Fabless semiconductor companies

New TySOM-M Series Targets Low Power, High Security Applications

Retrieved on: 
Wednesday, July 7, 2021
Technology, Hardware, Electronic design automation, Security, Computer architecture, Computing, Microprocessors, Instruction set architectures, Fabless semiconductor companies, SiFive, Microcontrollers, System on a chip, Hardware acceleration, RISC-V, Field-programmable gate array, Arc, TySOM, Aldec, TYSOM, ALDEC

Microchips PolarFire SoC FPGA boasts low power consumption, impressive thermal efficiency and defense-grade security for smart, connected systems.

Key Points: 
  • Microchips PolarFire SoC FPGA boasts low power consumption, impressive thermal efficiency and defense-grade security for smart, connected systems.
  • The RISC-V CPU micro-architecture implementation in the PolarFire SoC MPFS250T-FCG1152 is a five-stage single issue in-order pipeline.
  • The five cores are 1x SiFive E51 Monitor core (RV64IMAC) and 4x SiFive U54 Application cores (RV64GC).
  • Aldecs decision to use PolarFire SoC FPGA in its new TySOM-M family will enable users to design for a wealth of applications requiring low power and high security.

Global $9.1 Billion Wi-Fi 6 Chipset Market to 2026 Featuring ASUSTeK Computer, Broadcom, Cisco Systems, Intel, and Qualcomm Technologies

Retrieved on: 
Wednesday, July 7, 2021
Wi-Fi, Wireless networking, IEEE 802.11ax-2021, Technology, Fabless semiconductor companies, Science and technology, Computing

DUBLIN, July 7, 2021 /PRNewswire/ -- The "Global Wi-Fi 6 Chipset Market" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, July 7, 2021 /PRNewswire/ -- The "Global Wi-Fi 6 Chipset Market" report has been added to ResearchAndMarkets.com's offering.
  • The global market for Wi-Fi 6 chipsets should grow from $3.4 billion in 2021 to $9.1 billion by 2026, at a compound annual growth rate (CAGR) of 21.7% for the period of 2021-2026.
  • The report provides an overview of the global market for Wi-Fi 6 chipsets and analyzes market trends.
  • Using 2019 as the base year, the report provides estimated market data for the forecast period of 2021 through 2026.

Lattice Announces LEC2 TechWeb Trainings to Help Developers Create Applications Based on Low Power Lattice FPGAs

Retrieved on: 
Tuesday, July 6, 2021
Mobile, Wireless, Networks, Internet, Hardware, Electronic design automation, Consumer electronics, Training, Technology, Semiconductor, Education, Nanotechnology, Audio, Video, Fields of mathematics, Fabless semiconductor companies, Integrated circuits, Computer engineering, Lie groups, Group theory, Lattice Semiconductor, Field-programmable gate arrays, Ice, Lattice, Semiconductor, Actel

For more information on Lattices low-power FPGAs and solution stacks, please visit www.latticesemi.com .

Key Points: 
  • For more information on Lattices low-power FPGAs and solution stacks, please visit www.latticesemi.com .
  • Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader.
  • Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
  • The use of the word partner does not imply a legal partnership between Lattice and any other entity.

Keysight and Qualcomm First to Achieve 10 Gbps Data Connection Using 5G New Radio Dual Connectivity

Retrieved on: 
Tuesday, July 6, 2021
Technology, Mobile, Wireless, Telecommunications, Networks, Internet, Hardware, Telecommunications, Technology, Science and technology, Mobile telecommunications, Internet of things, ARM architecture, Fabless semiconductor companies, System on a chip, 5G, Qualcomm Snapdragon, Qualcomm, 3GPP

The demonstration included Keysights network emulation platform and Snapdragon X65 5G Modem-RF System with Qualcomm QTM545 mmWave Antenna Module to aggregate 5G mmWave and sub-6GHz spectrum.

Key Points: 
  • The demonstration included Keysights network emulation platform and Snapdragon X65 5G Modem-RF System with Qualcomm QTM545 mmWave Antenna Module to aggregate 5G mmWave and sub-6GHz spectrum.
  • NR-DC allows 5G NR devices to concurrently connect and aggregate multiple NR cells, leading to significantly increased data transfer speeds.
  • Qualcomm Technologies also used Keysights 5G Protocol R&D Toolset , part of the company's suite of network emulation solutions, to establish the industry's first 5G NR data connection based on 3GPP Rel-16.
  • Snapdragon and Qualcomm QTM545 mmWave Antenna Module are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Andes Technology Announces over 2 Billion Shipments of Andes-Embedded SoCs in 2020

Retrieved on: 
Tuesday, July 6, 2021
Computer architecture, Instruction set architectures, Microcontrollers, Andes Technology, Computing, RISC-V, Computers, Reduced instruction set computer, Symposium on Combinatorial Search, Fabless semiconductor companies

Although the pandemic has impacted the global economy, the SoC shipments containing Andes CPU IPs still hit a record high.

Key Points: 
  • Although the pandemic has impacted the global economy, the SoC shipments containing Andes CPU IPs still hit a record high.
  • Most of the 2 billion shipments in 2020 are Andes processors of the third generation architecture (V3), but Andes RISC-V series IPs launched in 2017 have started to contribute royalties as well, said Frankwell Lin, CEO of Andes Technology.
  • The production quantity of SoCs embedded with Andes processors reaches nearly 5.5 million units per day.
  • The annual volume of Andes-Embedded SoCs has exceeded 2 billion since 2020 and the cumulative volume has reached 7 billion.

