I2S

Quectel unveils its HCM511S high performance MCU Bluetooth module to power Low Energy compact connected devices

Retrieved on: 
Tuesday, April 9, 2024
Hardware, IOT (Internet of Things), Building Systems, Semiconductor, Security, Construction & Property, Consumer Electronics, Technology, Audio, Video, Apps, Applications, Wearables, Mobile Technology, Telecommunications, Software, Networks, Mobile, Wireless, Cortex, Blood pressure, Temperature, PC, USART, Sport, Internet of things, SPI, Bluetooth Special Interest Group, Embedded, Secure, ARM, Bluetooth mesh networking, LCC, Engineering, PWM, RAM, VEX, Thermometer, I2S, CSO, Multimedia, ADC, Lethargy, Bluetooth

Embedded World – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of the HCM511S high-performance MCU Bluetooth module for compact connected devices such as digital keys, portable devices and battery-operated motion sensors.

Key Points: 
  • Embedded World – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of the HCM511S high-performance MCU Bluetooth module for compact connected devices such as digital keys, portable devices and battery-operated motion sensors.
  • Utilizing Bluetooth Low Energy 5.4, the module accommodates an ARM Cortex-M33 processor and features built-in 32KB RAM and either 352KB or 512KB flash memory to deliver efficient performance.
  • View the full release here: https://www.businesswire.com/news/home/20240409992885/en/
    Quectel unveils its HCM511S high performance MCU Bluetooth module to power Low Energy compact connected devices (Graphic: Business Wire)
    The HCM511S module features excellent receiver sensitivity, a maximum transmit power of +6 dBm to achieve long distance transmission and has been designed to enable compact, low-power devices to connect cost effectively.
  • “We’re delighted to bring the compact, high-performance HCM511S Bluetooth Low Energy MCU module to the market,” says Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules to Increase Developer Options and Help Accelerate Digital Transformation

Retrieved on: 
Monday, February 26, 2024
Telecommunications, Networks, Consumer Electronics, Technology, Apps, Applications, IOT (Internet of Things), Mobile, Wireless, Security, Cortex, UART, I2S, Bluetooth, BLE, SRAM, Multimedia, LCC, Temperature, ARM, Internet of things, MWC, SPI, Codec, Communication, Bluetooth Low Energy, ADC, Sport, VEX, Certification, Bluetooth mesh networking, LAN, CSO, SMT, SWD, IEEE, PWM, IEEE 802.11n-2009, Data-rate units, Mobile phone

View the full release here: https://www.businesswire.com/news/home/20240226444518/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20240226444518/en/
    Quectel unveils four new high performance Wi-Fi and Bluetooth modules to increase developer options and help accelerate digital transformation (Photo: Business Wire)
    “Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • Quectel has also launched the Quectel HCM010S , high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies.
  • Quectel provides a comprehensive range of embedded and external antennas, offering end-to-end support from design to certification and post-deployment.
  • Quectel’s integrated approach with antennas, modules, and certifications significantly reduces cost and accelerates time-to-market, streamlining the journey from concept to mass market.

FDA purchases digiM I2S software for the assessment of product quality attributes

Retrieved on: 
Wednesday, January 24, 2024
Plasma protein binding, Research, Business analyst, Data management, Partnership, Science, I2S, Food and Drug Administration, AI, Division, Food, FDA, Therapy, Medical device

WOBURN, Mass., Jan. 24, 2024 /PRNewswire/ -- The U.S. Food and Drug Administration has placed a purchase order (75F40123P00369) committing to an annual subscription of digiM I2S, a fully integrated image processing platform based on digiM's proprietary cloud technology. I2S, short for Image to Simulation, is an end-to-end software combining data management, artificial intelligence image processing, structural analytics, and image-based simulation. FDA officers in the Division of Product Quality and Research (DPQR) will use the platform to assess the impact of material properties and process parameters on product quality attributes. The subscription will cover the period from September 2023-2024, including an optional four years extending to September 2028. The purchase includes support for a local installation of the cloud platform on the FDA DPQR's in-house cluster.

