TRENDFORCE


Associated tags: Research, Table, Semiconductor, News, Yoy, Blog, Hardware, Samsung, Other Manufacturing, Manufacturing

Locations: INDIA, MIDDLE EAST, TOKUYAMA, IRAN, WUXI, RUSSIA, LONGI, TAIWAN, ASIA PACIFIC, SK

HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce

Retrieved on: 
Wednesday, March 13, 2024

TrendForce highlights that the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3.

Key Points: 
  • TrendForce highlights that the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3.
  • The current HBM3 supply for NVIDIA’s H100 solution is primarily met by SK hynix, leading to a supply shortfall in meeting burgeoning AI market demands.
  • Samsung’s entry into NVIDIA’s supply chain with its 1Znm HBM3 products in late 2023, though initially minor, signifies its breakthrough in this segment.
  • It’s worth noting that Micron has not yet entered the HBM supply market, leaving SK hynix and Samsung as key players.

TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February, Poised to Shape Japan’s Semiconductor Landscape Over the Next Decade, Says TrendForce

Retrieved on: 
Friday, February 23, 2024

This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%.

Key Points: 
  • This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%.
  • The much-anticipated opening of TSMC’s Kumamoto Plant (JASM) in Japan on the 24th marks TSMC’s debut factory in Japan (Fab-23), signaling a bold step into the future.
  • TrendForce envisions Japan developing three semiconductor powerhouses in Kyushu, Tohoku, and Hokkaido, with Kyushu taking the lead, especially as the home of TSMC’s Kumamoto plant.
  • With concerted efforts from industry, government, and academia, Japan is on the brink of creating a comprehensive semiconductor manufacturing ecosystem.

BYD Set to Challenge Tesla for the Crown in EV Sales in 2024, Says TrendForce

Retrieved on: 
Tuesday, February 20, 2024

TrendForce further notes that China remains the largest market for NEVs, commanding about 60% of the global market share.

Key Points: 
  • TrendForce further notes that China remains the largest market for NEVs, commanding about 60% of the global market share.
  • However, growth is slowing down due to a high base effect, and limited sales growth in other regions cannot compensate for the gap left by the Chinese market.
  • In 2023, Tesla continues to lead BEV rankings with a 19.9% market share, closely followed by BYD, which narrowed the sales gap with Tesla to 248,000 units.
  • TrendForce believes that BYD has the potential to challenge Tesla’s dominance in the BEV market this year.

China and US Bolster Semiconductor Independence as Taiwan’s Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce

Retrieved on: 
Thursday, December 14, 2023

Meanwhile, Taiwan holds nearly 80% when it comes to EUV generation processes (such as 7nm and beyond).

Key Points: 
  • Meanwhile, Taiwan holds nearly 80% when it comes to EUV generation processes (such as 7nm and beyond).
  • 2027, the US’s share of advanced process capacity is expected to increase to 17%, although TSMC and Samsung will still account for over half of this capacity.
  • By 2027, China’s share in mature process capacity is expected to reach 39%, with room for further growth if equipment procurement proceeds smoothly.
  • Customers are also requiring global validation of production lines, even with long-term foundry partners, to enable flexible capacity adjustments.

China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce

Retrieved on: 
Monday, December 11, 2023

This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers.

Key Points: 
  • This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers.
  • TrendForce conjectures that the next-generation Ascend 910B chip is likely manufactured using SMIC’s N+2 process.
  • There remains considerable potential for China to improve and establish a complete AI ecosystem.
  • Chinese CSPs like Baidu and Alibaba are actively investing in autonomous AI chip development.

Japan Flexes Its Advantages in Semiconductor Upstream Equipment and Raw Materials, and Unveils Strategic Progress of Key Players in Kyushu, Tohoku, and Hokkaido, Says TrendForce

Retrieved on: 
Wednesday, November 1, 2023

This underscores Taiwan’s crucial position globally and has motivated regions worldwide to establish semiconductor industries within their territories while considering a multitude of factors.

