TDP

CoolIT Systems Unveils OMNI™ All-Metal Coldplates Featuring Split-Flow™ Technology

Retrieved on: 
Giovedì, Maggio 9, 2024
AMD, HPC, Risk, AI, ODM, OEM, AB, DLC, Intel, CTE, TDP, OMNI, Central processing unit, Graphics processing unit

CALGARY, AB, May 9, 2024 /PRNewswire-PRWeb/ -- CoolIT Systems (CoolIT), the world leader in liquid cooling, proudly announces its groundbreaking OMNI™ All-Metal Coldplates with Split-Flow™ technology. Engineered to meet demanding AI, HPC, and dense enterprise workloads, CoolIT's OMNI Coldplates offer industry-leading performance, reliability and scalability.

Key Points: 
  • CALGARY, AB, May 9, 2024 /PRNewswire-PRWeb/ -- CoolIT Systems (CoolIT), the world leader in liquid cooling, proudly announces its groundbreaking OMNI™ All-Metal Coldplates with Split-Flow™ technology.
  • CoolIT Systems (CoolIT), the world leader in liquid cooling, proudly announces its groundbreaking OMNI™ All-Metal Coldplates with Split-Flow™ technology.
  • "Our engineering team has raised the bar on our already industry-leading coldplates," said Patrick McGinn, Chief Operating Officer of CoolIT.
  • Engineered to handle thermal loads exceeding 1,500 W TDP and 300 W/cm2, OMNI Coldplates with Split-Flow™ technology deliver up to 60% lower thermal resistance compared with standard coldplates.

LattePanda Team Launches LattePanda Mu - a Micro x86 Compute Module for Custom Design Solutions

Retrieved on: 
Mercoledì, Aprile 10, 2024
CPU, NAS, Internet of things, SATA, NIC, Raspberry, HDMI, LattePanda, Library, Freedom, Microsoft Windows, DisplayPort, Network-attached storage, Intel, GitHub, TDP, Robotics, GPU, USB, Linux, Video game

SHANGHAI, April 10, 2024 /PRNewswire/ -- The LattePanda team launched the LattePanda Mu , an exceptional micro x86 compute module poised to swiftly empower custom design solutions.

Key Points: 
  • SHANGHAI, April 10, 2024 /PRNewswire/ -- The LattePanda team launched the LattePanda Mu , an exceptional micro x86 compute module poised to swiftly empower custom design solutions.
  • The LattePanda Mu demonstrates superior CPU performance compared to the Raspberry Pi 5 and excels in GPU capabilities, guaranteeing seamless operation for complex computational tasks and demanding applications.
  • By integrating the most intricate components, the LattePanda Mu provides users with the freedom to design simpler elements.
  • Moreover, customization services cater to various specialized requirements, enabling users to unleash the full potential of the LattePanda Mu and achieve exceptional results.

LattePanda Team Launches LattePanda Mu - a Micro x86 Compute Module for Custom Design Solutions

Retrieved on: 
Mercoledì, Aprile 10, 2024
CPU, NAS, Internet of things, SATA, NIC, Raspberry, HDMI, LattePanda, Library, Freedom, Microsoft Windows, DisplayPort, Network-attached storage, Intel, GitHub, TDP, Robotics, GPU, USB, Linux, Video game

SHANGHAI, April 10, 2024 /PRNewswire/ -- The LattePanda team launched the LattePanda Mu , an exceptional micro x86 compute module poised to swiftly empower custom design solutions.

Key Points: 
  • SHANGHAI, April 10, 2024 /PRNewswire/ -- The LattePanda team launched the LattePanda Mu , an exceptional micro x86 compute module poised to swiftly empower custom design solutions.
  • The LattePanda Mu demonstrates superior CPU performance compared to the Raspberry Pi 5 and excels in GPU capabilities, guaranteeing seamless operation for complex computational tasks and demanding applications.
  • By integrating the most intricate components, the LattePanda Mu provides users with the freedom to design simpler elements.
  • Moreover, customization services cater to various specialized requirements, enabling users to unleash the full potential of the LattePanda Mu and achieve exceptional results.