Key Points: 
  • I2S, short for Image to Simulation, is an end-to-end software combining data management, artificial intelligence image processing, structural analytics, and image-based simulation.
  • FDA officers in the Division of Product Quality and Research (DPQR) will use the platform to assess the impact of material properties and process parameters on product quality attributes.
  • The purchase includes support for a local installation of the cloud platform on the FDA DPQR's in-house cluster.
  • The purchase of I2S reflects the agency's continued efforts in exploring new technologies to better the assessment of drug products.

FDA purchases digiM I2S software for the assessment of product quality attributes

Retrieved on: 
Wednesday, January 24, 2024
Plasma protein binding, Research, Business analyst, Data management, Partnership, Science, I2S, Food and Drug Administration, AI, Division, Food, FDA, Therapy, Medical device

WOBURN, Mass., Jan. 24, 2024 /PRNewswire/ -- The U.S. Food and Drug Administration has placed a purchase order (75F40123P00369) committing to an annual subscription of digiM I2S, a fully integrated image processing platform based on digiM's proprietary cloud technology. I2S, short for Image to Simulation, is an end-to-end software combining data management, artificial intelligence image processing, structural analytics, and image-based simulation. FDA officers in the Division of Product Quality and Research (DPQR) will use the platform to assess the impact of material properties and process parameters on product quality attributes. The subscription will cover the period from September 2023-2024, including an optional four years extending to September 2028. The purchase includes support for a local installation of the cloud platform on the FDA DPQR's in-house cluster.

Key Points: 
  • I2S, short for Image to Simulation, is an end-to-end software combining data management, artificial intelligence image processing, structural analytics, and image-based simulation.
  • FDA officers in the Division of Product Quality and Research (DPQR) will use the platform to assess the impact of material properties and process parameters on product quality attributes.
  • The purchase includes support for a local installation of the cloud platform on the FDA DPQR's in-house cluster.
  • The purchase of I2S reflects the agency's continued efforts in exploring new technologies to better the assessment of drug products.

Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F

Retrieved on: 
Monday, January 8, 2024
ECC, Digital, ISA, Artificial neural network, AHB, DSP, SPI, Andes Technology, AI, Human, AXI, Socs, CPU, PLIC, Noise, NPU, ACE, I2S, Acceleration, Algorithm, UART, Video game

Andes Technology's D25F processor, based on the AndeStar™ V5 architecture, is a 32-bit RISC-V CPU IP core equipped with P-extension (DSP/SIMD extension, draft version).

Key Points: 
  • Andes Technology's D25F processor, based on the AndeStar™ V5 architecture, is a 32-bit RISC-V CPU IP core equipped with P-extension (DSP/SIMD extension, draft version).
  • The SPV60 series of on-device AI audio processors integrate the Andes D25F core and Spacetouch’s newly developed uDSP and AI NPU (Neural Network Processor).
  • "The combination of the D25F RISC-V processor and Spacetouch’s heterogeneous multi-core AI audio processor IC brings more innovation and possibilities to the fields of audio processing, embedded systems and mobile devices.
  • "We are very excited that Spacetouch launched this new generation edge-side AI audio processor chips in collaboration with Andes.

Quectel Announces SC696S LTE Cat 4 Smart Module Series Targeting Applications Requiring High Data Rates and Rich Multimedia Functions

Retrieved on: 
Thursday, July 27, 2023
Apps, Applications, Technology, Mobile, Wireless, Security, Software, Networks, Internet, IOT (Internet of Things), Consumer Electronics, SPI, Business development, Communication, Wi-Fi, Qualcomm, GNSS, CSO, Internet of things, Original equipment manufacturer, USB, POS, Socs, I2S, Multimedia, Temperature, SOC, Sale, MIMO, UART, Linux, Qualcomm Atheros, Bluetooth, LCM, LTE, GPU, Mobile phone, Video game

Quectel Wireless Solutions, a global IoT solutions provider, has launched the SC696S series of multi-mode smart LTE modules equipped with Wi-Fi and Bluetooth capabilities.

