EDA

Vigilant Aerospace Awarded OCAST Grant to Develop Distributed Airspace Management System

Retrieved on: 
Giovedì, Maggio 9, 2024
Aircraft, Research, Oklahoma State University–Stillwater, Software, Growth, OSU, EDA, National Airspace System, Vigilant, Atmosphere, Aviation, Hotbed, Airline

OKLAHOMA CITY, May 9, 2024 /PRNewswire/ -- Vigilant Aerospace Systems, the leading developer of multi-sensor airspace management and collision avoidance software for drones and advanced air mobility, has been awarded a $500,000 grant as part of a nearly $1 million project to work with the Oklahoma Aerospace Institute for Research and Education (OAIRE) at Oklahoma State University to develop a distributed version of its detect-and-avoid system.

Key Points: 
  • Vigilant Aerospace also won an OCAST grant in 2019 to work with OSU integrating new radars into its collision avoidance system.
  • While these autonomous vehicles offer significant societal and economic benefits, they require new airspace management paradigms to ensure safe integration into the existing airspace and air traffic.
  • The new corridor serves as the perfect platform for Vigilant's distributed airspace management system to enable true BVLOS flight.
  • "Working with OSU helps to speed our R&D and provide the Skyway Range Flight Corridor with the most advanced airspace management system in the nation," said Kraettli L. Epperson, CEO of Vigilant Aerospace.

DVCon U.S. 2025 Announces Call for Extended Abstracts, Workshop & Tutorial Proposals

Retrieved on: 
Martedì, Maggio 7, 2024
TLM, SVA, ESL, FPGA, IP, Hardware, Internet of things, SOC, Abstract, Functional safety, Stimulus, Conference, Machine learning, AMS, DoubleTree, SystemVerilog, EDA, Big data, Committee, PSL

GAINESVILLE, Fla., May 07, 2024 (GLOBE NEWSWIRE) -- The 2025 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract, workshop, and tutorial proposals.

Key Points: 
  • GAINESVILLE, Fla., May 07, 2024 (GLOBE NEWSWIRE) -- The 2025 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract, workshop, and tutorial proposals.
  • The 37th annual DVCon U.S. will be held February 24-27, 2025, at the Doubletree Hotel in San Jose, California.
  • Proposals should be an abstract of the workshop or tutorial, two to five paragraphs and no more than 1,000 words.
  • The deadline to submit extended abstracts, tutorial and workshop proposals is September 9, 2024.

Silvaco Announces Pricing of Initial Public Offering

Retrieved on: 
Giovedì, Maggio 9, 2024
Software, Networks, Internet, Data Management, Technology, Apps, Applications, Mobile, Wireless, Security, Sale, Prospectus, TCAD, AI, Vanderbilt Avenue, Jefferies, Research, Madison Avenue, Public expenditure, SIP, Jefferies Group, EDA, Capital Group Companies, Marketing, Rosenblatt, Attention, Telephone, Needham & Company, Security (finance)

Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced the pricing of its initial public offering of 6,000,000 shares of its common stock at a public offering price of $19.00 per share.

Key Points: 
  • Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced the pricing of its initial public offering of 6,000,000 shares of its common stock at a public offering price of $19.00 per share.
  • The aggregate gross proceeds to Silvaco from the offering are expected to be $114.0 million before deducting underwriting discounts and commissions and other offering expenses payable by Silvaco.
  • In addition, Silvaco has granted the underwriters a 30-day option to purchase up to an additional 900,000 shares of Silvaco’s common stock from Silvaco at the public offering price, less underwriting discounts and commissions.
  • Needham & Company is acting as lead manager and Craig-Hallum Capital Group and Rosenblatt are acting as co-managers for the offering.

Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process

Retrieved on: 
Giovedì, Maggio 2, 2024
Synopsys, CPU, USB On-The-Go, IP, GAA, SOC, Collaboration, Partnership, RTL, Samsung, Electronics, EDA, SNPS, Samsung Electronics, PPA, Central processing unit, Graphics processing unit

SUNNYVALE, Calif., May 2, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies. This significant achievement underscores the close collaboration between Synopsys and Samsung to deliver exceptional performance, power and area (PPA) for mutual customers, enabling a new generation of chips with generative artificial intelligence (AI) capabilities on Samsung Foundry advanced process nodes.