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Retrieved on: 
Martedì, Aprile 9, 2024
Temperature, COM Express, TSN, Intel, Communication, Time-Sensitive Networking, MIPI, Internet of things, LAN, LPDDR5, Transport, AI, PCI Express, Intel Atom, TCC, Robotics, USB, SMARC, Gracemont, Oklahoma, USB 3.2, HMI, TDP, Type 6, CPU, Computer data storage

SAN JOSE, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • "Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward."
  • Utilizing Intel's Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.
  • For more information about ADLINK COMs, visit the product pages for: cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules.
  • Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

Ventiva Announces Partnership with Clarion for Mass Production of ICE Electronics Manufacturing Expansion in Malaysia

Retrieved on: 
Martedì, Marzo 19, 2024
Technology, Batteries, Hardware, Consumer Electronics, Certification, Plasma, BHD, International Automotive Task Force, Partnership, ICE, Thermal design power, TDP, Crystal

Ventiva , a leading company in active cooling solutions for electronic devices, today announced its partnership with Crystal Precision (M) Sdn.

Key Points: 
  • Ventiva , a leading company in active cooling solutions for electronic devices, today announced its partnership with Crystal Precision (M) Sdn.
  • Bhd., a member of Clarion (Malaysia) Group of Companies, to manufacture its unique Ionic Cooling Engine (ICE) technology.
  • A dedicated production line in Crystal Precision’s 40,000-square-foot factory will be equipped to produce up to four million units per month.
  • Currently targeted at laptop computers, Ventiva delivers thermal subsystems for up to 30 watts of Thermal Design Power (TDP).

AMD Showcases AEWIN High-Density Edge Computing Server at Embedded World 2024

Retrieved on: 
Martedì, Aprile 2, 2024
DTLS, SSL/TLS, OS, QAT, IPMI, CRPS, Total cost, Memory, Embedded, RAID, Common, NVM Express, DDR5, PCI Express, AI, BMC, OCP, Solid-state drive, AMD, IPsec, TDP, CPU, Video game

TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.

Key Points: 
  • TAIPEI, April 2, 2024 /PRNewswire/ -- AEWIN is glad to share with you that our High-Density Edge Computing Server, BAS-6101A, powered by Single AMD Zen4 Genoa or Zen4c Bergamo CPU is selected is displayed by AMD at Embedded World 2024.
  • The BAS-6101A supports the latest AMD Bergamo CPU with up to 128 cores (~100% increased) and 400W TDP (~28% increased) to enable the extreme computing power pursued in the market.
  • With its short-depth design of 600mm for easy deployment at the edge, the system is suitable for diverse Edge AI applications.
  • Learn more about AEWIN BAS-6101A at AMD's booth at Embedded World 2024 or contact AEWIN sales at any time!

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Martedì, Marzo 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Computer appliance, TDP, Video game

TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI, March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Accelerating Networking and Edge AI with AEWIN High Performance Network Appliances and Edge Servers Powered by AMD Siena

Retrieved on: 
Martedì, Marzo 26, 2024
OS, MEC, GPU, SSD, TPM, NVM Express, DDR5, Network, AI, CXL, PCI Express, TCO, 2U, NIC, Processor, EPYC, DW, AMD, Solid-state drive, Multimedia, Computer appliance, TDP, Video game

TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.

Key Points: 
  • TAIPEI , March 26, 2024 /PRNewswire/ -- AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena.
  • Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.
  • Benefited from the Siena CPU with energy efficiency, both models feature extraordinary computing performance and short-depth design (SCB-1945: 548mm; SCB-1947A: 600mm) to achieve faster speeds for Edge Computing and Networking.
  • In addition to the GPU slots, there are 4x PCIe 5.0 x8 slots available for NIC, accelerators, or NVMe SSDs.

