Etron

Blackview OSCAL Rolls Out Power Station PowerMax 3600 with Expandable Capacity from 3.6kWh to 57.6kWh, 3600W Output, and 24/7 UPS in 5-8ms Switchover

Retrieved on: 
Sunday, January 7, 2024
Fire, Map, Movement, UPS, Lithium, Computer, AC, PV, LCD, Multimedia, Smart, Sunlight, NCM, Wind, System, CPAP, Microwave, Multi, Wilderness, Electricity, Capacity, Etron, Rest, Water, Ageing, BMS, Weather, Lithium iron phosphate, Tablet, Coffee, Safety, Risk, Recreational vehicle, Camping, SOC, EV, Electric battery

As a result, PowerMax 3600 , the first rugged portable power station in the world was introduced.

Key Points: 
  • As a result, PowerMax 3600 , the first rugged portable power station in the world was introduced.
  • PowerMax 3600 also supports remote control with a smart app, so that the operation of the power station is under control regardless of distance.
  • Expandable Power for Tailored-made Occasion, Luggage-like Design for Easy Movement
    -Support up to 15*Extra Batteries(3.6kWh/Per), Capacity From 3.6kWh to 57.6 kWh.
  • Get ready for the unveiling of Blackview OSCAL PowerMax 3600 on Indiegogo, starting from January 10th, 2024, PT.

TIE 2023 opening this October Showcases over 1,000 Innovative Technologies and Demonstrate Taiwan's Strong R&D Capability

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Thursday, October 5, 2023
Online, OSAT, MPI, Government, Organization, Professional corporation, VIS, R, TIE, Futures studies, TWTC, Realtek, Taipei World Trade Center, Oxford Instruments, Etron, Attention, Taipei, Infineon Technologies

TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.

Key Points: 
  • TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.
  • Through a variety of both online and offline avenues, visitors will have the opportunity to experience the latest technological achievements in Taiwan.
  • TIE 2023 will feature participation from 430 domestic and international organizations, with more than 1,000 technological innovations on display.
  • TIE 2023 has invited nearly a hundred organizations from 21 countries, including the United States, Canada, Germany, Japan, and South Korea.

TIE 2023 opening this October Showcases over 1,000 Innovative Technologies and Demonstrate Taiwan's Strong R&D Capability

Retrieved on: 
Thursday, October 5, 2023
Online, OSAT, MPI, Government, Organization, Professional corporation, VIS, R, TIE, Futures studies, TWTC, Realtek, Taipei World Trade Center, Oxford Instruments, Etron, Attention, Taipei, Infineon Technologies

TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.

Key Points: 
  • TAIPEI, Oct. 5, 2023 /PRNewswire/ -- The Taiwan Innotech Expo 2023 (TIE), one of the largest annual technology exchange events, will be held this October.
  • Through a variety of both online and offline avenues, visitors will have the opportunity to experience the latest technological achievements in Taiwan.
  • TIE 2023 will feature participation from 430 domestic and international organizations, with more than 1,000 technological innovations on display.
  • TIE 2023 has invited nearly a hundred organizations from 21 countries, including the United States, Canada, Germany, Japan, and South Korea.

Get Noticed at CES 2023 with Eye-Catching Etron Booths!

Retrieved on: 
Thursday, January 5, 2023
Innovation, Communication, XINK, Health, CV, 3D, USB, SDR, WLCSP, CES, Artificial intelligence, DDR3, Computer security, DDR, DRAM, Privacy, Attention, AI, SPI, DDR2, RPC, SDRAM, ST, Machine learning, LPDDR4, LPDDR2, DDR3 SDRAM, NIR, Connector, Chicago Innovation Awards, Internet, Robotics, Facial recognition, Intelligence, Medical device, Video game console, Computer data storage, Etron, DDR4

STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023.

Key Points: 
  • STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023.
  • The CES demonstrations highlight two jointly developed reference designs, the Ref-B6 and Ref-B3 ASV (Active Stereo Vision) video and depth cameras.
  • Ushering in the era of inclusive application of IntelligenceN, Etron is actively advancing heterogeneous integration of products in product innovation.
  • As advanced DRAM products are needed for heterogeneous integration applications, Etron introduced a new platform for heterogeneous integration of AI and DRAM.

eYs3D Launches One-Stop XINK Development Platform for Vision-Equipped Robots

Retrieved on: 
Tuesday, January 3, 2023
Cortex, Crypto, IEEE 1588, Platform as a service, OSAT, Ecosystem, KGDM, USB, PyTorch, Align Technology, IOT, Intelligence, NPU, AI, TVM, ARM, Sleep, MCU, TW, XINK, CES, Arm, ARM architecture, RPC, Central processing unit, AT1, ARM Cortex-A55, IEEE, DRAM, LVCC, Fourth Industrial Revolution, Arm Ltd., Central Hall, ISP, Machine learning, Consumer electronics, Video game console, Cryptocurrency, Computer data storage, Etron

LAS VEGAS and TAIPEI, Taiwan, Jan. 3, 2023 /PRNewswire/ -- eYs3D Microelectronics, a subsidiary of Etron Technology (TPEx: 5351. TW), a subsidiary of Etron Technology (TPEx: 5351. TW), launched at CES a state-of-the-art computer vision development platform for next-generation autonomous robotic applications such as AIoT (artificial intelligence of things), smart city, indoor cleaning robots, and outdoor agricultural robots for both industrial and retail sectors.

Key Points: 
  • TW), launched at CES a state-of-the-art computer vision development platform for next-generation autonomous robotic applications such as AIoT (artificial intelligence of things), smart city, indoor cleaning robots, and outdoor agricultural robots for both industrial and retail sectors.
  • XINK provides all the necessary elements for product development, including high-performance compute power, AI accelerator, I/O controls and Flexi-bus communication peripherals, smart power management and machine vision subsystems.
  • The modular XINK platform takes care of low-level programming, freeing developers to use cut-and-paste coding for application-specific design while reducing design cycles for quicker commercialization.
  • The eYs3D stereo video and depth camera, empowered by eSP87x, can be connected to the XINK platform via USB to capture video and depth stream for 3D data creation and for AI/ML analysis.