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Siemon Launches LightStack® and LightStack 8 Ultra-High Density Fiber Plug and Play System

Retrieved on: 
Mercoledì, Aprile 17, 2024

WATERTOWN, Conn., April 17, 2024 /PRNewswire-PRWeb/ -- The Siemon Company, a global leader in network infrastructure solutions, is proud to announce the launch of its new and improved LightStack and LightStack 8 Ultra-High-Density Fiber Plug and Play system. This innovative solution delivers superior density, port access, and cable management in a sleek, modern platform, making it ideal for today's advanced data center or enterprise networking environments. "With LightStack, we're removing the compromises often associated with ultra-highdensity applications," said Tony Walker, Siemon Fiber Product Marketing Manager. "LightStack and LightStack 8 offer the perfect balance between performance and ease of use, allowing users to design and deploy cutting-edge network connectivity at the highest densities with ease."

Key Points: 
  • With advanced best-in-class features, Siemon's LightStack and LightStack 8 ultra-high-density fiber Plug and Play system offers superior density, port access and cable management in a sleek, modern platform.
  • WATERTOWN, Conn., April 17, 2024 /PRNewswire-PRWeb/ -- The Siemon Company, a global leader in network infrastructure solutions, is proud to announce the launch of its new and improved LightStack and LightStack 8 Ultra-High-Density Fiber Plug and Play system.
  • "With LightStack, we're removing the compromises often associated with ultra-highdensity applications," said Tony Walker, Siemon Fiber Product Marketing Manager.
  • Availability Siemon's LightStack and LightStack 8 Ultra-High-Density Fiber Plug and Play system is available now through Siemon's global distribution network.

GigaDevice Showcases Cutting-Edge Industry Solutions at Embedded World 2024

Retrieved on: 
Martedì, Aprile 9, 2024

NUREMBERG, Germany, April 09, 2024 (GLOBE NEWSWIRE) -- GigaDevice , a leading semiconductor company specializing in Flash Memory , 32-bit Microcontrollers (MCUs) , Sensors , and Power Management technologies , is poised to showcase its comprehensive product lineup at the Embedded World 2024 event held in Nuremberg, Germany from April 9th to 11th.

Key Points: 
  • NUREMBERG, Germany, April 09, 2024 (GLOBE NEWSWIRE) -- GigaDevice , a leading semiconductor company specializing in Flash Memory , 32-bit Microcontrollers (MCUs) , Sensors , and Power Management technologies , is poised to showcase its comprehensive product lineup at the Embedded World 2024 event held in Nuremberg, Germany from April 9th to 11th.
  • They offer a comprehensive software and hardware security solution to meet the industrial markets’ demand for high reliability and security applications.
  • We are thrilled to highlight our GD32 collaborative efforts with industry partners, such as QT , Embedded Wizard , and Sensory .
  • Come and visit GigaDevice at Hall 5-129 in person, and join our conference presentations:

When Low-Frequency Digital Buses Become High-Speed: Announcing Introspect Technology's SV6E-X Mid-Frequency Digital Test Module

Retrieved on: 
Giovedì, Gennaio 18, 2024

MONTREAL, Jan. 18, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, leading manufacturer of electronic test and measurement instruments for high-speed digital applications, is pleased to announce the official launch of its SV6E-X Mid-Frequency Digital Test Module. This all-inclusive solution for mid-frequency digital interface development is capable of supporting popular protocols such as Quad and Octal SPI, JEDEC SidebandBus, MIPI I3C, MIPI SoundWire, and MIPI RFFE. It is also an ideal solution for validating and analyzing system management interfaces such as Distributed Management Task Force (DMTF), System Power Management Interface (SPMI), System Management Bus (SMBus), and Power Management Bus (PMBus).

Key Points: 
  • MONTREAL, Jan. 18, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, leading manufacturer of electronic test and measurement instruments for high-speed digital applications, is pleased to announce the official launch of its SV6E-X Mid-Frequency Digital Test Module .
  • "The SV6E-X stands as a pioneering solution for the growing complexities of consumer electronics," says Dr. Mohamed Hafed, Chief Executive Officer at Introspect Technology.
  • But what happens when these low-speed digital pins start to operate at frequencies in excess of 100 MHz?
  • All three instrument classes work together seamlessly within Introspect Technology's award-winning Pinetree software to create highly flexible testing paradigms.

Renesas Delivers New RA8 MCU Group Targeting Graphic Display Solutions and Voice/Vision Multimodal AI Applications

Retrieved on: 
Martedì, Dicembre 12, 2023

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8D1 microcontroller (MCU) group.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8D1 microcontroller (MCU) group.
  • The RA8D1 group is the second in Renesas’ RA8 Series, the first MCUs based on the Arm® Cortex®-M85 processor.
  • Renesas also provides support for open-source Light and Versatile Graphics Library (LVGL) and a robust network of graphics and AI ecosystem partners.
  • Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance.

Renesas’ New Ultra-High Performance MCUs are Industry’s First Based on Arm Cortex-M85 Processor

Retrieved on: 
Martedì, Ottobre 31, 2023

The new RA8 Series MCUs are the industry’s first to implement the Arm® Cortex®-M85 processor, enabling the new devices to deliver industry-leading 6.39 CoreMark/MHz1 performance.

Key Points: 
  • The new RA8 Series MCUs are the industry’s first to implement the Arm® Cortex®-M85 processor, enabling the new devices to deliver industry-leading 6.39 CoreMark/MHz1 performance.
  • This level of performance will allow system designers to use the RA MCUs in applications that previously required microprocessors (MPUs).
  • The new series is part of Renesas’ popular RA Family of MCUs based on Arm Cortex processors.
  • View the full release here: https://www.businesswire.com/news/home/20231031195413/en/
    The new RA8 Series MCUs deploy Arm Helium™ technology, Arm’s M-Profile Vector Extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor.

