LGA

pSemi Announces Volume Production of its New High-Isolation SP4T Switches with Broadband Frequency Up to 8.5 GHz

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星期四, 二月 15, 2024
5G, Telecommunications, Internet, Hardware, Technology, IOT (Internet of Things), Semiconductor, Mobile, Wireless, Marketing, Semiconductor industry, SP4T, E911, VSWR, MIMO, LGA, DPD, SP4, Architecture

pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration, today announced the production readiness of its newest SP4T switches featuring broadband frequency switches with industry leading high isolation up to 8.5 GHz: the PE42445 and the PE42446 .

Key Points: 
  • pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration, today announced the production readiness of its newest SP4T switches featuring broadband frequency switches with industry leading high isolation up to 8.5 GHz: the PE42445 and the PE42446 .
  • Offered in a 20-lead (3×3 mm) LGA package and 24-lead (4×4 mm) LGA package, the PE42445 and PE42446 switches offer greater than 60 dB isolation, preventing interference and maintaining signal integrity.
  • They are built for extended operating temperatures ranging from -40°C to +125°C.
  • Based on industry requirements for high-isolation SP4T switches, the new products offer low insertion loss across the band, high linearity of 65 dBm IIP3, and fast switching time of 200 nsec.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

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星期四, 二月 8, 2024
Pillar, BGA, Communication, SOC, LED, CPU, Samsung, Growth, SOI, Electronics, Memory, SIP, Tier, Aerospace, FOWLP, IC, College of Engineering (KNUST), LGA, Artificial intelligence, Reverse engineering, Silicon, RF, CSP, Equipment, Defense, Monolith, Chemical control, Quality control, Logic, Packaging and labeling, 3D, Miniaturization, FD-SOI, GPU, MEMS, Automation, Row, PGA, Interposer, Video game

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

Retrieved on: 
星期四, 二月 8, 2024
Pillar, BGA, Communication, SOC, LED, CPU, Samsung, Growth, SOI, Electronics, Memory, SIP, Tier, Aerospace, FOWLP, IC, College of Engineering (KNUST), LGA, Artificial intelligence, Reverse engineering, Silicon, RF, CSP, Equipment, Defense, Monolith, Chemical control, Quality control, Logic, Packaging and labeling, 3D, Miniaturization, FD-SOI, GPU, MEMS, Automation, Row, PGA, Interposer, Video game

By Packaging Component & Design, Device, Industry and Region

Key Points: 
  • By Packaging Component & Design, Device, Industry and Region
    Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.
  • Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.
  • Interposer and FOWLP market for memory devices to hold high market share during the forecast period.
  • Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

Preparing for Takeoff: Chase Opens its Chase Sapphire Lounge by The Club at New York’s LaGuardia Airport Today and Unveils Latest Expansion of its Airport Lounge Network

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星期二, 一月 16, 2024
Banking, Travel, Professional Services, Other Transport, Food, Beverage, Air, Transport, Retail, Restaurant, Bar, Other Travel, Finance, JPMorgan Chase, LaGuardia Airport, New Yorker, Mezzanine, Multimedia, Partnership, Chase, Imagination, Terminal, United, LGA, VIP, Coffee, Etihad Airways, Wine, Culture, Nature, Club, JFK, Nightclub

Today, Chase is opening the newest Chase Sapphire Lounge by The Club at New York’s LaGuardia Airport (LGA).

Key Points: 
  • Today, Chase is opening the newest Chase Sapphire Lounge by The Club at New York’s LaGuardia Airport (LGA).
  • View the full release here: https://www.businesswire.com/news/home/20240116052832/en/
    Additionally, Chase will further expand its lounge network with a new lounge location at John F. Kennedy International Airport (JFK).
  • This location will offer the signature Chase Sapphire Lounge by The Club experience.
  • Photos and additional media details about the new LaGuardia Chase Sapphire Lounge by The Club are available upon request.

Quectel Introduces Ultra-Low Power, Cost-Effective KG200Z Long Range Module

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星期二, 一月 9, 2024
Telecommunications, Internet, Data Management, Technology, Apps, Applications, IOT (Internet of Things), Mobile, Wireless, Other Technology, Waste management, UART, RF, SWD, VEX, CSO, BPSK, Life, Multimedia, LGA, MSK, FSK, Communication, Hertz, HVAC, CES, Long Range, SPI, Internet of things, Telescopic sight

CES - Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of the KG200Z module, a state-of-the-art Long Range (LoRa®) technology module designed to cater to the specific needs of IoT projects demanding dependable, ultra-low power, and cost-effective, long range wireless communication.

