Scalability

SecureIQLab Releases the First-Ever "Secure-by-Design" Web Application & API Protection (WAAP) Public Test Report

Retrieved on: 
木曜日, 5月 9, 2024
Deployment, Airlock, Imperva, Internet, Scalability, Attack, Fortinet, TCO, API, Amazon Web Services, Senior, Microsoft, Barracuda, Azure, Ease, OWASP, OE, Akamai Technologies, ROSI, Online shopping

AUSTIN, Texas, May 9, 2024 /PRNewswire/ -- SecureIQLab LLC, a leading provider of cloud security validation solutions, proudly announces the release of the first-ever Web Application & API Protection (WAAP) test to include the quantification of the critical secure-by-design and operational efficiency metrics.

Key Points: 
  • AUSTIN, Texas, May 9, 2024 /PRNewswire/ -- SecureIQLab LLC, a leading provider of cloud security validation solutions, proudly announces the release of the first-ever Web Application & API Protection (WAAP) test to include the quantification of the critical secure-by-design and operational efficiency metrics.
  • SecureIQLab Releases the First-Ever "Secure-by-Design" Web Application & API Protection (WAAP) Public Test Report.
  • According to Jay Pathak, SecureIQLab's Chief Scientist, "Security products have come under increasing fire by cyber-criminals and nation-states.
  • Without enforcing a secure-by-design approach, if a security product is compromised, the assurance of safeguarding everything the solution is intended to protect becomes uncertain."

Kepler Partners to Develop In-Space Optical Communications Network for HydRON

Retrieved on: 
水曜日, 4月 10, 2024
Internet, Scalability, LEO, Airbus, SCOT, ESA, Partnership, Orbit, Spacecraft, Airbus Defence and Space, Senior, Pathfinder, Government, Tesat-Spacecom, Communications satellite

TORONTO, April 10, 2024 (GLOBE NEWSWIRE) -- Kepler Communications, Inc. has entered into an agreement with TESAT-Spacecom and Airbus Defence and Space to develop a high bandwidth optical communications network in low Earth orbit (LEO) to address emerging opportunities such as the European Space Agency’s (ESA) High Throughput Optical Network (HydRON) program.

Key Points: 
  • TORONTO, April 10, 2024 (GLOBE NEWSWIRE) -- Kepler Communications, Inc. has entered into an agreement with TESAT-Spacecom and Airbus Defence and Space to develop a high bandwidth optical communications network in low Earth orbit (LEO) to address emerging opportunities such as the European Space Agency’s (ESA) High Throughput Optical Network (HydRON) program.
  • Led by Kepler, the companies are collaborating to deliver real-time optical communications to the market, leveraging the strengths of each entity to provide an innovative solution for key opportunities such as HydRON.
  • The project will demonstrate the world’s first operational optical multi-orbit transport network, enhancing the capabilities of spaceborne and terrestrial networks.
  • “Our team is proud to develop a new generation of optical communications technology in space.”
    The partnership is dedicated to delivering a comprehensive and compelling proposal to ESA, driving forward the evolution of optical space and ground network capabilities.

Intel Brings AI-Platform Innovation to Life at the Olympic Games

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水曜日, 4月 17, 2024
Software, Men, Mobile, Wireless, Sports, General Sports, Data Management, Consumer, Apps, Applications, Technology, Artificial Intelligence, Olympics, Women, Internet, International, VVC, Scalability, Partner, Acceleration, AI, Team, Partnership, Artificial intelligence, 3D, History, IOC, Smartphone, Automation, VR, International Paralympic Committee, Olympic Broadcasting Services, Intel, Olympic Games, Athlete, OTT, Multimedia, Xeon, OBS, Data-rate units, Samsung

Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.

Key Points: 
  • Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
  • The International Olympic Committee (IOC) will embed Intel AI platform technology throughout the Olympic and Paralympic Games experience in three key areas.
  • To help continue the legacy of the Olympic Games, neural object cloning will transform video of Olympic collections into 3D digital artifacts.
  • Intel has a storied history of innovation at the Olympic and Paralympic Games, accelerating the adoption of 5G, VR, drones and AI technology platforms to enhance the experience.

