Center for Advancing Electronics Dresden

proteanTecs Enhances Astera Labs’ Connectivity Solutions with Performance and Reliability Monitoring

Retrieved on: 
Tuesday, October 31, 2023
Data Management, Semiconductor, Technology, Telecommunications, Software, Networks, Artificial Intelligence, Ethernet, EVP, Engineering, Health, SVP, Center for Advancing Electronics Dresden, Multimedia, Electronics, AI, ATE, Video game

Astera Labs, the global leader in semiconductor-based connectivity solutions for accelerated computing, has implemented proteanTecs’ technology to enable ML-driven diagnostics and fleet management capabilities.

Key Points: 
  • Astera Labs, the global leader in semiconductor-based connectivity solutions for accelerated computing, has implemented proteanTecs’ technology to enable ML-driven diagnostics and fleet management capabilities.
  • View the full release here: https://www.businesswire.com/news/home/20231031060828/en/
    Astera Labs enriches connectivity solutions with proteanTecs’ on-chip monitoring and deep data analytics.
  • By using proteanTecs’ on-chip Agents, cloud-based platform and ATE software, Astera Labs is strengthening its rigorous testing and enhancing its chips with lifetime reliability monitoring.
  • “Astera Labs is breaking performance barriers with its game-changing cloud-scale solutions,” said Sanjay Lall, EVP of Worldwide Sales at proteanTecs.

ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics

Retrieved on: 
Wednesday, October 4, 2023
Technology, Semiconductor, Automotive, General Automotive, Professional Services, Software, Hardware, Data Analytics, Data Management, Partnership, Failure, Electronics, CSO, Health, PDT, Automotive industry, Multimedia, Quality, ELES, Cloud computing, IEEE, Application development, STMicroelectronics, Data analysis, Center for Advancing Electronics Dresden, Performance, Quality and Reliability Engineering International, Automotive Electronics Council, Software reliability testing, Safety, Calibration, Medical device, Instrumentation, Reliability

proteanTecs, a global leader of deep data analytics for advanced electronics, and ELES, a worldwide provider of semiconductor device reliability testing solutions, today announced their partnership for safety and mission-critical applications.

Key Points: 
  • proteanTecs, a global leader of deep data analytics for advanced electronics, and ELES, a worldwide provider of semiconductor device reliability testing solutions, today announced their partnership for safety and mission-critical applications.
  • The collaboration combines proteanTecs’ Health and Performance Monitoring solutions with ELES’ Design for Reliability methodology and advanced reliability test platforms.
  • The two companies have published a new white paper highlighting the joint benefits, titled “Using Deep Data Analytics to Enhance Reliability Testing: The Fast Roadmap for Zero Defects,” which can be downloaded here .
  • View the full release here: https://www.businesswire.com/news/home/20231004677256/en/
    ELES and proteanTecs announce their partnership to enhance reliability testing with deep data analytics.

proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem

Retrieved on: 
Monday, September 25, 2023
Software, Data Analytics, Packaging, Data Management, Professional Services, Technology, Semiconductor, Manufacturing, Business development, Partnership, 3D IC, Electronics, Business, Multimedia, OIP, IP, Cloud computing, Info, HPC, TSMC, Center for Advancing Electronics Dresden, Ecosystem, Silicon

The newest alliance in TSMC’s OIP ecosystem, the 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

Key Points: 
  • The newest alliance in TSMC’s OIP ecosystem, the 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.
  • View the full release here: https://www.businesswire.com/news/home/20230925037205/en/
    proteanTecs joins the TSMC Open Innovation Platform® (OIP) 3DFabric™ Alliance.
  • “proteanTecs is pleased to collaborate within the 3DFabric Alliance to accelerate the adoption of 3D heterogenous systems.
  • proteanTecs is speaking today at the TSMC OIP 3DFabric Alliance Workshop event on the capabilities and benefits of die-to-die interconnect monitoring.

Kulicke & Soffa Appoints Denise M. Dignam to its Board of Directors

Retrieved on: 
Wednesday, August 23, 2023
Hydrogen, Workforce, Semiconductor, Gail T. Kulick, Titanium dioxide, CC, Marketing, Electronics, DuPont, KLIC, TT, Woman, National Mining Association, APM, Drexel University, Six Sigma, Chemical industry, Engineering, Osaka Titanium Technologies, Growth, Chamber of commerce, Chemical engineering, NYSE, Center for Advancing Electronics Dresden, Commerce, Management, Science, Chemours

SINGAPORE, Aug. 23, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company") today announced the appointment of Denise M. Dignam to its Board of Directors.