Key Points: 
  • Synopsys.ai EDA suite augmented with high-performance CPU PPA optimizations delivers highest performance, power, and area optimization for GAA nodes.
  • Collaboration across Synopsys.ai full-stack AI-driven EDA suite on Samsung Foundry's advanced GAA technologies enables ultimate peak performance with lower power.
  • Decades-long collaboration provides mutual customers with leading AI-driven EDA suite to realize exceptional quality-of-results and productivity gains on Samsung processes.
  • This is a remarkable milestone to successfully achieve the highest performance, power and area on the most advanced mobile CPU cores and SoC designs in collaboration with Synopsys," said Jongpil Lee, vice president of SLSI at Samsung Electronics.

Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows

Retrieved on: 
Giovedì, Aprile 18, 2024
Integrated circuit, Magic, Silicon, OpenROAD, Application-specific integrated circuit, EDA, PALO, Open, 3D printing

The OpenLane platform has been at the forefront of open-source silicon implementation since 2020.

Key Points: 
  • The OpenLane platform has been at the forefront of open-source silicon implementation since 2020.
  • Integrating a range of development tools including Yosys, OpenROAD, Magic, and KLayout, it abstracts the complex processes of silicon design into tangible and manageable steps.
  • Key Highlights of OpenLane 2:
    - Stability and Flexibility: OpenLane 2 introduces a stable infrastructure that supports the creation of multiple, customizable flows.
  • By offering a silicon development infrastructure that supports highly customizable flows, we're not just meeting the current needs of the industry – we're anticipating its future directions."

Spatial Announces Release 2024 1.0.1

Retrieved on: 
Martedì, Aprile 30, 2024
Electronic Design Automation, Data Management, Engineering, Technology, Manufacturing, Software, Machinery, STEP, Element, Spatial Corp, IGES, Corp, Civil engineering, Visualization, 3D, Library, API, Navisworks, Interop, ACIS, BIM, Spatial, CAD, EDA, Printing, Neutral, Parasolid, Point, BREP, Dassault Group, CVM, Behavior, Linux, 3D printing

Spatial Corp , the leading software development toolkit provider for design, manufacturing, and engineering solutions and Dassault Systèmes subsidiary, announces the production release of 2024 1.0.1.

Key Points: 
  • Spatial Corp , the leading software development toolkit provider for design, manufacturing, and engineering solutions and Dassault Systèmes subsidiary, announces the production release of 2024 1.0.1.
  • The latest release allows BIM customers to read Navisworks files and write drawing sheets in a DXF/DWG format.
  • The latest release of 3D InterOp supports Point and Table type hole patterns in Creo Reader.
  • This release features the beta version of the Neutral Fiber Operator, which reduces radially symmetric 3D bodies to a one-dimensional line.

Silvaco Announces Launch of Initial Public Offering

Retrieved on: 
Martedì, Aprile 30, 2024
Semiconductor, Hardware, Technology, Artificial Intelligence, Software, Sale, Prospectus, TCAD, AI, Vanderbilt Avenue, Jefferies, Research, Exchange, Madison Avenue, Public expenditure, IPO, SIP, Jefferies Group, EDA, Capital Group Companies, Marketing, Rosenblatt, Attention, Telephone, Security (finance)

Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced it has launched the roadshow for its initial public offering (“IPO”) of 6,000,000 shares of its common stock.

Key Points: 
  • Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced it has launched the roadshow for its initial public offering (“IPO”) of 6,000,000 shares of its common stock.
  • The underwriters will have a 30-day option to purchase up to an additional 900,000 shares of Silvaco’s common stock from Silvaco at the IPO price, less underwriting discounts and commissions.
  • Jefferies and TD Cowen are acting as joint book-running managers for the proposed offering.
  • B. Riley Securities, Craig-Hallum Capital Group and Rosenblatt are acting as co-managers for the proposed offering.

New Energy New York Selects Four Innovative Battery Companies for ChargeUp Accelerator

Retrieved on: 
Giovedì, Aprile 11, 2024
Luminate, Binghamton University, Economy, Ecosystem, Research, NSF, Fermi energy, EDA, Koffman, Electric battery

ChargeUp, the nation’s first and only accelerator dedicated to supporting battery and energy storage startups, is the latest program launched under NENY to propel domestic battery industry innovation, while fostering economic growth in Upstate New York.