Supermicro Grows AI Optimized Product Portfolio with a New Generation of Systems and Rack Architectures Featuring New NVIDIA Blackwell Architecture Solutions

Retrieved on: 
Lunedì, Marzo 18, 2024
Cloud, HGX, GTC, GPU, Communication, Deep learning super sampling, NVLink, Grace, InfiniBand, SAN, B200, AI, LLM, Architecture, Graphics processing unit, GPT, TB, San Jose Convention Center, NVIDIA, MGX, TDP, Total, Video game

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- NVIDIA GTC 2024, -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing new AI systems for large-scale generative AI featuring NVIDIA's next-generation of data center products, including the latest NVIDIA GB200 Grace™ Blackwell Superchip, the NVIDIA B200 Tensor Core and B100 Tensor Core GPUs. Supermicro is enhancing its current NVIDIA HGX™ H100/H200 8-GPU systems to be drop-in ready for the NVIDIA HGX™ B100 8-GPU and enhanced to support the B200, resulting in a reduced time to delivery. Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs. Supermicro is also adding new systems to its lineup, including the 4U NVIDIA HGX B200 8-GPU liquid-cooled system.

Key Points: 
  • Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs.
  • "These new products are built upon Supermicro and NVIDIA's proven HGX and MGX system architecture, optimizing for the new capabilities of NVIDIA Blackwell GPUs.
  • Optimized for the NVIDIA Blackwell architecture, the NVIDIA Quantum-X800, and Spectrum-X800 will deliver the highest level of networking performance for AI infrastructures.
  • Supermicro will also showcase two rack-level solutions, including a concept rack with systems featuring the upcoming NVIDIA GB200 with 72 liquid-cooled GPUs interconnected with fifth-generation NVLink.

Supermicro Grows AI Optimized Product Portfolio with a New Generation of Systems and Rack Architectures Featuring New NVIDIA Blackwell Architecture Solutions

Retrieved on: 
Lunedì, Marzo 18, 2024
Cloud, HGX, GTC, GPU, Communication, Deep learning super sampling, NVLink, Grace, InfiniBand, SAN, B200, AI, LLM, Architecture, Graphics processing unit, GPT, TB, San Jose Convention Center, NVIDIA, MGX, TDP, Total, Video game

SAN JOSE, Calif., March 18, 2024 /PRNewswire/ -- NVIDIA GTC 2024, -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing new AI systems for large-scale generative AI featuring NVIDIA's next-generation of data center products, including the latest NVIDIA GB200 Grace™ Blackwell Superchip, the NVIDIA B200 Tensor Core and B100 Tensor Core GPUs. Supermicro is enhancing its current NVIDIA HGX™ H100/H200 8-GPU systems to be drop-in ready for the NVIDIA HGX™ B100 8-GPU and enhanced to support the B200, resulting in a reduced time to delivery. Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs. Supermicro is also adding new systems to its lineup, including the 4U NVIDIA HGX B200 8-GPU liquid-cooled system.

Key Points: 
  • Additionally, Supermicro will further strengthen its broad NVIDIA MGX™ systems lineup with new offerings featuring the NVIDIA GB200, including the NVIDIA GB200 NVL72, a complete rack level solution with 72 NVIDIA Blackwell GPUs.
  • "These new products are built upon Supermicro and NVIDIA's proven HGX and MGX system architecture, optimizing for the new capabilities of NVIDIA Blackwell GPUs.
  • Optimized for the NVIDIA Blackwell architecture, the NVIDIA Quantum-X800, and Spectrum-X800 will deliver the highest level of networking performance for AI infrastructures.
  • Supermicro will also showcase two rack-level solutions, including a concept rack with systems featuring the upcoming NVIDIA GB200 with 72 liquid-cooled GPUs interconnected with fifth-generation NVLink.