Key Points: 
  • Quectel Wireless Solutions, a global IoT solutions provider, has launched the SC696S series of multi-mode smart LTE modules equipped with Wi-Fi and Bluetooth capabilities.
  • View the full release here: https://www.businesswire.com/news/home/20230727183224/en/
    Quectel Announces SC696S LTE Cat 4 smart module series targeting applications requiring high data rates and rich multimedia functions (Photo: Business Wire)
    In addition, the adoption of MIMO technology enables the concurrent use of multiple antennas at the receiver end on the same frequency which minimizes bit error rate and optimizes data speed, improving communication quality.
  • “We’re delighted to launch the Quectel SC696S series of multi-mode modules which offer outstanding performance for a wide range of applications that demand high quality communication,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.
  • “The modules are ideal for a wide variety of industrial and consumer applications that require high data rates and rich multimedia functions.

Quectel Unveils Next Generation SG885G-WF Android Smart Module Ideal for High-Performance Industrial and Consumer IoT Applications

Retrieved on: 
Monday, July 24, 2023
Software, Mobile, Wireless, Internet, Hardware, Consumer Electronics, IOT (Internet of Things), Apps, Applications, Technology, Audio, Video, Wearables, Mobile Technology, Other Technology, Telecommunications, SPI, Business development, M2M, Qualcomm, IEEE 802.11be, SWR, CSO, Internet of things, USB, Bluetooth, PCI Express, Android, I2S, Multimedia, SOC, Temperature, MIMO, UART, LED, LCM, AI, Safety, AR, Mobile phone

Quectel Wireless Solutions, a global IoT solutions provider, today launches its new generation flagship Android smart module, the SG885G-WF.

Key Points: 
  • Quectel Wireless Solutions, a global IoT solutions provider, today launches its new generation flagship Android smart module, the SG885G-WF.
  • With high performance and rich media functions, the smart module is ideal for industrial and consumer applications that require high processing power and multimedia functions.
  • View the full release here: https://www.businesswire.com/news/home/20230724716405/en/
    Quectel unveils next generation SG885G-WF Android smart module ideal for high-performance industrial and consumer IoT applications.
  • “We’re proud to launch our new flagship Android smart module with the new generation Quectel SG885G-WF,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

Quectel Launches Ultra-Compact FCM360W Wi-Fi 6 and Bluetooth 5.1 Module Ideal for Smart Homes and Industrial IoT Use Cases

Retrieved on: 
Tuesday, June 6, 2023
IOT (Internet of Things), Building Systems, Mobile, Wireless, Technology, Construction & Property, Industrial internet of things, SPI, LCC, Wi-Fi 6, CSO, Internet of things, Original equipment manufacturer, I2S, Multimedia, Temperature, PWM, UART, Bluetooth, SRAM, PCB, ADC, AES, SSL, Memory, RF, Computer data storage, Mobile phone

Quectel Wireless Solutions, a global IoT solutions provider, has launched its latest Quectel FCM360W Wi-Fi and Bluetooth module, combining a high-performance processor with Wi-Fi 6 and Bluetooth 5.1 capabilities.

Key Points: 
  • Quectel Wireless Solutions, a global IoT solutions provider, has launched its latest Quectel FCM360W Wi-Fi and Bluetooth module, combining a high-performance processor with Wi-Fi 6 and Bluetooth 5.1 capabilities.
  • View the full release here: https://www.businesswire.com/news/home/20230606005273/en/
    Quectel launches ultra-compact FCM360W Wi-Fi 6 and Bluetooth 5.1 module ideal for smart homes and industrial IoT use cases (Photo: Business Wire)
    The module features standard security features such as WPA-PSK, WPA2-PSK and WPA3-PSK security standards and provides 128-bit AES encryption for added security.
  • The FCM360W supports multiple interfaces including UART, SPI, I2C, I2S, ADC and PWM alongside many low power consumption modes and keep-alive mechanisms, making it ideal for smart homes and industrial IoT (IIoT) use cases.
  • “We’re proud to launch the Quectel FCM360W to help enable a wide range of smart home and industrial IoT devices,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