Key Points: 
  • CES - Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of the KG200Z module, a state-of-the-art Long Range (LoRa®) technology module designed to cater to the specific needs of IoT projects demanding dependable, ultra-low power, and cost-effective, long range wireless communication.
  • View the full release here: https://www.businesswire.com/news/home/20240109198172/en/
    Quectel introduces ultra-low power, cost-effective KG200Z Long Range module (Photo: Business Wire)
    The module delivers seamless and robust connectivity for IoT devices, boasting an impressive transmission distance of 2-5 kilometers in urban settings and 10-15 kilometers in suburban areas.
  • The module also boasts a range connectivity options with multiple interfaces, including UART, SPI*, I2C*, and SWD, catering to a wide range of applications.
  • With an ultra-low power consumption, the KG200Z module is engineered for efficiency, boasting low power consumption to extend battery life significantly.

pSemi Unveils PE562212, Its Smallest and Fully Integrated PA-LNA-SW IoT Front-End Module

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星期二, 一月 9, 2024
Semiconductor, IOT (Internet of Things), Technology, Mobile, Wireless, Networks, Internet, Hardware, RF, PCB, Hertz, Semiconductor industry, Multimedia, LGA, SMD, FEM, ESD, BLE, DBm, Wi-Fi, CES, Typ, Marketing, GPIO, Internet of things, Internet service provider

pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212.

Key Points: 
  • pSemi® Corporation , a Murata company leading in the design and development of semiconductor integration and advanced connectivity, today announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212.
  • The PE562212 enables connectivity across Thread, Zigbee®, Bluetooth® BDR/EDR, BLE, and low-medium throughput Wi-Fi® (MCS7) as well as 2.4 GHz proprietary applications.
  • It also offers excellent ESD and ruggedness for all intended applications and environmental conditions inherent to the IoT space.
  • Samples and EVKs for PE562212 are available now, directly through pSemi, and are expected to be commercially available by August 2024.

Cavli Wireless Announces the 5G RedCap CQM220 Cellular IoT Module at CES 2024

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星期二, 一月 9, 2024
Semiconductor, IOT (Internet of Things), Technology, Mobile, Wireless, Telecommunications, Internet, LVCC, M.2, M2M, Çavlı, Multimedia, 3GPP, LGA, Linux, MCU, GNSS, CES, Redcap, ESIM, Internet of things, Connectivity, Mobile phone

Cavli Wireless , a pioneer in the IoT solutions landscape, announced its flagship 5G RedCap CQM220 Cellular IoT Module at CES 2024, in Las Vegas, USA.

Key Points: 
  • Cavli Wireless , a pioneer in the IoT solutions landscape, announced its flagship 5G RedCap CQM220 Cellular IoT Module at CES 2024, in Las Vegas, USA.
  • View the full release here: https://www.businesswire.com/news/home/20240109002006/en/
    Cavli Wireless announces the 5G RedCap CQM220 Cellular IoT Module at CES 2024 (Graphic: Business Wire)
    The CQM220 is the flagship 5G RedCap cellular IoT module from Cavli Wireless, compatible with 3GPP release 17 standards, specifically designed for advanced IoT and M2M applications.
  • John Mathew, CEO & Chief Technology Architect of Cavli Wireless, commented, “The introduction of the CQM220 at CES 2024 represents a significant milestone for Cavli Wireless.
  • These qualities are the foundational pillars of the CQM220 and distinguish both the product and Cavli Wireless in a competitive market.”
    As we announce the CQM220 at CES 2024, Cavli Wireless reaffirms its commitment to delivering affordable, seamless, and high-performance cellular IoT solutions.

TDK announces new 3-axis accelerometer, finalizing transition of SmartAutomotive™ non-safety product family to 105°C

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星期二, 一月 9, 2024
LVCC, Senior, Temperature, SAN, InvenSense, LGA, MEMS, Consumer Electronics Show, Safety, TDK, CES

The launch represents a full transition of the InvenSense SmartAutomotive non-safety product line to 105°C.

