Fabless semiconductor companies

Quectel 5G Modules Selected by 100+ Global OEMs for 5G Designs

Retrieved on: 
Wednesday, October 16, 2019
Telecommunications, Technology, Mobile telecommunications, Internet of things, 5G, Technology forecasting, Fabless semiconductor companies, Computers, Qualcomm

SHANGHAI, Oct. 16, 2019 /PRNewswire/ -- Quectel Wireless Solutions , the leading global supplier of cellular and GNSS modules, announced that the company's 5G cellular modules, from sub-6GHz to mmWave, have been selected by 100+ global OEMs spanning a broad spectrum of industries for their 5G designs and planning.

Key Points: 
  • SHANGHAI, Oct. 16, 2019 /PRNewswire/ -- Quectel Wireless Solutions , the leading global supplier of cellular and GNSS modules, announced that the company's 5G cellular modules, from sub-6GHz to mmWave, have been selected by 100+ global OEMs spanning a broad spectrum of industries for their 5G designs and planning.
  • The widespread adoption of our 5G modules has enabled the industry's first wave of 5G use cases and is driving more IoT innovations," said Patrick Qian, CEO, Quectel.
  • "Due to the simple-to-integrate designs, reliable performance and comprehensive product portfolio, Quectel has proved to be a reliable partner of global OEMs."
  • Quectel is showcasing 5G modules at the Qualcomm 5G Summit in Barcelona, October 14-16, and MWC Los Angeles (Booth No.

QuickLogic Teams with SiFive to Make eFPGA Technology Available via DesignShare Portfolio

Retrieved on: 
Wednesday, October 16, 2019
Fabless semiconductor companies, Technology, Hardware acceleration, SiFive, Articles, Internet of things, Computing, Field-programmable gate array

The SiFive DesignShare IP program offers a streamlined process for companies seeking to partner with leading vendors to provide pre-integrated premium Silicon IP for bringing new SoCs to market.

Key Points: 
  • The SiFive DesignShare IP program offers a streamlined process for companies seeking to partner with leading vendors to provide pre-integrated premium Silicon IP for bringing new SoCs to market.
  • "The demand for voice and AI-based IoT solutions is growing," said Mohit Gupta, vice president of SoC IP solutions at SiFive.
  • Adding QuickLogic's eFPGA IP to our DesignShare ecosystem offers our customers a solution that is not only flexible but low-cost, ultra-low power and very high-performance."
  • "This relationship with SiFive gives IoT and other SoC designers easy access to the flexibility and low power benefits associated with eFPGA technology."

Global 5G Chipset Market Summary 2019-2025: Core Findings, Recommendations, & Conclusions - ResearchAndMarkets.com

Retrieved on: 
Wednesday, October 16, 2019
Technology, Semiconductor, Mobile telecommunications, Technology, Internet of things, Fabless semiconductor companies, Computers, 5G, Technology forecasting, Articles, Chipset, Field-programmable gate array, ATI Technologies

The "5G Chipset Market Summary: Core Findings, Recommendations, & Conclusions 2019 to 2025" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "5G Chipset Market Summary: Core Findings, Recommendations, & Conclusions 2019 to 2025" report has been added to ResearchAndMarkets.com's offering.
  • 5G chipsets are going to play a crucial role in the global deployment of 5G.
  • Leading and few innovative vendors have already come up with their 5G chipset designs.
  • Current status of 5G chipset across categories such as ASIC, ASSP, RFIC, and FPGA

sureCore PowerMiser™ Low Power SRAM IP Now on Samsung 28nm FDS Process Technology

Retrieved on: 
Wednesday, October 16, 2019
Companies, Economy of South Korea, Technology, Microtechnology, Silicon on insulator, SRAM Corporation, Samsung Electronics, Samsung, Fabless semiconductor companies, System on a chip

SHEFFIELD, England, Oct. 16, 2019 /PRNewswire/ -- sureCore Limited, a provider of low power SRAM products and custom memory design services, today announced that its PowerMiserTM low power SRAM IP is now available for designs targeting the Samsung 28nm FDS process.

