MCQ

Reeves College Receives Dental Accreditation

Retrieved on: 
Thursday, February 22, 2024

Edmonton, Feb. 22, 2024 (GLOBE NEWSWIRE) -- Reeves College is pleased to announce that the Commission on Dental Accreditation of Canada (CDAC) accredited the Edmonton South Campus’ Dental Assisting program for two years.

Key Points: 
  • Edmonton, Feb. 22, 2024 (GLOBE NEWSWIRE) -- Reeves College is pleased to announce that the Commission on Dental Accreditation of Canada (CDAC) accredited the Edmonton South Campus’ Dental Assisting program for two years.
  • Furthermore, Reeves College Edmonton South put the Dental Assisting program on the books in June 2022.
  • We, and our students, were positively elated when we heard the great news.”
    The Dental Assisting program at Reeves College Edmonton South is an 11-month Program.
  • It includes a 140-hour-long practicum, and optional career opportunities are dental office, hospital dental department, dental laboratories, and public health clinics.

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Retrieved on: 
Wednesday, November 22, 2023

DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.

Key Points: 
  • DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.
  • As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
  • With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset.
  • "The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency."

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Retrieved on: 
Wednesday, November 22, 2023

DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.

Key Points: 
  • DUBAI, UAE, Nov. 22, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.
  • As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
  • With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset.
  • Dimensity 8300 will power 5G devices launching in the global market before the end of 2023.

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Retrieved on: 
Tuesday, November 21, 2023

HSINCHU, Nov. 21, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Key Points: 
  • HSINCHU, Nov. 21, 2023 /PRNewswire/ -- MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones.
  • As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
  • With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset.
  • Dimensity 8300 will power 5G devices launching in the global market before the end of 2023.

View the Night - When Art Becomes a Sensorial, Poetic Experience

Retrieved on: 
Wednesday, November 1, 2023

I love to explore the city on foot at night to enjoy a unique experience," notes Philippe*.

Key Points: 
  • I love to explore the city on foot at night to enjoy a unique experience," notes Philippe*.
  • View the Night is also an encounter with nocturnal light, whether it is natural, like moonlight and starlight, or artificial, like candles and electric lights.
  • Led by Maude Lévesque, exhibition curator, the MNBAQ's teams sought to offer a museum experience that allows art to express itself, unaccompanied by texts.
  • View the Night comprises more than 60 works from the MNBAQ's collections, from ancient art to present-day art, and 15 objects from the collection of the Musée de la civilisation (MCQ).

Kioxia Introduces Next-Generation UFS Ver. 4.0 Devices

Retrieved on: 
Wednesday, May 31, 2023

Continuing to move Universal Flash Storage[1] (UFS) technology forward, Kioxia Corporation , a world leader in memory solutions, today announced sampling[2] of new, higher performing UFS Ver.

Key Points: 
  • Continuing to move Universal Flash Storage[1] (UFS) technology forward, Kioxia Corporation , a world leader in memory solutions, today announced sampling[2] of new, higher performing UFS Ver.
  • 4.0 devices from Kioxia integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.
  • *Read and write speeds are the best values obtained in a specific test environment at Kioxia Corporation and Kioxia Corporation warrant neither read nor write speeds in individual devices.

KIOXIA Introduces Next-Generation UFS Ver. 4.0 Devices

Retrieved on: 
Tuesday, May 30, 2023

Continuing to move Universal Flash Storage1 (UFS) technology forward, KIOXIA America, Inc. today announced sampling2 of new, higher performing UFS Ver.

Key Points: 
  • Continuing to move Universal Flash Storage1 (UFS) technology forward, KIOXIA America, Inc. today announced sampling2 of new, higher performing UFS Ver.
  • The improved performance3 of UFS products from KIOXIA enables these applications to take advantage of 5G’s connectivity benefits, leading to faster downloads, reduced lag time and an improved user experience.
  • 4.0 devices from KIOXIA integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • “Once again KIOXIA is maintaining its leadership in UFS, with our pipeline of newer, faster performing UFS devices,” noted Scott Beekman, vice president, Memory Business Unit, for KIOXIA America, Inc. “This is our second generation of UFS 4.0 devices, which were developed to keep pushing the performance boundaries from generation to generation.”
    Performance improvement over previous generation4: +18% sequential write, +30% random write and +13% random read.

MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings

Retrieved on: 
Tuesday, November 8, 2022

HSINCHU, Nov. 8, 2022 /PRNewswire/ -- MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe.

Key Points: 
  • HSINCHU, Nov. 8, 2022 /PRNewswire/ -- MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones.
  • "MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek.
  • With support for extreme performance gaming displays, eye-catching resolution and extended foldable designs, the chipset's MediaTek MiraVision 890 display technology brings content to life.
  • Leading in power efficiency with its eXtreme Power Saving Technology for AI-noise reduction andAI-super resolution tasks, the Dimensity 9200 provides up to 30% power savingswith AI-NR, and 45% power savings with AI-SR in all visual applications.

MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings

Retrieved on: 
Tuesday, November 8, 2022

HSINCHU, Nov. 8, 2022  /PRNewswire/ -- MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe.

Key Points: 
  • HSINCHU, Nov. 8, 2022 /PRNewswire/ -- MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones.
  • "MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek.
  • With support for extreme performance gaming displays, eye-catching resolution and extended foldable designs, the chipset's MediaTek MiraVision 890 display technology brings content to life.
  • Leading in power efficiency with its eXtreme Power Saving Technology forAI-noise reduction andAI-superresolution tasks,the Dimensity 9200 provides up to30%power savingswith AI-NR,and 45% power savings with AI-SR in all visual applications.

NFW Closes $85 Million Series B to Scale First Naturally Circular Materials Platform and Reach New Markets

Retrieved on: 
Tuesday, April 12, 2022

PEORIA, Ill., April 12, 2022 /PRNewswire-PRWeb/ -- Natural Fiber Welding, Inc. (NFW) today announced that they have closed an $85 million funding round to scale production of high-performance, all-natural, circular materials products coming to market with a wide array of global brand partners. Evolution VC Partners led the round, with participation by Tattarang, Lewis & Clark AgriFood, Collaborative Fund, AiiM Partners, Engine No.1, Raga Partners, Tidal Impact, Scrum Ventures, and Gaingels. Return investors include BMW i Ventures, Ralph Lauren Corporation, Advantage Capital, and Central Illinois Angels.

Key Points: 
  • NFW engineers and manufactures: CLARUS, a family of high-performance, all-natural textiles; and MIRUM, the only next-generation, zero-plastic complement to leather.
  • NFW's global customer base includes leading brands who are aiming to provide their consumers with beautiful, high-performance petrochemical-free materials.
  • NFW is using the Series B funding to continue scaling the CLARUS and MIRUM materials platforms in order to meet global demand.
  • The Peoria-based company is also extending its product offerings to molded composite materials to enable and encourage global brand partners to design unprecedented, comprehensively circular products.