S2C Accelerates Development Timeline of Bluetooth LE Audio SoC

Retrieved on: 
Thursday, June 1, 2023
Stability testing, Bluetooth Low Energy, Communication, SPI, Neuralink, Interface, BLE, Internet of things, I2S, ACTT, IP, History, Bluetooth Special Interest Group, Internet, RF, UART, SAN, Socs, SDK, Brain–computer interface, Silicon, ACCT, JTAG, FPGA, Software, Video game, Cryptocurrency, S2C, SOC, Bluetooth

The Bluetooth protocol was originally introduced by the Bluetooth Special Interest Group ("Bluetooth SIG") in 1998, followed by Bluetooth Low Energy (BLE) in 2009, and most recently the Bluetooth Low Energy Audio ("BLE Audio") specification was released in 2022.

Key Points: 
  • The Bluetooth protocol was originally introduced by the Bluetooth Special Interest Group ("Bluetooth SIG") in 1998, followed by Bluetooth Low Energy (BLE) in 2009, and most recently the Bluetooth Low Energy Audio ("BLE Audio") specification was released in 2022.
  • BLE Audio focuses on higher power efficiency than the classic version of Bluetooth, provides for higher audio quality than standard Bluetooth, and introduces new features – and was the largest specification development project in the history of the Bluetooth SIG.
  • By working closely with its customer-partners, S2C fosters a thriving collaborative working environment that encourages the timely exchange of ideas, resources, and SoC development expertise.
  • With a shared vision of success, S2C and its customer-partners strive to achieve successful SoC development outcomes like ACCT's, that delivers compelling value to our customer-partners.

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System at MWC Barcelona 2023

Retrieved on: 
Wednesday, March 1, 2023
UART, UIM, OpenWrt, Industrial internet of things, M.2, MiFi, Qualcomm, MWC, High-pass filter, CPE, MLO, LGA, CPU, USB 3.1, IEEE 802.11be, Internet, USB, FWA, NR, A55, SVP Worldwide, PCI Express, SVP, 3GPP, Industrial, X75, Communication, Wi-Fi, I2S, Mobile phone, Renewable energy, Ethernet, Internet of things

BARCELONA, Spain, March 1, 2023 /PRNewswire/ -- Fibocom Wireless Inc.,(300638.SZ) a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, to announce the launch of the leading-edge 5G Sub-6GHz and mmWave module Fx190(W)/Fx180(W) series at MWC Barcelona 2023. Adopting multiple innovations from the world's first 5G Advanced-ready modem-RF system, Snapdragon X75 and X72, the modules are set to bring outstanding cellular performance to mass data transmission applications such as mobile broadband, FWA, enterprise 5G, and IIoT.

Key Points: 
  • During MWC Barcelona 2023, Fibocom to unveil the 5G Sub-6GHz and mmWave module Fx190/Fx180 series based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AI innovations in architecture design, significantly improves 5G cellular capabilities and spectrum utilization.
  • Equipped with Qualcomm® 5G AI Processor Gen 2, Snapdragon X75 is the world's first modem-RF system with a dedicated AI tensor accelerator.
  • It is worth noting that FM190/FM180 series are M.2 standard and pin compatible with Fibocom FM170/FM160/FM150 5G module series.
  • "We are proud of cooperating with Qualcomm Technologies, the most valuable partner of Fibocom to launch the leading-edge 5G Sub-6GHz and mmWave module series Fx190(W)/Fx180(W) based on Snapdragon X75 and X72 at MWC Barcelona 2023," said Dan Schieler, SVP of IoT Overseas Sales Department, Fibocom.