DL Boost

DFI Collaborates with MDS to Showcase AI Embedded Solutions at Smart Factory + Automation World 2024

Retrieved on: 
Wednesday, March 20, 2024
Deep learning, DFI, DL Boost, SOC, Face, Acceleration, Intelligence, Xe, AI, VNNI, SBC, IMB, Xeon, MDS, Som, Smart

TAIPEI, March 20, 2024 /PRNewswire/ -- DFI, the world's leading brand in embedded motherboards and industrial computers, is thrilled to announce its collaboration with Korean distributor MDS for a groundbreaking co-exhibition at Smart Factory + Automation World 2024 in Seoul, Korea. The showcase will feature an exclusive demonstration of the TGH960 System-on-Module and its AI edge computing applications, highlighting its deep learning capabilities and face and object recognition features.

Key Points: 
  • TAIPEI, March 20, 2024 /PRNewswire/ -- DFI , the world's leading brand in embedded motherboards and industrial computers, is thrilled to announce its collaboration with Korean distributor MDS for a groundbreaking co-exhibition at Smart Factory + Automation World 2024 in Seoul, Korea.
  • Founded in 1990, Smart Factory + Automation World 2024 is a premier international exhibition in the Korean automation market that brings together industry leaders, innovators, and technology enthusiasts from around the world.
  • As leaders at the forefront of the embedded industry, DFI and MDS aim to leverage the platform to redefine the future of the smart manufacturing and industrial automation industry.
  • The AI BOX from MDS has received positive feedback from numerous customers in terms of its performance in deep learning.

Sealing Technologies Puts End User Input at the Core of the SN 3100 XP Server Node

Retrieved on: 
Wednesday, July 19, 2023
Crypto, NVM Express, Swap, TB, Acceleration, Xeon D, XP, DL Boost, SATA, Data analysis, Dynamic Sealing Technologies, Inc., Intel, Deep learning, Xeon, GPU, Video game

COLUMBIA, Md., July 19, 2023 /PRNewswire/ -- Sealing Technologies, Inc. (SealingTech), a veteran-owned business that provides innovative cybersecurity solutions, proudly introduces its latest product: the SN 3100 XP server node.

Key Points: 
  • COLUMBIA, Md., July 19, 2023 /PRNewswire/ -- Sealing Technologies, Inc. (SealingTech), a veteran-owned business that provides innovative cybersecurity solutions, proudly introduces its latest product: the SN 3100 XP server node.
  • With a role as data analysis and network sensor, the SN 3100 XP sets a new standard in portable edge computing.
  • Building upon the success of its predecessor, the SN 3000, the SN 3100 XP offers an expanded range of options within a similar portable footprint.
  • "The SN 3100 XP represents the next evolution of our compact and highly mobile hyper-converged server with built-in advanced hardware acceleration.

DFI Unveils ATX Motherboard ICX610-C621A Facilitating the Integration of AI Computing

Retrieved on: 
Wednesday, August 24, 2022
ECC, Intel, PCI Express, Deep learning, Central processing unit, MHZ, CPU, DL Boost, CT, ATX, AVX-512, Communication, AOI, MRI, Automation, VNNI, AI, Efficiency

TAIPEI, Aug. 24, 2022 /PRNewswire/ --DFI, the global leading provider of high-performance computing technology across multiple embedded industries,unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform,powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205W.

Key Points: 
  • TAIPEI, Aug. 24, 2022 /PRNewswire/ --DFI, the global leading provider of high-performance computing technology across multiple embedded industries,unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform,powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205W.
  • ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power.
  • As a result, it improves the performance by 1.46 times compared to previous generation.
  • The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHZ, enhances high end performance for advanced inspection equipment and improves efficiency.

DFI Unveils ATX Motherboard ICX610-C621A Facilitating the Integration of AI Computing

Retrieved on: 
Wednesday, August 24, 2022
ECC, Intel, PCI Express, Deep learning, Central processing unit, MHZ, CPU, DL Boost, CT, ATX, AVX-512, Communication, AOI, MRI, Automation, VNNI, AI, Efficiency

TAIPEI, Aug. 24, 2022 /PRNewswire/ --DFI, the global leading provider of high-performance computing technology across multiple embedded industries,unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform,powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205W.

