 4월 6, 2022
IDE, LinkedIn, Align Technology, RVV, Library, SMP, NN, TWSE, Cloud computing, Microcontroller, AI (computer virus), RVP, Socs, AI, Linux, CTO, Asymmetric, Communication, OS, Software, TensorFlow, Twitter, FPU, Asymmetric multiprocessing, Symmetry, Architecture, GLOBE, Vector processor, Tool, Andes Technology, Solution, SIN, Artificial neural network, Efficiency, ISA, DSP, FP16, Awareness, SIMD, AMP, Video game console, Computer data storage, Vector, Facebook

As to AMP (Asymmetric Multiprocessing) demands, AndeSight integrates the OpenAMP which provides communication infrastructure between heterogeneous systems and enables AMP applications to leverage parallelism offered by multiprocessor systems.

Key Points: 
  • As to AMP (Asymmetric Multiprocessing) demands, AndeSight integrates the OpenAMP which provides communication infrastructure between heterogeneous systems and enables AMP applications to leverage parallelism offered by multiprocessor systems.
  • AndeSight provides the user-friendly multicore debugging feature for both SMP and AMP systems in one IDE interface.
  • AndeSight also offers the record-and-replay scripting capability to save interactive steps for easy issue reproduction and automatic testing.
  • With comprehensive AndeSight IDE, customers can release their software with more features, better performance and higher quality in a shorter time.

Semiconductor Intellectual Property (IP) Market worth $7.2 billion by 2026 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
금요일, 1월 28, 2022
Knowledge, Growth, Power supply, Security, SME, Microchip Technology, Silicon carbide, Synopsys, Power electronics, Intelligence, Semiconductor, Electronics, Research, COVID-19, Medicine, Texas Instruments, GEM, Gallium nitride, Telecommunication, Lighting, Microcontroller, Transport, LED, Analysis, ROW, Advanced Micro Devices, Consumer electronics, Industry, Communication, Intel, Indium phosphide, Gallium arsenide, DSP, Cadence Design Systems, Inc. v. Avanti Corp, Committee on Transport, Industry, Communications, Energy, Science, and Technology, Marketing, Geography, Qualcomm, Automotive industry

The global market players are experiencing increased demand for semiconductors such as cores and processors from countries such as China, Japan, Taiwan and South Korea.

Key Points: 
  • The global market players are experiencing increased demand for semiconductors such as cores and processors from countries such as China, Japan, Taiwan and South Korea.
  • Major players in the chip industry in APAC include Intel (US), Qualcomm (US), Advanced Micro Devices, Inc. (US), and Texas Instruments (US).
  • The consumer electronics vertical would continue to dominate the market in APAC.
  • Increasing demand for consumer electronics, especially smartphones, is expected to drive the growth of the semiconductor IP market in APAC.

Semiconductor Intellectual Property (IP) Market worth $7.2 billion by 2026 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
금요일, 1월 28, 2022
Knowledge, Growth, Power supply, Security, SME, Microchip Technology, Silicon carbide, Synopsys, Power electronics, Intelligence, Semiconductor, Electronics, Research, COVID-19, Medicine, Texas Instruments, GEM, Gallium nitride, Telecommunication, Lighting, Microcontroller, Transport, LED, Analysis, ROW, Advanced Micro Devices, Consumer electronics, Industry, Communication, Intel, Indium phosphide, Gallium arsenide, DSP, Cadence Design Systems, Inc. v. Avanti Corp, Committee on Transport, Industry, Communications, Energy, Science, and Technology, Marketing, Geography, Qualcomm, Automotive industry

The global market players are experiencing increased demand for semiconductors such as cores and processors from countries such as China, Japan, Taiwan and South Korea.

Key Points: 
  • The global market players are experiencing increased demand for semiconductors such as cores and processors from countries such as China, Japan, Taiwan and South Korea.
  • Major players in the chip industry in APAC include Intel (US), Qualcomm (US), Advanced Micro Devices, Inc. (US), and Texas Instruments (US).
  • The consumer electronics vertical would continue to dominate the market in APAC.
  • Increasing demand for consumer electronics, especially smartphones, is expected to drive the growth of the semiconductor IP market in APAC.

Notice to Disregard -- Andes Technology Corp.