Key Points: 
  • The launch represents a full transition of the InvenSense SmartAutomotive non-safety product line to 105°C.
  • With this release, TDK confirms its leadership in driving the inertial sensors market for both safety and non-safety automotive applications.
  • "With this launch, TDK completes the transition from temperature grade 3 to grade 2 of the entire SmartAutomotive non-safety product line," said Alberto Marinoni, Senior Director Product Marketing Automotive at InvenSense, a TDK Group company.
  • TDK will demonstrate this and other technologies at the Consumer Electronics Show (CES) from January 9-12, 2024, in Las Vegas.

Quectel launches SG520B series of 5G Sub-6GHz smart modules with powerful multimedia functionality

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星期四, 十二月 7, 2023
Consumer Electronics, IOT (Internet of Things), Apps, Applications, Technology, Mobile, Wireless, Networks, Qualcomm, CPE, Sale, IEEE, DBS, Internet of things, Android, NSA, Wi-Fi, Bluetooth, LGA, CSO, Multimedia, GNSS, System, MiFi, POS, MIMO, HP EliteBook, PDA, Temperature, Environment, LTE, Mobile phone

Quectel Wireless Solutions, a global IoT solutions provider, announces the new Quectel SG520B series of 5G Sub-6GHz, Wi-Fi 6E and Bluetooth smart modules.

Key Points: 
  • Quectel Wireless Solutions, a global IoT solutions provider, announces the new Quectel SG520B series of 5G Sub-6GHz, Wi-Fi 6E and Bluetooth smart modules.
  • View the full release here: https://www.businesswire.com/news/home/20231207674182/en/
    Quectel launches SG520B series of 5G Sub-6GHz smart modules with powerful multimedia functionality (Photo: Business Wire)
    Offering comprehensive cellular connectivity options including worldwide 2G, 3G, 4G and 5G coverage, with LTE Cat 15 and both 5G Release 16 standalone (SA) and 5G non-standalone (NSA), the modules offer 5G and LTE multiple input multiple output (MIMO) technology.
  • “The Quectel SG520B Series of 5G Sub-6GHz smart modules are powerful, versatile modules that are ideal for enabling rich device functionality alongside unparalleled connection performance across multiple cellular, Wi-Fi and Bluetooth options,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • For 5G NSA deployments, the modules will support 2.5Gbps downlink and 550Mbps uplink, again depending on which regional variant is selected.

Joby Flies Quiet Electric Air Taxi in New York City

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星期一, 十一月 13, 2023
Transportation, Environment, Travel, Green Technology, Air, Aerospace, Transport, Manufacturing, Aviation, DBA, NYSE, New Yorker, SVP-24, United States Air Force, Indianapolis Downtown Heliport, Heliport, Economic development, Joby Aviation, Port, Investment, Delta Air Lines, LGA, Animation, JoeBen Bevirt, NASA, Multimedia, Joby, Downtown Manhattan Heliport, JFK, Federal Aviation Administration, NYCEDC, EDC, Partnership, Atmosphere, Aircraft, SVP, Altitude, Quality of life, Certification, Airline, Delta, LaGuardia Airport

Joby Aviation, Inc. (NYSE:JOBY), a company developing electric vertical take-off and landing (eVTOL) aircraft for commercial passenger service, today announced that it successfully performed an exhibition flight in New York City yesterday, marking the first ever electric air taxi flight in the city and the first time Joby has flown in an urban setting.

Key Points: 
  • Joby Aviation, Inc. (NYSE:JOBY), a company developing electric vertical take-off and landing (eVTOL) aircraft for commercial passenger service, today announced that it successfully performed an exhibition flight in New York City yesterday, marking the first ever electric air taxi flight in the city and the first time Joby has flown in an urban setting.
  • View the full release here: https://www.businesswire.com/news/home/20231113446548/en/
    Joby’s electric air taxi in the skies above New York City, piloted by James “Buddy” Denham.
  • “By electrifying one of the most famous heliports in the world, New York is demonstrating global leadership in the adoption of electric air travel.
  • We’re grateful for the support of the city, and we’re honored to be working with visionary partners like Delta Air Lines to bring our air taxi service to this market,” said JoeBen Bevirt, Founder and CEO of Joby Aviation.