Key Points: 
  • SINGAPORE, Aug. 23, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company") today announced the appointment of Denise M. Dignam to its Board of Directors.
  • Ms. Dignam currently serves as a Board Member of the National Mining Association, and was previously appointed as a Board Member to the United States Chamber of Commerce.
  • Ms. Dignam has a passion for strategy development and execution with key competencies in continuous improvement, organizational design, agile methodologies, commercial excellence, and M&A.
  • Peter Kong, Chairman of the K&S Board of Directors, stated, "We welcome Denise to the K&S Board.

proteanTecs and Teradyne Partner to Bring Machine Learning-driven Telemetry to SoC Testing

Retrieved on: 
Tuesday, July 11, 2023
Robotics, Professional Services, Data Management, Semiconductor, Data Analytics, Technology, Hardware, Partnership, Electronics, DSP, DUT, Multimedia, Machine learning, Socs, Center for Advancing Electronics Dresden, Longevity, AVS, DAC, Video game, Printed circuit board, Teradyne

View the full release here: https://www.businesswire.com/news/home/20230711125559/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20230711125559/en/
    proteanTecs and Teradyne have partnered to accelerate joint customers’ time to market and provide actionable insights on both the tester and in the cloud.
  • Alphawave Semi, a global leader in high-speed connectivity for the world’s technology infrastructure, is using proteanTecs’ deep data analytics and Teradyne’s automated test solutions.
  • Teradyne and proteanTecs will be showcasing their collaboration in a joint demonstration during DAC and SEMICON West.
  • proteanTecs’ solutions can now be instantiated in Teradyne’s IG-XL software via the Teradyne PortBridge tool for use on Teradyne’s UltraFLEX and UltraFLEXplus testers.

proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023

Retrieved on: 
Wednesday, July 5, 2023
Technology, Semiconductor, Other Technology, Health Technology, Professional Services, Software, Hardware, Health, Data Analytics, Momentum, Electronics, Convention, PDT, The Office, Multimedia, Human back, Marketing, Future, PDF Solutions, Intel, Center for Advancing Electronics Dresden, Silicon, GUC, DAC, Nightclub, Video game, Microsoft, Cadence

DESIGN AUTOMATION CONFERENCE (DAC) and SEMICON WEST – proteanTecs, a global leader of deep data analytics for advanced electronics, will exhibit and speak at DAC and SEMICON West 2023.

Key Points: 
  • DESIGN AUTOMATION CONFERENCE (DAC) and SEMICON WEST – proteanTecs, a global leader of deep data analytics for advanced electronics, will exhibit and speak at DAC and SEMICON West 2023.
  • Attendees are invited to meet with proteanTecs’ experts at DAC booth #2449 from July 10-12, and SEMICON West booth #1834 from July 11-13.
  • View the full release here: https://www.businesswire.com/news/home/20230705203526/en/
    proteanTecs to showcase the future of health and performance monitoring at DAC and SEMICON West 2023.
  • (Graphic: Business Wire)
    proteanTecs’ DAC and SEMICON West booths will have collaborative demonstrations with partners Advantest, Teradyne, PDF Solutions and Global Unichip Corporation (GUC).

proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers

Retrieved on: 
Monday, May 15, 2023
Telecommunications, Software, Networks, Data Analytics, Hardware, Data Management, Professional Services, Technology, IDC, Meta, Electronics, SDES, Open Compute Project, Multimedia, SDC, OCP, CEST, Center for Advancing Electronics Dresden, Cryptocurrency

proteanTecs, a global leader of deep data analytics for advanced electronics, announced that the company will participate in an Open Compute Project (OCP) educational webinar titled “Addressing Silent Data Errors for Resilient Data Centers.” Featuring experts from Google, IDC and proteanTecs, this webinar will be held on Thursday, May 18at 8 am PDT/ 11 am EDT/ 5 pm CEST.