Key Points: 
  • SHEFFIELD, England, Oct. 16, 2019 /PRNewswire/ -- sureCore Limited, a provider of low power SRAM products and custom memory design services, today announced that its PowerMiserTM low power SRAM IP is now available for designs targeting the Samsung 28nm FDS process.
  • "As the low power IC design and SRAM IP standard products leader, we're responding to more and more enquiries about the low power consumption capabilities of silicon-on-insulator technology," explained Paul Wells, sureCore CEO.
  • Making PowerMiser available on Samsung's 28nm FDS technology responds to demands for low power devices, particularly those powering IoT, wearable, and medical applications."
  • "sureCore providing PowerMiser for the Samsung 28FDS technology node creates competitive advantages to companies looking to manufacture low power, low leakage SoC designs.

Neural Network Inference at Dramatically Lower Latency Compared to GPUs with Zebra by Mipsology on Xilinx Alveo U50 Accelerators

Retrieved on: 
Tuesday, October 15, 2019
Integrated circuits, Fabless semiconductor companies, Computer architecture, Electronic engineering, Application-specific integrated circuits, Coprocessors, Graphics hardware, Hardware acceleration, Xilinx, Graphics processing unit, Accelerator, Zebra

Neural network inference can now be deployed faster than ever with Zebra on the Alveo U50 Data Center accelerator card .

Key Points: 
  • Neural network inference can now be deployed faster than ever with Zebra on the Alveo U50 Data Center accelerator card .
  • Accelerating the Zebra software stack with Alveo accelerator cards delivers best-in-class performance transparently, replacing CPUs or GPUs for inference in a data center or at the edge.
  • Zebra delivers a range of critical capabilities:
    Fastest CNN inference - Zebra sets a new standard of performance.
  • Mipsology demonstrated Zebra live on the Xilinx Alveo U50 and Alveo U250 cards at the Avnet Acceleration Seminar in Tokyo Japan running 4 live camera streams at low latency.

Mercury Systems Announces Strategic Investment in Trusted Microelectronics Technology Innovation

Retrieved on: 
Tuesday, October 15, 2019
Mercury Systems, Fabless semiconductor companies, Computing, Microsemi, Mercury, Andover, Massachusetts, Computers, Digital technology

ANDOVER, Mass., Oct. 15, 2019 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com ) announced today a $15 million capital investment to expand its trusted custom microelectronics business, bringing cutting-edge commercial silicon technology to the Department of Defense (DoD).

Key Points: 
  • ANDOVER, Mass., Oct. 15, 2019 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com ) announced today a $15 million capital investment to expand its trusted custom microelectronics business, bringing cutting-edge commercial silicon technology to the Department of Defense (DoD).
  • The technology is applicable to all defense platforms and programs and offers fast, affordable and secure and trusted chip-scale open system architecture (OSA) devices to accelerate future modernization efforts.
  • This is an expansion upon existing investments which began in earnest three years ago, following Mercurys acquisition of Microsemis custom microelectronics business.
  • Headquartered in Andover, Mass., Mercury is pioneering a next-generation defense electronics business model specifically designed to meet the industry's current and emerging technology needs.

Strategy Analytics - 2Q 2019 Baseband Market Share: Qualcomm and Samsung Emerge as Early 5G Contenders

Retrieved on: 
Tuesday, October 15, 2019
Technology, Mobile, Wireless, Consulting, Other Technology, Professional services, Software, Networks, Internet, Consumer electronics, Technology, Companies, Fabless semiconductor companies, Electronics, Embedded microprocessors, System on a chip, ARM architecture, Baseband processor, MediaTek, Qualcomm, Samsung Electronics, HiSilicon

The global cellular baseband processor market declined 4 percent year-over-year to reach $5.0 billion in Q2 2019, according to Strategy Analytics Handset Component Technologies service report, Baseband Market Share Tracker Q2 2019: Qualcomm and Samsung Vie for 5G Leadership .

Key Points: 
  • The global cellular baseband processor market declined 4 percent year-over-year to reach $5.0 billion in Q2 2019, according to Strategy Analytics Handset Component Technologies service report, Baseband Market Share Tracker Q2 2019: Qualcomm and Samsung Vie for 5G Leadership .
  • This Strategy Analytics research finds that Qualcomm, HiSilicon, MediaTek, Samsung LSI, and Intel captured the top-five revenue share rankings in the global cellular baseband processor market in Q2 2019.
  • 5G baseband market is off to a great start in 2019.
  • Samsung LSI emerged as an early 5G market contender in Q2 2019 and Strategy Analytics estimates that Qualcomm and Samsung LSI were neck and neck in terms of 5G baseband market share.

Linley Fall Processor Conference Features Innovative Processors and IP for AI Applications, Automotive, IoT, Embedded, and Data Center

Retrieved on: 
Tuesday, October 15, 2019
Data management, Semiconductor, Technology, Software, Networks, Internet, Hardware, Digital electronics, Digital technology, Electronic engineering, Parallel computing, Computer architecture, Fabless semiconductor companies, Microprocessors, Electronic design automation, Multi-core processor, SiFive, Semiconductor intellectual property core, Benchmark

This notable forum explores the latest processors and IP cores for AI (artificial intelligence) applications, automotive, embedded, data center, IoT, and communications.

Key Points: 
  • This notable forum explores the latest processors and IP cores for AI (artificial intelligence) applications, automotive, embedded, data center, IoT, and communications.
  • SiFive will detail a new, high-performance processor core IP with significant compute-capability enhancements.
  • GrAI Matter Labs will introduce its GrAI One chip, which is based on its NeuronFlow architecture, and provide performance and power benchmarks.
  • Facebook Director of AI System Codesign Group, Misha Smelyanskiy, will present Challenges and Opportunities of Architecting AI Systems at Data-Center Scale.

Qualcomm Announces Quarterly Cash Dividend

Retrieved on: 
Tuesday, October 15, 2019
Fabless semiconductor companies, Companies, HSA Foundation, Qualcomm, Telecommunications

SAN DIEGO, Oct. 15, 2019 /PRNewswire/ -- Qualcomm Incorporated (NASDAQ: QCOM) today announced a quarterly cash dividend of $0.62 per common share, payable on December 19, 2019, to stockholders of record at the close of business on December 5, 2019.

Key Points: 
  • SAN DIEGO, Oct. 15, 2019 /PRNewswire/ -- Qualcomm Incorporated (NASDAQ: QCOM) today announced a quarterly cash dividend of $0.62 per common share, payable on December 19, 2019, to stockholders of record at the close of business on December 5, 2019.
  • Qualcomm invents breakthrough technologies that transform how the world connects, computes and communicates.
  • Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including the QCT semiconductor business.
  • Qualcomm is a registered trademark of Qualcomm Incorporated.

Navitas Enables World's Smallest Adapter for World's Fastest Laptop

Retrieved on: 
Tuesday, October 15, 2019
Fabless semiconductor companies, Companies, Technology, Computers, Power supplies, Personal computing, Nvidia, AC adapter, Laptop, Asus, ATI Technologies, Adapter

EL SEGUNDO, Calif., Oct. 15, 2019 /PRNewswire-PRWeb/ -- Navitas Semiconductor today announced its power technology enables the highest density power adapter for the world's fastest laptop, the Asus ProArt StudioBook One.

Key Points: 
  • EL SEGUNDO, Calif., Oct. 15, 2019 /PRNewswire-PRWeb/ -- Navitas Semiconductor today announced its power technology enables the highest density power adapter for the world's fastest laptop, the Asus ProArt StudioBook One.
  • The 300W AC-DC adapter design, developed in collaboration with NVIDIA, exploits the high-speed power-conversion technology of Navitas' GaNFast power ICs to create a powerful, yet light-weight and small-size mobile charger.
  • "Navitas' dedicated technologists worked alongside the NVIDIA engineering design team to address this challenge as part of the NVIDIA ACE reference design, delivering a 300W laptop adapter in half the size of traditional adapters."
  • Navitas GaNFast power ICs enable a new generation of fast-charging mobile adapters for smartphones, tablets and laptops from 27W to 300W+.