Key Points: 
  • TAIPEI, Aug. 24, 2022 /PRNewswire/ --DFI, the global leading provider of high-performance computing technology across multiple embedded industries,unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform,powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205W.
  • ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power.
  • As a result, it improves the performance by 1.46 times compared to previous generation.
  • The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHZ, enhances high end performance for advanced inspection equipment and improves efficiency.

Real-time VVC/H.266 UHD Encoder Announced by Spin Digital

Retrieved on: 
Tuesday, August 2, 2022
Scalability, Algorithm, Xeon, Environment, DL Boost, Digital, Industry, RTP, HFR, Intel, CPU, SIMD, IBC, Spin, HTTP, Deep learning, VOD, Internet, HEVC, Sport, VR, Efficiency, ABR, HDR, High frame rate, SDI, Gesellschaft mit beschränkter Haftung, Ultra-high-definition television, Virtual reality, HLS, Television, Computer data storage, Cassette tape, UHD, Ice Lake, VVC

BERLIN,  August 02, 2022  /PRNewswire-PRWeb/ -- Spin Digital announced today the availability of the first version of a real-time VVC/H.266 encoder designed for live UHD (4K and 8K) streaming and broadcasting applications.

Key Points: 
  • Spin Digital announced today the release of a new real-time VVC/H.266 software encoder for Ultra HD (4K, 8K) streaming and broadcasting.
  • BERLIN, August 02, 2022 /PRNewswire-PRWeb/ -- Spin Digital announced today the availability of the first version of a real-time VVC/H.266 encoder designed for live UHD (4K and 8K) streaming and broadcasting applications.
  • Spin Digital Video Technologies GmbH (Spin Digital) develops high-performance video codecs for the next generation of ultra-high-quality video applications.
  • Spin Digital, Spin Enc Live and Spin Player VVC are trademarks of Spin Digital Video Technologies GmbH.

DFI New-Gen ADS Series Embedded Computing Solutions for Intelligent Workload Optimization

Retrieved on: 
Tuesday, June 14, 2022
IOV, Eye, IEEE 802.11ax-2021, VNNI, GFX, DFI, Deep learning, DL Boost, AI, Intelligence, Intel, GPU, PCI Express, Computer, VM, POC, Efficiency, SR-IOV, Video game console

Besides the new hybrid architecture, the ADS Series also supports PCIe 5.0 high-speed signal transmission for the first time, achieving a data transfer speed 2X faster than the previous-gen PCIe 4.0.

Key Points: 
  • Besides the new hybrid architecture, the ADS Series also supports PCIe 5.0 high-speed signal transmission for the first time, achieving a data transfer speed 2X faster than the previous-gen PCIe 4.0.
  • Numerous data transfers, shares and backups are processed through the high-speed 10GLAN on the ADS Series Computers, significantly improving operating efficiency.
  • The new ADS Series is designed to help integrators maximize the use of each device, reduce configuration, and lower costs.
  • While improving overall computing performance and efficiency, the ADS Series is also equipped with I/O virtualization of GFX SR-IOV for the first time.

ADLINK Presents Edge Server-class COM-HPC Server Type and COM Express Type 7 Modules Powered Latest Intel® Xeon® D Processors

Retrieved on: 
Tuesday, March 8, 2022
Time, TSN, DDR4, SAS, PCI Express, LCC, Twitter, MB, Telecommunication, LAN, VNNI, Gen4 Energy, HCC, Ethernet, BMC, Health, Facebook, Intel, COM Express, LinkedIn, COMS, AI, MMC, AWS, Temperature, Natural language processing, Xeon, TDP, Time-Sensitive Networking, IKVM.NET, CPU, Artificial intelligence, Computer, ROS, Technology, COM, Ice Lake, IOT, Robotics, Acceleration, Transport, ADLINK, VGA, IPMB, HPC, DL Boost, SOL, Computer data storage, Satellite navigation device, Software, Serial, NVIDIA

"Their integrated high-speed Ethernet significantly reduces the complexity and time required in design and development processes," says Alex Wang, Senior Product Manager Module Product Center, ADLINK.

Key Points: 
  • "Their integrated high-speed Ethernet significantly reduces the complexity and time required in design and development processes," says Alex Wang, Senior Product Manager Module Product Center, ADLINK.
  • "With industrial-grade reliability and extended temperature range make these modules especially suitable for mission-critical edge applications," he adds.
  • For more information about ADLINK COMs, follow the links for ADLINK COM-HPC-sIDH (COM-HPC Server Type) and Express-ID7 (COM Express Type 7) modules.
  • ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence.