In the development of technologies for high-density mounting, electroless plating[4] is becoming mainstream for producing copper and gold plating bumps.
Key Points:
In the development of technologies for high-density mounting, electroless plating[4] is becoming mainstream for producing copper and gold plating bumps.
This method can achieve a fine pitch, but because comparatively higher pressures are required during bonding, there are concerns about possible chip damage.
As precious metals professionals, TANAKA Kikinzoku Kogyo has been conducting research and development into the use of AuRoFUSE(TM), which enables low-temperature, low-pressure bonding with followability of uneven surfaces due to its porousness, to achieve high-density mounting of semiconductors.
Using this new technology, the paste is dried prior to bonding to eliminate fluidity, which minimizes spread and enables high-density mounting (Figure 1).