Key Points: 
  • This underscores Taiwan’s crucial position globally and has motivated regions worldwide to establish semiconductor industries within their territories while considering a multitude of factors.
  • Beyond attracting leading tech giants to establish manufacturing bases, venturing into self-driven R&D has emerged as a viable alternative.
  • TrendForce points out that Japan is also attempting to seize this opportunity for reshuffling, aiming to reclaim the 40 years lost in its semiconductor industry.
  • Based on Japan’s geographical characteristics, TrendForce has identified three potential semiconductor hubs that might emerge in Japan, located in Kyushu, Tohoku, and Hokkaido respectively.

TrendForce 2024: Riding the Wave of Revolutionary Tech Trends

Retrieved on: 
Tuesday, October 17, 2023

Advanced packaging is becoming essential for improving chip performance, conserving hardware space, reducing power consumption, and minimizing latency.

Key Points: 
  • Advanced packaging is becoming essential for improving chip performance, conserving hardware space, reducing power consumption, and minimizing latency.
  • In fact, several 2.5D packaging solutions, including TSMC’s CoWoS, Intel’s EMIB, and Samsung’s I-Cube, have been seen in development for years.
  • Unlike 2.5D packaging, which uses a silicon interposer layer, 3D packaging directly connects chips with different functions using TSVs.
  • Through these advancements, 6G aims to deliver revolutionary applications like holographic projections, tactile communications, and digital twins.

Q4 DRAM Contract Prices Set to Rise, With Estimated Quarterly Increase of 3-8%, Says TrendForce

Retrieved on: 
Friday, October 13, 2023

DRAM prices, for instance, are projected to see a quarterly surge of about 3-8%.

Key Points: 
  • DRAM prices, for instance, are projected to see a quarterly surge of about 3-8%.
  • Overall, as DDR5 adoption accelerates, an approximate 3–8% quarterly increase is projected for PC DRAM contract prices during this period.
  • Looking ahead, Q4 forecasts anticipate stable server DDR4 average prices, while server DDR5 is set to maintain a declining trajectory.
  • This leads to an estimated 3–8% quarterly hike in Q4 server DRAM contract prices.

Surge in Production Demand for Solar N-Type Cells Observed as Battery Technology Evolution Accelerates, Says TrendForce

Retrieved on: 
Thursday, September 21, 2023

Currently, PERC cell technology (for producing P-type cells) stands as the market's mainstay.

Key Points: 
  • Currently, PERC cell technology (for producing P-type cells) stands as the market's mainstay.
  • By 2023's end, it is projected that the total production capacity of polysilicon will reach 2.072 million tons, an increase of 68.6% YoY.
  • As the market leans towards N-type cell technology, P-type silicon may face oversupply, causing its price to drop faster.
  • Driven by the increasing demand for N-type cell wafers, silicon wafer manufacturers are rapidly transitioning to N-type production and ramping up their output.

Server Supply Chain Becomes Fragmented, ODM’s Southeast Asia SMT Capacity Expected to Account for 23% in 2023, Says TrendForce

Retrieved on: 
Wednesday, August 23, 2023

US-based CSPs have been establishing SMT production lines in Southeast Asia since late 2022 to mitigate geopolitical risks and supply chain disruptions.

Key Points: 
  • US-based CSPs have been establishing SMT production lines in Southeast Asia since late 2022 to mitigate geopolitical risks and supply chain disruptions.
  • It’s projected that by 2023, the production capacity from these regions will account for 23%, and by 2026, it will approach 50%.
  • Meanwhile, Foxconn has renovated its existing facilities in Hanoi, Vietnam and uses its Wisconsin plant to accommodate customer needs.
  • Inventec’s current strategy mirrors that of Quanta, with plans to build SMT production lines in Thailand by 2024 and commence server production in late 2024.