Land grid array

Renesas Unveils First Family of Automotive Radar Transceivers with Industry’s Highest Accuracy and Lowest Power Consumption

Retrieved on: 
Wednesday, November 16, 2022
Semiconductor, Automotive, Automotive Manufacturing, General Automotive, Technology, Manufacturing, Hardware, Renesas Electronics, Level 3, Steradian, Senior, ReMarkable, Radar, Winning Combinations: Deep Purple and Rainbow, Multimedia, MIMO, Safety, IATF, ADAS, Enterprise Electronics Corporation, IATF 16949, MMIC, Land grid array, Combination, IOT, TSE, ADC, Instrumentation, Television

Leveraging automotive expertise accumulated through years of global customer engagements, Renesas will incorporate the new RAA270205 high-definition radar transceiver into its growing sensor fusion portfolio, which combines radar, vision systems, and other sensing modalities.

Key Points: 
  • Leveraging automotive expertise accumulated through years of global customer engagements, Renesas will incorporate the new RAA270205 high-definition radar transceiver into its growing sensor fusion portfolio, which combines radar, vision systems, and other sensing modalities.
  • The new transceiver MMIC (monolithic microwave integrated circuit) is especially suited for imaging radar, long-range forward-looking radar and 4D radar, but can also be used for corner and central-processing radar architectures, the so-called satellite automotive radar systems.
  • Power consumption of 1.2W is 50 percent lower than comparable transceivers and it delivers a noise figure of 9dB, which is 3dB less than other radar transceivers.
  • Renesas has plans to combine the RAA270205 transceiver with other compatible devices from its portfolio to support automotive radar systems.

Global IC Packaging Market Report to 2027 - by Type, Bonding Technique, Application & Region - ResearchAndMarkets.com

Retrieved on: 
Monday, May 30, 2022
Technology, Hardware, Semiconductor, Other Technology, FC, Land grid array, VPS, BGA, Quad flat package, AI, Ball grid array, IOT, SOJ, Region, DIP, Package, QFP, IC, USD, SOP, COVID-19, Packaging and labeling, LGA, Marketing, Small outline integrated circuit, Double, WLP, Industry, LATAM, Primary, CSP, Chip-scale package, PGA, ICT, QFN, CAGR, Flip chip, Chief executive officer, Growth, Application, MEA, Analysis, Video game, Medical device

The "Global IC Packaging Market, By Type, Bonding Technique, Application & By Region - Forecast and Analysis 2022-2027" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Global IC Packaging Market, By Type, Bonding Technique, Application & By Region - Forecast and Analysis 2022-2027" report has been added to ResearchAndMarkets.com's offering.
  • The global IC packaging market was valued at USD 78.18 Million in 2021, and it is expected to reach a value of USD 134.77 Million by 2027, at a CAGR of more than 9.50% over the forecast period (2022 - 2027).
  • The global market was valued at USD 71.4 billion, witnessing a sluggish growth in 2020, amid COVID-19.
  • Top-down and bottom-up approaches were used to estimate and validate the size of the IC Packaging market and to estimate the size of various other dependent submarkets.

Industry's highest power density, 48 Vin charge pump step-down, DC-DC converter module

Retrieved on: 
Monday, March 21, 2022
PCB, Sale, APEC, Multimedia, Land grid array, PlayStation 4 technical specifications, Routing protocol, DC-DC, IOT, Vin, Solution, LGA, 6A, Efficiency, Temperature, Printed circuit board, Electric motor

HOUSTON, March 21, 2022 /PRNewswire/ -- APPLIED POWER ELECTRONICS CONFERENCE (APEC) - Murata today announced the development of the MYC0409, the industry's highest power density(5.4kW/inch3), 48 Vin divide-by-4 charge pump capacitor divider module with all passive components integrated in a low profile PSiP package. Capable of delivering up to 72 watts of power with peak efficiency of around 97-percent, the interleaved, switching capacitor architecture is based on Murata's unique lossless charge pump technology, providing extremely low input and output ripple performance. The solution is presented in a compact footprint with 2.0 mm height, making it ideal for low profile applications and placement on the underside of system boards. MYC0409 devices can be connected in parallel to provide high power, high efficiency solutions suitable for a variety of 48V to 12V step-down conversion applications such as datacenters, networking routers, base stations and optical equipment.  

Key Points: 
  • HOUSTON, March 21, 2022 /PRNewswire/ -- APPLIED POWER ELECTRONICS CONFERENCE (APEC) - Murata today announced the development of the MYC0409, the industry's highest power density(5.4kW/inch3), 48Vin divide-by-4 charge pump capacitor divider module with all passive components integrated in a low profile PSiP package.
  • "5G and IoT data-driven applications are pushing the limits for datacenter and networking power requirements.
  • "Previously, we released PE25204 as part of our FlexiCPportfolio, discrete charge pump IC, which is akin to a virtually lossless DC transformer.
  • Now, we are unveiling the MYC0409 UltraCPcharge pump capable of ultra-high efficiency conversion from 48 Vin bus in a low profile, compact PSiP package."

ERS electronic Appoints Mark Wachter as Chief Financial Officer

Retrieved on: 
Thursday, January 13, 2022
Technology, Other Manufacturing, Semiconductor, Manufacturing, Fan-out wafer-level packaging, Land grid array, IEEE Transactions on Advanced Packaging, FOWLP, Gesellschaft mit beschränkter Haftung, Atmosphere, CEO, Solution, Industry, Ministry of Education (Malaysia), CFO, Multimedia, Head, ERS, Management, Porsche

ERS electronic, the world leader in the market of thermal management solutions for semiconductor manufacturing, announces the appointment of Mark Wachter as Chief Financial Officer of the company.

Key Points: 
  • ERS electronic, the world leader in the market of thermal management solutions for semiconductor manufacturing, announces the appointment of Mark Wachter as Chief Financial Officer of the company.
  • View the full release here: https://www.businesswire.com/news/home/20220113005406/en/
    Mark Wachter joins ERS electronic as new Chief Financial Officer (Photo: Business Wire)
    Following its strong financial performance and all-time high revenue in 2021, ERS is expanding its C-level executive team with a new member.
  • Wachter will be responsible for all financial operations of ERS worldwide, effective immediately.
  • Mark has a proven track record of financial leadership and delivering great results, so were thrilled to have him on board, said Laurent Giai-Miniet, CEO of ERS electronic.