Key Points: 
  • proteanTecs, a global leader of deep data analytics for advanced electronics, announced that the company will participate in an Open Compute Project (OCP) educational webinar titled “Addressing Silent Data Errors for Resilient Data Centers.” Featuring experts from Google, IDC and proteanTecs, this webinar will be held on Thursday, May 18at 8 am PDT/ 11 am EDT/ 5 pm CEST.
  • View the full release here: https://www.businesswire.com/news/home/20230515005074/en/
    proteanTecs will present alongside Google and IDC, in an Open Compute Project (OCP) webinar on silent data errors (SDEs) in data centers.
  • In addition, the speakers will discuss innovative mechanisms that will greatly assist in reducing the magnitude of SDCs and how these solutions can optimize datacenter resilience.
  • “Silent data errors is an issue that is only going to multiply with the increased interest in AI driving an expansion of compute infrastructure,” said Cliff Grossner, Ph.D., Vice President of Market Intelligence & Innovation at the Open Compute Project.

FuriosaAI Enhances Next-Generation AI Chips with proteanTecs’ Deep Data Analytics

Retrieved on: 
Tuesday, May 9, 2023
Semiconductor, Data Management, Technology, Artificial Intelligence, Software, Pleasure, EVP, Center for Advancing Electronics Dresden, Multimedia, Electronics, Medical device, AI

proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that FuriosaAI has selected their deep data analytics solutions to ensure performance and field reliability of their cutting-edge inference chips.

Key Points: 
  • proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that FuriosaAI has selected their deep data analytics solutions to ensure performance and field reliability of their cutting-edge inference chips.
  • FuriosaAI, a leading South Korean AI company with a robust and flexible software stack, will use proteanTecs’ technology in their next-generation AI accelerators targeted at hyperscale data centers.
  • View the full release here: https://www.businesswire.com/news/home/20230509005005/en/
    FuriosaAI enhances next-generation AI chips with proteanTecs’ deep data analytics.
  • (Graphic: Business Wire)
    “Speedy and robust execution is our main focus as we work to deliver competitive, high-performance AI accelerator products for data center servers,” says June Paik, CEO at FuriosaAI.

proteanTecs Joins IOWN Global Forum, Supports Industry Collaboration in Shaping Next-Generation Communications Infrastructure

Retrieved on: 
Wednesday, April 19, 2023
Electronic Design Automation, Data Management, Technology, Mobile, Wireless, Software, Networks, Hardware, Toronto Global Forum, Electronics, CSO, Sony, Wireless network, Multimedia, 2000s, Rochester Telephone Corporation, Nippon Telegraph and Telephone, Intel, Center for Advancing Electronics Dresden, Silicon, NTT, Forum, Mobile phone, Asset management

proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that it has joined the Innovative Optical and Wireless Network (IOWN) Global Forum .

Key Points: 
  • proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that it has joined the Innovative Optical and Wireless Network (IOWN) Global Forum .
  • View the full release here: https://www.businesswire.com/news/home/20230419005014/en/
    proteanTecs joins IOWN Global Forum and supports collaboration to meet future data and computing requirements.
  • (Graphic: Business Wire)
    Founded in January 2020 by Nippon Telegraph and Telephone Corporation (NTT), Intel, and Sony, IOWN Global Forum is focused on defining next-generation communications infrastructure to create a smarter, fully connected world.
  • We look forward to sharing our approach to ensuring reliability while offering new concepts for power and performance optimization as we build relationships throughout the IOWN Global Forum community.”

Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board

Retrieved on: 
Wednesday, March 29, 2023
Hardware, Data Management, Technology, Artificial Intelligence, Software, Technical University of Berlin, Georgios, McPherson, Electronics, Institute of technology, Communication, CAD, IC, ML, Multimedia, IP, Oracle, VLSI, Advisory board, TPU, IEEE, Publication, HPC, TPC, Center for Advancing Electronics Dresden, Silicon, Sun Microsystems, AI, IRPS, ISSCC, Video game, Industrial design, Management, Physics

proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that Georgios Konstadinidis has joined its Advisory Board.

Key Points: 
  • proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that Georgios Konstadinidis has joined its Advisory Board.
  • A high performance computing (HPC) and AI hardware design expert, Georgios will offer his deep technical expertise to the company.
  • View the full release here: https://www.businesswire.com/news/home/20230329005182/en/
    proteanTecs welcomes high performance computing hardware expert Georgios Konstadinidis to its advisory board.
  • “proteanTecs is carving out a clear path in the industry, and I am eager to contribute to their continued success,” said proteanTecs’ newly appointed advisory board member, Georgios Konstadinidis.