Retrieved on: 
목요일, 11월 25, 2021
News, GLOBE, Release, GlobeNewswire, Microcontroller, Animal, Publishing

Shanghai, Nov. 25, 2021 (GLOBE NEWSWIRE) -- We are advised by Andes Technology Corp. that journalists and other readers should disregard the news release,HPMicro Semiconductor Announces the Release of the HPM6000 series of Microcontrollers with AndesCore dual D45 cores issued November 24, 2021, over GlobeNewswire.

Key Points: 
  • Shanghai, Nov. 25, 2021 (GLOBE NEWSWIRE) -- We are advised by Andes Technology Corp. that journalists and other readers should disregard the news release,HPMicro Semiconductor Announces the Release of the HPM6000 series of Microcontrollers with AndesCore dual D45 cores issued November 24, 2021, over GlobeNewswire.

STMicroelectronics announces changes in the Executive Committee

Retrieved on: 
목요일, 11월 18, 2021
S-1 Executive Committee, Internet, EMEA, Adoption, CEO, Vehicle Production Group, Intel, Cassis, STMicroelectronics, Executive Committee, Chief innovation officer, Grenoble Institute of Technology, OMAP, Company, Acquisition, NYSE, Grenoble Institute of Political Studies, ST, Social responsibility, STM, Texas Instruments, Corporate social responsibility, Leadership, Solution, Acosta Sales & Marketing, Goal, Artificial intelligence, ERM, Demand, Political science, INPG, MEMS, Supervisory board, Innovation, VPU, Digital, Microcontroller, Engineering, Harvard Business School, Remi El-Ouazzane, Management

Geneva, November 18, 2021 Upon the proposal of STs President & CEO Jean-Marc Chery, the Supervisory Board of STMicroelectronics (NYSE: STM) has approved the following changes to the Executive Committee, entrusted with the management of the Company and led by Mr. Chery as its Chairman.

Key Points: 
  • Geneva, November 18, 2021 Upon the proposal of STs President & CEO Jean-Marc Chery, the Supervisory Board of STMicroelectronics (NYSE: STM) has approved the following changes to the Executive Committee, entrusted with the management of the Company and led by Mr. Chery as its Chairman.
  • These changes will be effective January 1st, 2022.
  • Lorenzo Grandi is confirmed in his Chief Financial Officer role and will be appointed President of Finance, Purchasing, ERM and Resilience.
  • Jerome Roux, currently Executive Vice President, Asia Pacific Region, will be appointed President, Sales & Marketing.

NGK, TOREX, Ossia Start Collaboration to Spread Use of Wireless Power Transmission/Transfer Systems

Retrieved on: 
수요일, 11월 17, 2021
WPT, Environment, Technology, Time, Adoption, Industry, General manager, NAS, LTD, Motion, ICS, Personal computer, IOT, XCL, IC, Ceramic, Nature, TSE, Electrode, DCDC, Communication, MCU, Hertz, Microcontroller, NGK, Lithium, Electronic component, Electric battery, Electric motor, Mobile phone

REDMOND, Wash., Nov. 17, 2021 /PRNewswire/ --NGK INSULATORS, LTD. (hereinafter, "NGK"), TOREX SEMICONDUCTOR LTD. (hereinafter, "TOREX") and Ossia Inc. (hereinafter "Ossia") have started working together to spread the use of wireless power transmission/transfer (WPT) systems.

Key Points: 
  • REDMOND, Wash., Nov. 17, 2021 /PRNewswire/ --NGK INSULATORS, LTD. (hereinafter, "NGK"), TOREX SEMICONDUCTOR LTD. (hereinafter, "TOREX") and Ossia Inc. (hereinafter "Ossia") have started working together to spread the use of wireless power transmission/transfer (WPT) systems.
  • At the higher frequency of 5.8GHz, it enables smaller receivers and more precise control of power supply.
  • NGK, TOREX and Ossia are working together to spread the use of 5.8 GHz band WPT.
  • The WPT power receiver development kit comprises the Ossia Antenna that extracts radio frequency as power, EnerCera batteries that store the power and a power supply IC that stably supplies the stored power at an optimal voltage to an MCU*2 or sensor.

Truechip Introduces Silicon IP for Network on Chip (NoC) Focussed for TileLink RISC-V Chips

Retrieved on: 
금요일, 10월 29, 2021
RISC, VIP, IP, RTL, Policy, DFT, FPGA, Nitin, Microcontroller, SOC, Software, UH, Silicon, CEO, AI, Solution, ASIC, Cable television

This silicon IP named as NoC Silicon IP for RISC-V based chips supporting the TileLink protocol.