Key Points: 
  • ChargeUp, the nation’s first and only accelerator dedicated to supporting battery and energy storage startups, is the latest program launched under NENY to propel domestic battery industry innovation, while fostering economic growth in Upstate New York.
  • "ChargeUp is a pivotal element of the NENY ecosystem, epitomizing our vision as a federal Battery Tech Hub and an NSF Engine.
  • This strategic alignment with Luminate's celebrated framework positions ChargeUp for success in the critical battery and energy storage industry.
  • The ChargeUp Accelerator 2024 Inaugural Cohort includes:
    Ateios Systems - developing innovative electrode manufacturing techniques to improve and accelerate production of new battery technologies across a range of various markets and applications.

Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design

Retrieved on: 
Mercoledì, Aprile 24, 2024
Automotive Manufacturing, Aerospace, Technology, Manufacturing, Semiconductor, Telecommunications, Software, Mobile, Wireless, 5G, Hardware, Electronic Design Automation, Spectre, EMX, TSMC, IP, Architecture, UCIe, AI, SOC, PCI Express, Certification, Silicon, CDNS, 3D, Cadence Design Systems, PDK, Automation, App Store (iOS/iPadOS), SVP, GDDR6, Simulation, EDA, GM, Schematic, LPDDR5, RF, DDR5, PPA, Virtuoso, D2D, EM, Video game

Cadence’s digital solutions are certified for TSMC N2 design flow, including Innovus™ Implementation System, Quantus™ Extraction Solution, Quantus Field Solver, Tempus™ Timing Signoff and ECO Solution, Pegasus™ Verification System, Liberate™ characterization, and the Voltus™ IC Power Integrity Solution.

Key Points: 
  • Cadence’s digital solutions are certified for TSMC N2 design flow, including Innovus™ Implementation System, Quantus™ Extraction Solution, Quantus Field Solver, Tempus™ Timing Signoff and ECO Solution, Pegasus™ Verification System, Liberate™ characterization, and the Voltus™ IC Power Integrity Solution.
  • Cadence and TSMC are collaborating on AI-driven Cadence solutions to enable an AI-assisted design flow for productivity and optimization of PPA results.
  • All have been enhanced for managing corner simulations, statistical analyses, design centering, and circuit optimization, which are now common with advanced nodes.
  • Cadence unveils a new silicon photonics flow to support TSMC’s Compact Universal Photonic Engine (COUPE) technology: Cadence and TSMC collaborate to develop a design flow for the COUPE 3D photonics process that features the Cadence Integrity 3D-IC platform.

Kalray Joins Arm Total Design, Extending Collaboration With Arm on Accelerated AI Processing

Retrieved on: 
Mercoledì, Aprile 24, 2024
VoIP, Software, Mobile, Wireless, Professional Services, Hardware, Data Management, Technology, Artificial Intelligence, Semiconductor, Other Professional Services, Audio, Video, Other Technology, Cloud, CMN, ARM Neoverse, Ecosystem, IP, Acceleration, Silicon, CSS, EDA, ASIC, DPU, Arm, Video game

Kalray (Euronext Growth Paris: ALKAL), a leading provider of hardware and software solutions to accelerate data intensive workflows from Cloud to Edge, announced that it has extended its collaboration with Arm by joining Arm Total Design.

Key Points: 
  • Kalray (Euronext Growth Paris: ALKAL), a leading provider of hardware and software solutions to accelerate data intensive workflows from Cloud to Edge, announced that it has extended its collaboration with Arm by joining Arm Total Design.
  • Kalray is already working to integrate Arm Coherent Mesh Network (CMN) technology to help easily connect Kalray’s advanced AI and data processing acceleration solution to Arm Neoverse CSS.
  • As a member of the Arm Total Design ecosystem, Kalray can move swiftly with the latest Arm technologies and thus ease the access to Kalray’s advanced AI and data processing capabilities to adopters of Arm Neoverse technology – and in doing so, facilitate their rollout of AI across numerous use cases and industries.
  • “Kalray is proud to be among the best of the best in the industry as part of the Arm Total Design ecosystem.