Discrete group

BorgWarner to integrate STMicroelectronics’ Silicon-Carbide Technology in Viper Power Module for Volvo Cars’ Next-Generation Electric Vehicles

Retrieved on: 
Thursday, August 31, 2023

This power module is used in BorgWarner’s traction inverter platforms for several current and future Volvo Cars electric vehicles.

Key Points: 
  • This power module is used in BorgWarner’s traction inverter platforms for several current and future Volvo Cars electric vehicles.
  • “This collaboration will give Volvo Cars the opportunity to further increase the attractiveness of our electrical vehicles with longer range and faster charging.
  • It will also support us on our journey towards being fully electric by 2030 and strengthen our increased vertical integration and our control of critical components," says Javier Varela, Chief Operating Officer & Deputy CEO, Volvo Cars.
  • The collaboration between the companies provides the high-volume capability that is required by the quickly growing EV market.

ZF signs multi-year supply agreement with STMicroelectronics for silicon carbide devices

Retrieved on: 
Thursday, April 13, 2023

ZF will leverage ST’s vertically integrated silicon carbide manufacturing in Europe and Asia to secure customer orders in electromobility.

Key Points: 
  • ZF will leverage ST’s vertically integrated silicon carbide manufacturing in Europe and Asia to secure customer orders in electromobility.
  • With this agreement, ZF has gained a world-class supplier for silicon carbide technology, in addition to ZF’s existing partnership agreement on silicon carbide technology announced in February.
  • ST will supply ZF from 2025 with a volume of double-digit millions of third generation silicon carbide MOSFET devices.
  • Silicon carbide devices significantly reduce power losses in electric car inverters, as well as in wind turbine and photovoltaic inverters.

STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology

Retrieved on: 
Thursday, December 1, 2022

The goal of this cooperation is the adoption by ST of Soitecs SmartSiC technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm.

Key Points: 
  • The goal of this cooperation is the adoption by ST of Soitecs SmartSiC technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm.
  • The goal of the technology cooperation with Soitec is to continue to improve our manufacturing yields and quality.
  • The combination of Soitecs SmartSiC substrates with STMicroelectronics industry-leading silicon carbide technology and expertise is a game-changer for automotive chip manufacturing that will set new standards.
  • SmartSiC is a proprietary Soitec technology which uses Soitec proprietary SmartCut technology, to split a thin layer of a high quality SiC donor wafer,and bond it on top of a low resistivity handle polySiC wafer.

STMicroelectronics Powers e-Mobility with New Microcontrollers for Software-Defined Electric Vehicles

Retrieved on: 
Monday, February 21, 2022

Geneva, Switzerland, February 21, 2022 STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled new automotive microcontrollers (MCUs) optimized for electric vehicles and centralized (domain and zonal) electronic architectures.

Key Points: 
  • Geneva, Switzerland, February 21, 2022 STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled new automotive microcontrollers (MCUs) optimized for electric vehicles and centralized (domain and zonal) electronic architectures.
  • STs Stellar E MCUs , designed for the next generation of software-defined EVs, integrate high-speed control-loop processing on-chip.
  • The new MCUs extend STs Arm-based Stellar family and are designed from the ground up with the car as a platform in mind.
  • For EVs, software upgradability and hardware integration are especially crucial to boost the vehicles power efficiency for extra driving range.

STMicroelectronics Introduces First PowerGaN Products for More Energy-Efficient, Slimmer Power Supplies

Retrieved on: 
Wednesday, December 15, 2021

Target applications include consumer equipment such as chargers, external power adapters for PCs, LED-lighting drivers, and power supplies inside televisions and home appliances.

Key Points: 
  • Target applications include consumer equipment such as chargers, external power adapters for PCs, LED-lighting drivers, and power supplies inside televisions and home appliances.
  • In higher-power applications, STs PowerGaN devices also benefit telecom power supplies, industrial motor drives, solar inverters, and electric vehicles and chargers.
  • Commercializing GaN-based products is the next frontier for power semiconductors, and we are ready to realize the potential of this exciting technology.
  • We are committed to progressively building up our PowerGaN portfolio to enable customers to design more efficient, smaller power supplies everywhere.

STMicroelectronics Drives the Future of EVs and Industrial Applications with New Silicon-Carbide Devices

Retrieved on: 
Thursday, December 9, 2021

The effort continues to drive the transformation of the EV and industrial markets.

Key Points: 
  • The effort continues to drive the transformation of the EV and industrial markets.
  • STs new SiC devices are specifically optimized for these high-end automotive applications including EV traction inverters, on-board chargers, and DC/DC converters, as well as e-climate compressors.
  • The new generation also suits industrial applications by boosting the efficiency of motor drives, renewable-energy converters and storage systems, as well as telecom and data-center power supplies.
  • We are investing relentlessly to support our automotive and industrial programs expected to generate $1 billion in SiC revenue in 2024.

A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on Silicon Carbide R&D for the EV Market and Industrial Applications

Retrieved on: 
Thursday, November 25, 2021

Under this research collaboration, A*STARs IME and STMicroelectronics aim to develop and optimize SiC integrated devices and package modules to offer significantly better performance in next-generation power electronics.

Key Points: 
  • Under this research collaboration, A*STARs IME and STMicroelectronics aim to develop and optimize SiC integrated devices and package modules to offer significantly better performance in next-generation power electronics.
  • We are pleased to collaborate with STMicroelectronics to develop breakthrough technologies that meet the needs of the growing electric vehicles market.
  • This new collaboration with IME encourages the growth of a silicon carbide ecosystem in Singapore, as we ramp up our manufacturing activities there in addition to Catania (Italy).
  • The Institute of Microelectronics (IME) is a research institute of the Agency for Science, Technology and Research (A*STAR).

STMicroelectronics Upgrades Automotive Positioning Accuracy with Single-Chip Triple-Band Satellite-Navigation Receiver

Retrieved on: 
Tuesday, November 16, 2021

Joining STs Teseo V family, the STA8135GA is the first automotive-qualified GNSS (Global Navigation Satellite System) receiver to integrate a triple-band positioning measurement engine on-chip, in addition to standard multi-band Position-Velocity-Time (PVT) and dead-reckoning.

Key Points: 
  • Joining STs Teseo V family, the STA8135GA is the first automotive-qualified GNSS (Global Navigation Satellite System) receiver to integrate a triple-band positioning measurement engine on-chip, in addition to standard multi-band Position-Velocity-Time (PVT) and dead-reckoning.
  • Triple band has historically been used in professional applications such as surveying, mapping, and precision agriculture that demand millimeter accuracy with minimal reliance on correction data.
  • Bringing this capability to the automotive market in a compact and convenient package, the STA8135GA helps driver-assistance systems make accurate decisions about the road ahead.
  • The multi-constellation receiver delivers raw information for the host system to run any precise-positioning algorithm, such as PPP/RTK (Precise Point Positioning / Real-Time Kinematic).

The University of Catania and STMicroelectronics Sign Agreement to Collaborate on Power Electronics Training and Research

Retrieved on: 
Thursday, November 4, 2021

Catania, Italy, November 4, 2021 The University of Catania (Italy) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the signing of a framework agreement on education and research activities in power electronics.

Key Points: 
  • Catania, Italy, November 4, 2021 The University of Catania (Italy) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the signing of a framework agreement on education and research activities in power electronics.
  • The collaboration aims to foster academic and professional training of students and nurture research for technological innovation.
  • Moreover, it will also look at reliability analysis and advanced modelling of power modules, and manufacturing-process simulation and characterization.
  • Focusing on innovative research in Power Electronics, this agreement extends the long-term, successful collaboration between ST and the University of Catania while building opportunities for our students in valuable technological disciplines and sharing results with ST, said Francesco Priolo, Rector of University of Catania.