ATI and United Steelworkers Reach Tentative Agreement

Retrieved on: 
Tuesday, July 6, 2021
Teledyne Technologies, Canadian Labour Congress, Fabless semiconductor companies, Trade unions, Allegheny Technologies, Ati, ATI Technologies, United Steelworkers, Companies, Organizations

PITTSBURGH, July 6, 2021 /PRNewswire/ --Allegheny Technologies Incorporated (NYSE: ATI) announced it has reached tentative agreement for its labor contract with the United Steelworkers (USW) covering approximately 1,300 represented employees located primarily within the Advanced Alloys & Solutions segment operations for the term covering March 1, 2021 February 28, 2025.

Key Points: 
  • PITTSBURGH, July 6, 2021 /PRNewswire/ --Allegheny Technologies Incorporated (NYSE: ATI) announced it has reached tentative agreement for its labor contract with the United Steelworkers (USW) covering approximately 1,300 represented employees located primarily within the Advanced Alloys & Solutions segment operations for the term covering March 1, 2021 February 28, 2025.
  • The tentative agreement is subject to ratification by USW members in the coming weeks.
  • "The efforts of both parties have resulted in a tentative agreement that rewards our hard-working employees and contributes to the long-term viability of ATI," said Kim Fields, executive vice president of Advanced Alloys & Solutions and High Performance Materials & Components.
  • ATI (NYSE: ATI) is a $3 billion global manufacturer solving the world's most difficult challenges through materials science; advanced, integrated process technologies; and relentlessly innovative people.

Worldwide Wi-Fi Chipset Industry to 2026 - Featuring Qualcomm Technologies, Intel and Texas Instruments Among Others - ResearchAndMarkets.com

Retrieved on: 
Monday, July 5, 2021
Mobile, Wireless, Technology, Semiconductor, Wireless networking, Telecommunications engineering, Wireless, Telecommunications, Wi-Fi, Fabless semiconductor companies, Qualcomm, Wireless access points, Boingo Wireless

The "Wi-Fi Chipset Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Wi-Fi Chipset Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.
  • The global Wi-Fi chipset market reached a value of US$ 17.13 Billion in 2020.
  • Looking forward, the publisher expects the global Wi-Fi chipset market to exhibit moderate growth during the forecast period (2021-2026).
  • The Wi-Fi technology uses wireless transmitter and chipset to send information to mobile devices for wireless networking.

Xeris Pharmaceuticals Announces Inducement Grants Under NASDAQ Listing Rule 5635(c)(4)

Retrieved on: 
Friday, July 2, 2021
Biotechnology, Pharmaceutical, Health, Fabless semiconductor companies, Companies, Semiconductor device fabrication, Broadcom Inc., Federal Trade Commission, Arm Ltd., Nasdaq, Inc.

Xeris Inducement Equity Plan is used exclusively for the grant of equity awards to individuals who were not previously employed by Xeris or one of its subsidiaries as an inducement material to such individual's entering into employment with Xeris or one of its subsidiaries, pursuant to Rule 5635(c)(4) of the NASDAQ Listing Rules.

Key Points: 
  • Xeris Inducement Equity Plan is used exclusively for the grant of equity awards to individuals who were not previously employed by Xeris or one of its subsidiaries as an inducement material to such individual's entering into employment with Xeris or one of its subsidiaries, pursuant to Rule 5635(c)(4) of the NASDAQ Listing Rules.
  • The restricted stock units will vest over a period of four years in equal annual installments and are subject to the employees continued employment with Xeris or one of its subsidiaries.
  • All equity awards are subject to the terms and conditions of Xeris Inducement Equity Plan and forms of award agreements covering the grants.
  • Xeris (Nasdaq: XERS) is a specialty pharmaceutical company delivering innovative solutions to simplify the experience of administering important therapies that people rely on every day around the world.

Worldwide Semiconductor Intellectual Property to 2027 - Featuring Arm Holdings, CEVA and Intel Among Others - ResearchAndMarkets.com

Retrieved on: 
Friday, July 2, 2021
Technology, Semiconductor, Digital electronics, Electronic engineering, Technology, Fabless semiconductor companies, Electronic design automation, Logic design, Semiconductor device fabrication, Semiconductor intellectual property core, Integrated circuit, ON Semiconductor, Duolog

The "Semiconductor Intellectual Property (IP) Market - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Semiconductor Intellectual Property (IP) Market - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027" report has been added to ResearchAndMarkets.com's offering.
  • Semiconductor IP core are virtual components that can be used to build integrated semiconductor devices and systems-on-chip.
  • Continuous developments are being conducted in the field of semiconductor IP, to offer intelligent products enabled with information processing and communication capabilities.
  • Growing adoption of AI-based solutions is expected to offer further potential revenue opportunities to vendors of semiconductor intellectual property.

Cirrus Logic to Announce Q1 Results July 28

Retrieved on: 
Thursday, July 1, 2021
Technology, Mobile, Wireless, Hardware, Consumer electronics, Fabless semiconductor companies, Cirrus Logic, Cirrus, Companies, Aviation, Industry economics)

Cirrus Logic will host a live Q&A webcast session at 5 p.m. EDT that same day to answer questions related to its financial results and business outlook.

Key Points: 
  • Cirrus Logic will host a live Q&A webcast session at 5 p.m. EDT that same day to answer questions related to its financial results and business outlook.
  • Cirrus Logic is a leader in low-power, high-precision mixed-signal processing solutions that create innovative user experiences for the worlds top mobile and consumer applications.
  • With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture.
  • Cirrus Logic and Cirrus are trademarks of Cirrus Logic, Inc.
    View source version on businesswire.com: https://www.businesswire.com/news/home/20210701005604/en/