Unlocking the Potential of AI Optimised Crypto Mining: A Deep Dive into Hash AI

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金曜日, 4月 5, 2024
GPU, Growth, Environment, Partnership, Carbon footprint, AI, Graphics processing unit, Scalability, Future, Artificial intelligence, Mining, Cryptocurrency

By seamlessly integrating Artificial Intelligence with an extensive array of in-house GPUs, Hash AI has crafted a unique solution that redefines efficiency and profitability in crypto mining.

Key Points: 
  • By seamlessly integrating Artificial Intelligence with an extensive array of in-house GPUs, Hash AI has crafted a unique solution that redefines efficiency and profitability in crypto mining.
  • • AI-Enhanced Mining: Proprietary AI technology selects the most profitable coins to mine in real-time.
  • Hash AI addresses these issues by offering scalable in-house resources, and utlising AI in mining.
  • The Future with Hash AI:
    At its core, Hash AI is not just about mining; it's about setting the stage for a sustainable, efficient, and highly profitable crypto mining environment.

Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

Retrieved on: 
月曜日, 3月 25, 2024
Semiconductor, Technology, Mobile, Wireless, Software, 5G, Artificial Intelligence, BOW, HBM, ICS, IO, GPU, Memory, HPC, AI, High Bandwidth Memory, Rump, Graphics processing unit, Scalability, Booth, ChatGPT, Artificial intelligence, Multimedia, MicroLED, UCIe, Video game

Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).

Key Points: 
  • Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA ( https://www.ofcconference.org/en-us/home/ ).
  • The chiplet interconnect extends ultra-high density die-to-die (D2D) connections up to 10m at multi-Tbps/mm shoreline bandwidth density and class leading sub-pJ/bit energy efficiency.
  • The LightBundle chiplet interconnect extends HBM and other ultra-high performance D2D connections up to 10m while dissipating
  • “At Avicena, we are excited to announce our ultra-low power scalable chiplet interconnect based on our LightBundle platform,” says Bardia Pezeshki, Founder and CEO of Avicena.

Lumentum Thought Leaders to Present on Leading Edge Innovations and the Role of Photonics in AI Data Centers at OFC 2024

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金曜日, 3月 22, 2024
Apps, Applications, Mobile, Wireless, Technology, Semiconductor, Engineering, Software, Manufacturing, Audio, Video, Networks, Hardware, Cloud, PDT, Research, Optics, Conference, MSA, Optica, PSC, AI, Scalability, ROADM, Photonics, Management

Alan Lowe, CEO and President of Lumentum, will take part in the Optica Executive Forum’s CEO Panel at OFC, discussing the evolution and future of the industry.

Key Points: 
  • Alan Lowe, CEO and President of Lumentum, will take part in the Optica Executive Forum’s CEO Panel at OFC, discussing the evolution and future of the industry.
  • This panel will provide a platform for industry leaders to discuss current challenges, opportunities, and the future of the optical communication industry.
  • This session is scheduled for Wednesday, March 27, 2024, from 5:00 pm to 7:00 pm PDT in Room 15 at OFC.
  • For additional information about Lumentum’s presence at OFC 2024, please visit the official event page at https://www.lumentum.com/en/ofc-2024 or contact the customer service team at [email protected] .

Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem

Retrieved on: 
水曜日, 3月 13, 2024
Automotive Manufacturing, Automotive, Technology, Manufacturing, Semiconductor, Vehicle Technology, Software, Artificial Intelligence, Engineering, Hardware, Electronic Design Automation, SOC, DSP, Prevalence, Chiplet, Electronics, ADAS, Blog, CDNS, 3D, AI, SDV, Cadence Design Systems, Architecture, Scalability, IP, NPU, Ecosystem, Workload, Machine learning, SDK, Silicon

The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and interface interoperability to foster industry-wide collaboration, enable heterogeneous integration and expand system innovation.

Key Points: 
  • The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and interface interoperability to foster industry-wide collaboration, enable heterogeneous integration and expand system innovation.
  • The solution is architected and built using the latest generation of Arm® Automotive Enhanced technologies and Cadence® IP.
  • Coupled with the need to quickly customize 3D-IC systems for a plethora of automotive applications, chiplets are an increasingly attractive solution.
  • The new solution architecture and reference design provide a standard for chiplet interface interoperability, addressing a critical industry need.

