Tokyo:7619

TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE(TM) Preforms

Retrieved on: 
Monday, March 11, 2024
Electrode, Heat, Copper, Semiconductor, Gold, Research, Temperature, Printed circuit board

In the development of technologies for high-density mounting, electroless plating[4] is becoming mainstream for producing copper and gold plating bumps.

Key Points: 
  • In the development of technologies for high-density mounting, electroless plating[4] is becoming mainstream for producing copper and gold plating bumps.
  • This method can achieve a fine pitch, but because comparatively higher pressures are required during bonding, there are concerns about possible chip damage.
  • As precious metals professionals, TANAKA Kikinzoku Kogyo has been conducting research and development into the use of AuRoFUSE(TM), which enables low-temperature, low-pressure bonding with followability of uneven surfaces due to its porousness, to achieve high-density mounting of semiconductors.
  • Using this new technology, the paste is dried prior to bonding to eliminate fluidity, which minimizes spread and enables high-density mounting (Figure 1).