HHUSF.PK

Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD

星期四, 六月 3, 2021 - 4:30am

HONG KONG, June 3, 2021 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that its 90nm BCD process has received wide recognition from customers for its high performance index and compact chip size, and mass production has been achieved on Hua Hong Wuxi's 12'' production line.

Key Points: 
  • HONG KONG, June 3, 2021 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that its 90nm BCD process has received wide recognition from customers for its high performance index and compact chip size, and mass production has been achieved on Hua Hong Wuxi's 12'' production line.
  • Hua Hong Semiconductor's 90nm BCD process has better electrical parameters and excellent yield due to the stability of its 12'' process, providing a more competitive manufacturing solution for chip applications such as digital power supplies and digital audio amplifiers.
  • Hua Hong Semiconductor has an advanced analog and power management IC process platform, covering 0.5um to 90nm technology nodes.
  • Hua Hong Semiconductor Limited ("Hua Hong Semiconductor", stock code: 1347.HK) (the "Company") is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory ("eNVM"), power discrete, analog & power management, and logic & RF.

Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions

星期四, 八月 27, 2020 - 5:00am

For the newly launched 90nm ULL eFlash process platform, the leakage of 1.5V core N-Type and P-Type MOS transistors reaches 0.2pA/um, effectively extending the standby time of MCU devices.

Key Points: 
  • For the newly launched 90nm ULL eFlash process platform, the leakage of 1.5V core N-Type and P-Type MOS transistors reaches 0.2pA/um, effectively extending the standby time of MCU devices.
  • The most important advantage of this process platform is the integration of the Company's proprietary split gate NORD eFlash technology.
  • The launch of the 90nm ultra-low-leakage eFlash technology platform further makes available more foundry options for Hua Hong Semiconductor's MCU customers in ultra-low power consumption applications."
  • Hua Hong Semiconductor Limited (1347.HK) is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory (eNVM), power discrete, analog & power management, and logic & RF.

Hua Hong Semiconductor Relies on "8-inch + 12-inch" Strategy to Accelerate Development in IGBT Market

星期五, 七月 31, 2020 - 4:28am

HONG KONG, July 31, 2020 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that it will fully cooperate with IGBT (Insulated Gate Bipolar Transistor) product customers to shape the IGBT ecosystem.

Key Points: 
  • HONG KONG, July 31, 2020 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that it will fully cooperate with IGBT (Insulated Gate Bipolar Transistor) product customers to shape the IGBT ecosystem.
  • IGBT is the core device of energy conversion and transmission, known as "CPU of Power Electronics Industry".
  • The Company has the advanced full set of IGBT thin wafer BGBM (Backside Grinding / Backside Metallization) processing technology.
  • Hua Hong Semiconductor Limited ("Hua Hong Semiconductor", stock code: 1347.HK) (the "Company") is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory ("eNVM"), power discrete, analog & power management, and logic & RF.