WLBI

Advantest to Showcase Latest Test Solutions at SEMICON Japan, Dec. 13-15 in Tokyo

Retrieved on: 
Tuesday, December 12, 2023

TOKYO, Dec. 12, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON Japan 2023 on December 13-15 at the Tokyo Big Sight.

Key Points: 
  • TOKYO, Dec. 12, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its latest test solutions at SEMICON Japan 2023 on December 13-15 at the Tokyo Big Sight.
  • In booth #1648, Hall 1, Advantest will showcase its broad range of test technologies enabling the evolution of increasingly complex semiconductors, which are essential to our daily lives.
  • NEW: HA1200 , offering die test capability with active thermal control to enable at-speed 100% test coverage before the dies are assembled into 2.5D/3D packages.
  • NEW: T5230 memory test system adopts a combined array architecture to reduce test cost for NAND/NVM wafer test, including wafer-level burn-in (WLBI).

Advantest Targets NAND Flash/NVM Market with New Group of Memory Test Products

Retrieved on: 
Thursday, December 7, 2023

TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products.

Key Points: 
  • TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products.
  • The new products include the T5230 memory wafer test solution; the STM32G third-generation protocol NAND system-level test module for the T5851 memory tester; and the T5835 high-speed wafer-sort interface option.
  • The T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST).
  • Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell.

Advantest Announces New Versatile, High-Throughput Test Solution for NAND/Nonvolatile Flash Memory ICs

Retrieved on: 
Monday, November 29, 2021

Worldwide sales of NAND wafer test equipment for multi-stacked type probers are approximately US$100 million per year, accounting for an estimated seven percent of the total memory market.

Key Points: 
  • Worldwide sales of NAND wafer test equipment for multi-stacked type probers are approximately US$100 million per year, accounting for an estimated seven percent of the total memory market.
  • As the market grows, customers are shifting away from high-functionality wafer-sorting test equipment toward more cost-effective design-for-test (DFT) and BIST strategies using multi-probe systems.
  • The systems test stations do not add to the overall footprint because they are housed within the multi-wafer prober.
  • This allows the T5221 platform to use much less floor space than Advantests previous nonvolatile memory tester and a standalone prober.