Key Points: 
  • This silicon IP named as NoC Silicon IP for RISC-V based chips supporting the TileLink protocol.
  • I am thrilled to announce that we are launching an early adopter version of NoC Silicon IP for TileLink protocol.
  • Current version of our NoC Silicon IP supports TileLink UL and UH conformance levels.
  • This is the first of our Silicon IP offerings and we plan to do only selective and strategic Silicon IPs".

New ISO 26262 Functional Safety Packages Simplify Design of ASIL B and ASIL C Safety Applications Using dsPIC®, PIC18 and AVR® Microcontrollers

Retrieved on: 
수요일, 10월 20, 2021
MCU, Information Satellite Systems Reshetnev, LIN, FSM, Risk, Documentation, Certification, IEC, AVR, PIC18, ISO 26262, Ecosystem, PIC, SGS, Diagnosis, Highway Safety Manual, CAN, Functional safety, IEC 61508, FMEDA, Safety, DSC, Microchip Technology, ASIL, AEC, GLOBE, FD, IDE, Electronics, ISO, Compliance, Microcontroller, Solution, Classification, Failure modes, effects, and diagnostic analysis, MPLAB, Medical device, Agriculture, Audit, Risk management

Microchip Technology Inc. (Nasdaq: MCHP) is offering newly certified functional safety packages to enable engineers to develop their products as per the ISO 26262 functional safety standard.

Key Points: 
  • Microchip Technology Inc. (Nasdaq: MCHP) is offering newly certified functional safety packages to enable engineers to develop their products as per the ISO 26262 functional safety standard.
  • Microchip is announcing the release of ISO 26262 functional safety packages for dsPIC33C digital signal controllers (DSCs), PIC18 and AVR microcontrollers (MCUs) that accelerate the development of safety-critical designs targeting ASIL B and ASIL C safety level and certification efforts.
  • The functional safety packages listed below, together with our development tools that come with the safety documents, allow engineers to develop compliant systems.
  • The functional safety full package offers a complete solution for beginners and seasoned experts to simplify the design and certification of safety-critical automotive applications.

With Market Size Valued at $1.9 Billion by 2026, it`s a Robust Outlook for the Global Free Space Optics (FSO) and Visible Light Communication (VLC) Market

Retrieved on: 
금요일, 10월 8, 2021
General Electric Company, Visible light communication, FSO, SAN, GIA, CAGR, COVID-19, Microcontroller, Software, Marketing, Growth, Panasonic, Technology, Internet, Players, Free-space optical communication, Photodetector, Forecasting, VLC, Intelligence, Research, Pet

SAN FRANCISCO, Oct. 8, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Free Space Optics (FSO) and Visible Light Communication (VLC) - Global Market Trajectory & Analytics" .

Key Points: 
  • SAN FRANCISCO, Oct. 8, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Free Space Optics (FSO) and Visible Light Communication (VLC) - Global Market Trajectory & Analytics" .
  • Geographies:World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
  • Previews provide deep insider access to business trends; competitive brands; domain expert profiles; and market data templates and much more.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices

Retrieved on: 
목요일, 10월 7, 2021
Software, Networks, Hardware, Data Management, Consumer Electronics, Technology, Semiconductor, Mobile, Wireless, Tablet, LSI, Efficiency, MCU, Electronics, Memory, Television, Future, COVID-19, Multimedia, MRAM, Big data, SFF, MP, Samsung Electronics, Adoption, News, 3D, Health information management, LED, GAA, Connected Devices, Smart, Microcontroller, MBCFET, RF, Samsung, PPA, IOT, Leadership, FinFET, Solution, Technology, Silicon, Ecosystem, Semiconductor, Mobile phone

View the full release here: https://www.businesswire.com/news/home/20211007005441/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20211007005441/en/
    Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices (Graphic: Business Wire)
    With a theme of Adding One More Dimension, the multi-day virtual event is expected to draw over 2,000 global customers and partners.
  • At this years event, Samsung will share its vision to bolster its leadership in the rapidly evolving foundry market by taking each respective part of foundry business to the next level: process technology, manufacturing operations, and foundry services.
  • Samsung Foundry is continuously improving its FinFET process technology to support specialty products with cost-effective and application-specific competitiveness.
  • The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions.