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Nexa3D Unveils New Ultrafast Desktop Post-Processing and Three New Resin Materials

Retrieved on: 
Thursday, November 9, 2023

Nexa3D , the ultrafast 3D printing leader, announced today at Formnext, the introduction of a groundbreaking desktop cure system that reduces post-processing time by as much as 80%, bringing ultrafast post-processing to the desktop.

Key Points: 
  • Nexa3D , the ultrafast 3D printing leader, announced today at Formnext, the introduction of a groundbreaking desktop cure system that reduces post-processing time by as much as 80%, bringing ultrafast post-processing to the desktop.
  • View the full release here: https://www.businesswire.com/news/home/20231108499208/en/
    xCURE Desktop curing system reduces resin post processing by as much as 80%.
  • xPRO9400-FR, produced in partnership with BASF ForwardAM, sets a new standard in flame retardant 3D printing materials.
  • Nexa3D is dedicated to pushing the boundaries of 3D printing technology, and these new products are a testament to our commitment to innovation, quality, and versatility for ultrafast, high-throughput 3D printing.

Samyang Corporation Develops Korea's first eco-friendly polycarbonate with 90% recycled plastic content

Retrieved on: 
Wednesday, January 11, 2023

SEOUL, South Korea, Jan. 11, 2023 /PRNewswire/ -- Samyang Corporation has developed eco-friendly materials using recycled plastic resources, demonstrating a commitment to ESG management.

Key Points: 
  • - Application to small home appliances like laptops, and multiple plastic resins to continuously expand the scope of application
    SEOUL, South Korea, Jan. 11, 2023 /PRNewswire/ -- Samyang Corporation has developed eco-friendly materials using recycled plastic resources, demonstrating a commitment to ESG management.
  • Samyang Corporation (CEO Hosung Kang), a chemical and food affiliate of the Samyang Group, announced on 11 that it developed Korea's first eco-friendly PC containing more than 90% of Post-Consumer Recycled Polycarbonate (PCR PC).
  • Securing suppliers of quality recycled PC material that closely monitor the degree of contamination and foreign substances was also effective.
  • Also, in last August, Samyang Corporation signed a contract to supply plastic pellets made from recycled fishing nets, further expanding its eco-friendly business portfolio.

Carbon Unveils New Flame-Retardant Resin as Part of Its Idea-to-Production Platform

Retrieved on: 
Wednesday, February 16, 2022

This follows the recent announcement of the M3 Series printers and the general availability of the Carbon Design Engine as the company further enhances its idea-to-production platform.

Key Points: 
  • This follows the recent announcement of the M3 Series printers and the general availability of the Carbon Design Engine as the company further enhances its idea-to-production platform.
  • EPX 86FR is a photopolymer resin that offers an unmatched combination of flame retardance, functional toughness, high strength, and long-term stability.
  • "We turned to Carbon's platform and extensive material lineup, including EPX 86FR, to mitigate these challenges.
  • Carbon is a 3D printing technology company helping businesses to develop better products and bring them to market in less time.

Showa Denko Materials to Launch the Mass Production of “MCL-E-795G,” an Ultra-Low CTE Core Material for Next-Generation FC-BGA Package Substrate

Retrieved on: 
Thursday, October 28, 2021

Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama; hereinafter Showa Denko Materials) announces the mass production of the MCL-E-795G series, an advanced functional laminate material for printed wiring boards, starting in October 2021.

Key Points: 
  • Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama; hereinafter Showa Denko Materials) announces the mass production of the MCL-E-795G series, an advanced functional laminate material for printed wiring boards, starting in October 2021.
  • Achieving higher density requires enhanced packaging reliability of printed wiring boards for semiconductor packages as well as reduced substrate warpage caused by the thermal expansion difference between semiconductor chips and substrate materials in packaging process.
  • In particular, the type LH combining low CTE glass cloth can reduce warpage by additional 20 percent.
  • The strength of Showa Denko Materials laminate materials for printed wiring boards lies in their excellent packaging reliability, including warpage properties and flatness, with their semiconductor package substrate applications holding the worlds top share in value terms*8 (FY2020).