GigaDevice Launches the GD32H7 Arm® Cortex®-M7 MCU Product Family, Delivering Exceptional Performance for Embedded Systems

Retrieved on: 
Lunedì, Maggio 29, 2023

BEIJING, May 29, 2023 (GLOBE NEWSWIRE) -- GigaDevice Semiconductor Inc. introduces its first Arm® Cortex®-M7 core microcontroller (MCU) product family, the GD32H737/757/759 ultra-high performance MCU series.

Key Points: 
  • BEIJING, May 29, 2023 (GLOBE NEWSWIRE) -- GigaDevice Semiconductor Inc. introduces its first Arm® Cortex®-M7 core microcontroller (MCU) product family, the GD32H737/757/759 ultra-high performance MCU series.
  • "The popularization of connected devices and AI algorithms are driving more intelligence into embedded designs," said Eric Jin, GigaDevice's Product Marketing Director.
  • The GD32H7 MCU series adopts an Arm® Cortex®-M7 high-performance core based on Armv7E-M architecture, with up to 600MHz clock frequency.
  • GigaDevice provides a free development environment for the new GD32H7 MCU series, the GD32 Eclipse IDE, and the GD32 All-In-One Programmer.

MaxLinear Expands its Diverse Ethernet Portfolio with 2.5G Ethernet switches and eight port 2.5G Enterprise PHYs

Retrieved on: 
Giovedì, Maggio 25, 2023

The family is comprised of new 2.5G Ethernet switches and eight port 2.5G Enterprise PHYs.​ The chipsets will anchor MaxLinear’s already robust Ethernet portfolio - which includes 10/100, 1G, and 2.5G bridges, PHYs and switches.

Key Points: 
  • The family is comprised of new 2.5G Ethernet switches and eight port 2.5G Enterprise PHYs.​ The chipsets will anchor MaxLinear’s already robust Ethernet portfolio - which includes 10/100, 1G, and 2.5G bridges, PHYs and switches.
  • The demand for more robust Ethernet products is growing as 2.5G speeds expand into enterprise, retail, and industrial single and multiport applications, and more PCs offer 2.5G Ethernet ports.
  • "MaxLinear has a 20-year history of being an innovator and major supplier of Ethernet PHYs and switches," said James Lougheed, Vice President & GM, High Performance Analog at MaxLinear.
  • MaxLinear’s 1G Ethernet PHY, 2.5G Ethernet PHY, and 1G Ethernet switch solutions offer the connectivity required for bandwidth-hungry video streaming, gaming, and video conferencing.

Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP

Retrieved on: 
Giovedì, Maggio 18, 2023

SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0. The xSPI IP also supports JESD216D Serial Flash Discoverable Parameters (SFDP). The JEDEC JESD251 standardizes the NOR Flash Device Interfaces. PSRAM is also supported.

Key Points: 
  • Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its SUREBOOT™ Total xSPI IP Solution which now includes the xSPI PHY IP.
  • SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0.
  • Arasan provides a Total xSPI IP Solution with xSPI PHY and software, FPGA prototyping platform and 3'rd party UVM based VIP in addition to the Verilog RTL code and test environment.
  • Arasan Total xSPI IP joins its comprehensive portfolio of solid state storage IP which includes Total UFS IP, Total eMMC IP and Total NAND IP Solutions.

Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP

Retrieved on: 
Giovedì, Maggio 18, 2023

SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0. The xSPI IP also supports JESD216D Serial Flash Discoverable Parameters (SFDP). The JEDEC JESD251 standardizes the NOR Flash Device Interfaces. PSRAM is also supported.

Key Points: 
  • Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its SUREBOOT™ Total xSPI IP Solution which now includes the xSPI PHY IP.
  • SAN JOSE, Calif., May 18, 2023 /PRNewswire/ -- Arasan expands its solid state storage IP portfolio with the announcement of the immediate availability of its Total eXpanded Serial Peripheral Interface (xSPI) IP including xSPI PHY compliant to the JEDEC JESD251 xSPI Specification V1.0.
  • Arasan provides a Total xSPI IP Solution with xSPI PHY and software, FPGA prototyping platform and 3'rd party UVM based VIP in addition to the Verilog RTL code and test environment.
  • Arasan Total xSPI IP joins its comprehensive portfolio of solid state storage IP which includes Total UFS IP, Total eMMC IP and Total NAND IP Solutions.

Siemon Examines ANSI/TIA-568.3-E Revision Introducing New Polarity Methods

Retrieved on: 
Martedì, Novembre 29, 2022

WATERTOWN, Conn., Nov. 29, 2022 /PRNewswire-PRWeb/ -- On September 29, 2022, ANSI released the latest revision of the ANSI/TIA568.3-E, Optical Fiber Cabling and Components Standard. Included in that revision was for the introduction of two new connectivity (polarity) methods for MTP/MPO-based duplex applications. The revision also introduced additional connector pinning guidance.

Key Points: 
  • Latest revision of the ANSI/TIA568.3-E, Optical Fiber Cabling and Components Standard includes in that revision was for the introduction of two new connectivity (polarity) methods for MTP/MPO-based duplex applications.
  • WATERTOWN, Conn., Nov. 29, 2022 /PRNewswire-PRWeb/ -- On September 29, 2022, ANSI released the latest revision of the ANSI/TIA568.3-E, Optical Fiber Cabling and Components Standard.
  • Included in that revision was for the introduction of two new connectivity (polarity) methods for MTP/MPO-based duplex applications.
  • Prior to the release of this revision of the Standard, connectivity methods for array-based duplex applications were limited to Methods A, B & C each having its own strengths and weaknesses.