SSI Alliance Unveils Sustainable Data Center Infrastructure Ecosystem Landscape

Retrieved on: 
水曜日, 3月 20, 2024
Cloud, Knowledge, Sustainability, Organization, PDF, ESG, PNG, AI, Cloud Native Computing Foundation, Software, Carbon, Silicon, CNCF, Scalability, Cloud computing, Linux, Landscape, Ecosystem, Linux Foundation, Equinix

NEW YORK, March 20, 2024 /PRNewswire-PRWeb/ -- The Sustainable and Scalable Infrastructure Alliance(SSIA), a community and open standard for sustainable enterprise and edge data center innovation, today released the first version of its sustainable data center infrastructure landscape and a dedicated working group to capture, organize and promote the hundreds of diverse companies and projects supporting a sustainable digital infrastructure future. Inspired by the CNCF (Cloud Native Computing Foundation) Landscape, the SSI Alliance Landscape, available online at landscape.ssia.org, organizes and categorizes the companies and projects that enable a net zero carbon digital infrastructure future.

Key Points: 
  • NEW YORK, March 20, 2024 /PRNewswire-PRWeb/ -- The Sustainable and Scalable Infrastructure Alliance (SSIA), a community and open standard for sustainable enterprise and edge data center innovation, today released the first version of its sustainable data center infrastructure landscape and a dedicated working group to capture, organize and promote the hundreds of diverse companies and projects supporting a sustainable digital infrastructure future.
  • Inspired by the CNCF (Cloud Native Computing Foundation) Landscape, the SSI Alliance Landscape, available online at landscape.ssia.org, organizes and categorizes the companies and projects that enable a net zero carbon digital infrastructure future.
  • The landscape includes public and private companies that span sectors including data center construction, cooling, operations, fluids & chemicals, silicon, building management, cloud computing, and data transfer.
  • To access the interactive landscape, visit https://landscape.ssia.org/ and for more information about the SSI Alliance and membership, visit, https://www.ssia.org/about-us/ .

MiTAC and TYAN Present Cutting-Edge Server Solutions for Cloud Computing at CloudFest 2024

Retrieved on: 
火曜日, 3月 19, 2024
Emerald, DIMM, Intel, Transport, Memory, LAN, UDIMM, SATA, NVM Express, Computing, Europa-Park, DSG, AI, CX, Family, OCP, MiTAC, Scalability, Cloud computing, Solid-state drive, AMD, Fox Creek Pass, Central processing unit, Video game

RUST, Germany, March 19, 2024 /PRNewswire/ -- Today, the subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, unveil their latest cloud server platforms at CloudFest 2024, Booth #H12.

Key Points: 
  • RUST, Germany, March 19, 2024 /PRNewswire/ -- Today, the subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, unveil their latest cloud server platforms at CloudFest 2024, Booth #H12.
  • Over a decade, MiTAC and Intel have been vital strategic partners, working together to create top-tier server products for cloud computing and next-gen demanding workloads.
  • Today, MiTAC showcases one of its DSG product lineups tailored for cloud, enterprise, and AI workloads at CloudFest.
  • The Intel Server System M50FCP1UR204 , presented by MiTAC, represents the 1U solution from the Intel Server M50FCP Family (formerly Fox Creek Pass).

MiTAC and TYAN Present Cutting-Edge Server Solutions for Cloud Computing at CloudFest 2024

Retrieved on: 
火曜日, 3月 19, 2024
Emerald, DIMM, Intel, Transport, Memory, LAN, UDIMM, SATA, NVM Express, Computing, Europa-Park, DSG, AI, CX, Family, OCP, MiTAC, Scalability, Cloud computing, Solid-state drive, AMD, Fox Creek Pass, Central processing unit, Video game

RUST, Germany, March 19, 2024 /PRNewswire/ -- Today, the subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, unveil their latest cloud server platforms at CloudFest 2024, Booth #H12.

Key Points: 
  • RUST, Germany, March 19, 2024 /PRNewswire/ -- Today, the subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, unveil their latest cloud server platforms at CloudFest 2024, Booth #H12.
  • Over a decade, MiTAC and Intel have been vital strategic partners, working together to create top-tier server products for cloud computing and next-gen demanding workloads.
  • Today, MiTAC showcases one of its DSG product lineups tailored for cloud, enterprise, and AI workloads at CloudFest.
  • The Intel Server System M50FCP1UR204 , presented by MiTAC, represents the 1U solution from the Intel Server M50FCP Family (formerly Fox Creek Pass).